CN106973544A - Electronic system - Google Patents
Electronic system Download PDFInfo
- Publication number
- CN106973544A CN106973544A CN201610284514.3A CN201610284514A CN106973544A CN 106973544 A CN106973544 A CN 106973544A CN 201610284514 A CN201610284514 A CN 201610284514A CN 106973544 A CN106973544 A CN 106973544A
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- Prior art keywords
- liquid
- connector
- cooling system
- cooled module
- module
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of electronic system, a radiating seat and an electronic installation are included.Radiating seat includes a pedestal, one first liquid cooling system and at least one first connector.First liquid cooling system and the first connector are arranged in pedestal.First connector is connected to the first liquid cooling system and exposed from pedestal.Electronic installation includes a housing, a liquid cooled module and at least one second connector.Liquid cooled module and the second connector are arranged in housing.Second connector is connected to liquid cooled module and exposed from housing.When the first connector and the second connector are connected with each other, the first liquid cooling system is with liquid cooled module via the first connector and the second connector one liquid SAPMAC method path of formation.
Description
Technical field
The present invention is on a kind of electronic system, espespecially a kind of electricity radiated using radiating seat to electronic installation
Subsystem.
Background technology
The development of heat abstractor and electronic installation is closely bound up.Because electronic installation is in running, in circuit
Electric current can produce unnecessary heat energy because of the influence of impedance, if these heat energy can not effectively be excluded and tired out
Product is on the electronic component inside electronic installation, and electronic component is just possible to damage because of continuous elevated temperature
It is bad.Therefore, the running of the good and bad influence electronic installation of heat abstractor is very huge.
At present, the most frequently used heat abstractor of electronic installation is by the way that the end thereof contacts of heat pipe can be produced to the electricity of heat
Subcomponent, other end connection fin, and fin is radiated with radiator fan.However, radiation air
Fan disturbs people's noise and high power consumption produced by under high rotating speed, and often manufacturer is difficult to what is overcome
Problem.Therefore, liquid cooling system just in response to and give birth to.
In general, liquid cooling system mainly connects liquid cold head, radiator and pumping institute structure by multiple pipelines
Into.Liquid cooling system is that coolant is squeezed into liquid cold head by pumping, cooled down when being radiated to electronic component
Liquid absorbs the heat produced by electronic component, then coolant is cooled down by radiator.Due to electronic installation
The increasingly lifting of efficiency, electronic installation heat produced when operating is also more and more more so that electronic installation is built-in
Heat abstractor or liquid cooling system gradually apply use.Therefore, the radiating effect to electronic installation how is promoted
Rate, becomes as the big problem in design.
The content of the invention
The present invention provides a kind of electronic system radiated using radiating seat to electronic installation, above-mentioned to solve
The problem of.
According to an embodiment, electronic system of the invention includes a radiating seat and an electronic installation.Radiating seat
Include a pedestal, one first liquid cooling system and at least one first connector.First liquid cooling system and first connects
Fitting is arranged in pedestal.First connector is connected to the first liquid cooling system and exposed from pedestal.Electronic installation
Include a housing, a liquid cooled module and at least one second connector.Liquid cooled module and the second connector are set
In housing.Second connector is connected to liquid cooled module and exposed from housing.When the first connector and second connects
When fitting is connected with each other, the first liquid cooling system is formed with liquid cooled module via the first connector with the second connector
One liquid SAPMAC method path.
According to another embodiment, electronic system of the invention includes a radiating seat and an electronic installation.Radiating
Seat includes a pedestal and one first liquid cooling system.First liquid cooling system is arranged in pedestal and comprising one first
Liquid cooled module.First liquid cooled module is exposed from pedestal.Electronic installation includes a housing and the cold system of one second liquid
System.Second liquid cooling system is arranged in housing and comprising one second liquid cooled module.Second liquid cooled module is from housing
It is exposed.When electronic installation is arranged on radiating seat, the first liquid cooled module contacts with each other with the second liquid cooled module.
In summary, in an embodiment, radiating seat has can be connected with each other first respectively with electronic installation
Connector and the second connector, wherein the first connector is connected to the first liquid cooling system in radiating seat, and
Two connectors are connected to the liquid cooled module in electronic installation.When electronic installation is because long-time is used and radiates
During not enough the problem of, the first connector and the second connector can be connected with each other by user so that the first liquid is cold
System is with liquid cooled module via the first connector and the second connector formation liquid SAPMAC method path.Now, radiate
First liquid cooling system of seat can carry out auxiliary heat dissipation to electronic installation.In another embodiment, radiating seat can
With the first liquid cooling system, and electronic installation can have the second liquid cooling system.When the second liquid cooling system can not be by
When heat produced by electronic installation is excluded in time, electronic installation can be arranged on radiating seat by user, make the
One liquid cooled module contacts with each other with the second liquid cooled module.Now, the heat produced by electronic installation be can be via the
Two liquid cooled modules are conducted to the first liquid cooled module, and then carry out aiding in dissipating using the first liquid cooling system of radiating seat
Heat.
It can be obtained on the advantages and spirit of the present invention by following detailed description of the invention and institute's accompanying drawings into one
The understanding of step.
Brief description of the drawings
Fig. 1 is the schematic diagram of the electronic system according to one embodiment of the invention.
Fig. 2 be Fig. 1 in electronic system explosive view.
Fig. 3 be Fig. 1 in radiating seat explosive view.
Fig. 4 be Fig. 1 in electronic installation explosive view.
Fig. 5 is the explosive view of the electronic installation according to another embodiment of the present invention.
Fig. 6 is the schematic diagram of the electronic system according to another embodiment of the present invention.
Fig. 7 be Fig. 6 in electronic system explosive view.
Fig. 8 be Fig. 6 in radiating seat explosive view.
Fig. 9 is the radiating seat in Fig. 6 in the explosive view at another visual angle.
Figure 10 be Fig. 6 in electronic installation explosive view.
Figure 11 is the schematic diagram of the electronic system according to another embodiment of the present invention.
Figure 12 be Figure 11 in electronic system explosive view.
Figure 13 is the electronic system in Figure 11 in the explosive view at another visual angle.
Figure 14 be Figure 11 in radiating seat explosive view.
Figure 15 be Figure 11 in electronic installation explosive view.
Wherein, reference：
1st, 3,5 electronic system
10th, 30,50 radiating seat
12nd, the electronic installation of 12', 32,52
100th, 300,500 pedestal
102nd, 302,502 first liquid cooling system
The connector of 104a, 104b first
120th, 320,520 housing
122 liquid cooled modules
The connector of 124a, 124b second
126th, 322,522 second liquid cooling system
128 radiating modules
304th, 504 first liquid cooled module
306 support frames
308 elastic components
324th, 524 second liquid cooled module
1020th, 1260,3020,3220,5020,5220 pumping
1022nd, 1262,3022,3222,5022,5222 radiator
1024th, 1264,1286,3024,3224,5024,5224 fan
1026th, 1266,3026,3226,5026,5226 pipeline
1280 heat-conducting plates
1282 heat pipes
1284 radiating fin combinations
3060 limiting sections
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as to the present invention's
Limit.
Fig. 1 to Fig. 4 is referred to, Fig. 1 is the schematic diagram of the electronic system 1 according to one embodiment of the invention,
Fig. 2 be Fig. 1 in electronic system 1 explosive view, Fig. 3 be Fig. 1 in radiating seat 10 explosive view,
Fig. 4 be Fig. 1 in electronic installation 12 explosive view.As shown in Figures 1 and 2, electronic system 1 is included
One radiating seat 10 and an electronic installation 12.In practical application, electronic installation 12 can be an integral type
(All-in-One, AIO) computer, a notebook computer, a projector or a light supply apparatus.
As shown in Figure 2 and Figure 3, radiating seat 10 comprising a pedestal 100, one first liquid cooling system 102 with
And at least one first connector.In the present embodiment, radiating seat 10 has the first connector 104a and 104b,
Only the present invention is not limited thereto.First liquid cooling system 102 is arranged at the first connector 104a and 104b
In pedestal 100.First connector 104a, 104b is connected to the first liquid cooling system 102 and from pedestal 100
It is exposed.In this embodiment, the first liquid cooling system 102 can include a pumping 1020, a radiator 1022
And a fan 1024, wherein the first connector 104a, 104b, pumping 1020 are passed through with radiator 1022
It is connected with each other by pipeline 1026, and fan 1024 is arranged at the side of radiator 1022.
As shown in Fig. 2 and Fig. 4, electronic installation 12 comprising a housing 120, a liquid cooled module 122 and
At least one second connector.In the present embodiment, electronic installation 12 has the second connector 124a and 124b,
Only the present invention is not limited thereto.In practical application, liquid cooled module 122 can for temperature-uniforming plate, liquid cold head or
Other cavitys for accommodating coolant.Liquid cooled module 122 and second connector 124a, 124b are arranged at 120
In housing.Second connector 124a, 124b is connected to liquid cooled module 122 and exposed from housing 120.In
In this embodiment, electronic installation 12 additionally comprises one second liquid cooling system 126.Second liquid cooling system 126 can
Comprising a pumping 1260, at least an at least radiator 1262, a fan 1264 and liquid cooled module 122,
Wherein liquid cooled module 122, the second connector 124a, 124b, pumping 1260 and radiator 1262 are via pipe
Road 1266 is connected with each other, and fan 1264 is arranged at the side of radiator 1262.
In this embodiment, one of the first connector 104a and the second connector 124a can be public fast for one
Joint, and the first connector 104a and the second connector 124a are wherein another for a female fast joint.Change speech
It, the first connector 104a and the second connector 124a can be designed as the public fast access cooperated by the present invention
Head and female fast joint so that the first connector 104a and the second connector 124a can quickly with it is advantageously mutual
Connection is separated.In practical application, the first liquid cooling system 102, the cold system of the liquid of liquid cooled module 122 and second
Coolant (for example, water or other liquid) is accommodated in system 126, therefore, in certain embodiments, is used
Come realize the first connector 104a and the second connector 124a fast joint can have connect soon or Quick Release knot
Structure, and cooling is prevented in engagement or dismounting with the first connector 104a and the second connector 124a
The structure that liquid leaks.In other embodiment, the first connector 104a and the second connector 124a
It can be designed in the way of screwing togather.It should be noted that, the first connector 104b and the second connector 124b
Structure design be approximately identical to the first connector 104a and the second connector 124a structure design, herein
Repeat no more.
In general, the liquid cooled module 122 of electronic installation 12 is attached at the electronics member inside electronic installation 12
In part (not shown), to absorb heat produced during electronic component running.When electronic installation 12 is not yet set
It is placed on radiating seat 10, that is, first connector 104a, 104b and second connector 124a, 124b
When being not yet connected with each other, electronic installation 12 is dissipated by the second liquid cooling system 126 to liquid cooled module 122
Heat.
When electronic installation 12 because long-time use and occur the second liquid cooling system 126 radiate deficiency the problem of when,
Electronic installation 12 can be arranged on radiating seat 10 by user, and by first connector 104a, 104b with
Second connector 124a, 124b is connected with each other so that the first liquid cooling system 102 and electronics of radiating seat 10
The liquid cooled module 122 of device 12 is via first connector 104a, 104b and second connector 124a, 124b
Form liquid SAPMAC method path.Now, the first liquid cooling system 102 of radiating seat 10 can be to electronic installation 12
Liquid cooled module 122 carry out auxiliary heat dissipation, to promote the radiating efficiency to electronic installation 12.It is being not required to make
When being radiated with radiating seat 10 to electronic installation 12, as long as user is by first connector 104a, 104b
Separated with second connector 124a, 124b.Because first connector 104a, 104b is connected with second
Part 124a, 124b have the structure for preventing that coolant from leaking, therefore, as first connector 104a, 104b
When being separated from each other with second connector 124a, 124b, first connector 104a, 104b and the second connector
124a, 124b can prevent the liquid SAPMAC method path that the first liquid cooling system 102 is formed with liquid cooled module 122
In coolant leak.
In this embodiment, when first connector 104a, 104b and second connector 124a, 124b are mutual
During separation, electronic installation 12 carries out liquid-cooling heat radiation by the second liquid cooling system 126 to liquid cooled module 122.
However, when first connector 104a, 104b and second connector 124a, 124b is connected with each other, this hair
It is bright to detect first connector 104a, 104b and the second connector by mechanical and/or electronic type design
124a, 124b have been connected with each other, and control the pumping 1020 of the first liquid cooling system 102 to open, and control
The pumping 1260 of second liquid cooling system 126 is closed so that the first liquid cooling system 102 is to liquid cooled module 122
Liquid-cooling heat radiation is carried out, and the second liquid cooling system 126 stops carrying out liquid-cooling heat radiation to liquid cooled module 122.Need
It is bright, when first connector 104a, 104b and second connector 124a, 124b is connected with each other, this
Invention also can control the pumping 1260 of the liquid cooling system 126 of pumping 1020 and second of the first liquid cooling system 102
Open simultaneously so that the first liquid cooling system 102 and the second liquid cooling system 126 are simultaneously to liquid cooled module 122
Carry out liquid-cooling heat radiation.
Referring to Fig. 5, Fig. 5 is the explosive view of the electronic installation 12' according to another embodiment of the present invention.Electricity
Sub-device 12' in place of the main difference of above-mentioned electronic installation 12 with being, electronic installation 12' additionally comprises one
Radiating module 128, and replaced with radiating module 128 the second above-mentioned liquid cooling system 126 pumping 1260,
Radiator 1262 and fan 1264.As shown in figure 5, radiating module 128 is arranged in housing 120, and
Liquid cooled module 122 is arranged on radiating module 128.In this embodiment, radiating module 128 can include one
Heat-conducting plate 1280, at least a heat pipe 1282, at least a radiating fin combination 1284 and an at least fan
1286.Liquid cooled module 122 may be disposed on heat-conducting plate 1280, and two ends of heat pipe 1282 connect heat conduction respectively
Plate 1280 and radiating fin combination 1284, fan 1286 are then arranged at the side of radiating fin combination 1284.
Thereby, the heat that liquid cooled module 122 is absorbed can be conducted to heat radiating fin via heat-conducting plate 1280 and heat pipe 1282
Piece combination 1284, then air-flow is produced by fan 1286 walk the torrid zone.It should be noted that, with Fig. 4 in Fig. 5
Shown in identical label element, its action principle is roughly the same, will not be repeated here.
Fig. 6 to Figure 10 is referred to, Fig. 6 is the signal of the electronic system 3 according to another embodiment of the present invention
Figure, Fig. 7 be Fig. 6 in electronic system 3 explosive view, Fig. 8 be Fig. 6 in radiating seat 30 blast
Figure, Fig. 9 be radiating seat 30 in Fig. 6 in the explosive view at another visual angle, Figure 10 is the electronics dress in Fig. 6
Put 32 explosive view.As shown in Figures 6 and 7, electronic system 3 includes a radiating seat 30 and an electronics
Device 32.In practical application, electronic installation 32 can for an integral type (All-in-One, AIO) computer,
One notebook computer, a projector or a light supply apparatus.
As shown in Figure 7 to 9, radiating seat 30 includes a pedestal 300, one first liquid cooling system 302, one
Support frame 306 and at least an elastic component 308.First liquid cooling system 302, support frame 306 and elastic component
308 are arranged in pedestal 300.First liquid cooling system 302 includes one first liquid cooled module 304.First liquid
Chill block 304 is exposed from pedestal 300.First liquid cooled module 304 is movably arranged at support frame 306
In.Two ends of elastic component 308 are connected to the first liquid cooled module 304 and support frame 306.Support frame 306
With a limiting section 3060, wherein limiting section 3060 limits the first liquid cooled module 304 disengaging support frame 306.
In practical application, first liquid cooled module 304 can be temperature-uniforming plate, liquid cold head or other coolants that accommodate
Cavity, and elastic component 308 can be spring or other elastomers.In this embodiment, the first liquid cooled module
304 can be made of copper, but be not limited.In this embodiment, the first liquid cooling system 302 can be additionally comprised
One pumping 3020, a radiator 3022 and a fan 3024, wherein pumping 3020, radiator 3022
It is connected with each other with the first liquid cooled module 304 via pipeline 3026, and fan 3024 is arranged at radiator 3022
Side.In practical application, cooling is accommodated in the first liquid cooling system 302 and the first liquid cooled module 304
Liquid (for example, water or other liquid).
As shown in Fig. 7 and Figure 10, electronic installation 32 includes a housing 320 and one second liquid cooling system
322.Second liquid cooling system 322 is arranged in housing 320 and comprising one second liquid cooled module 324.Second
Liquid cooled module 324 is exposed from housing 320.In practical application, the second liquid cooled module 324 can for temperature-uniforming plate,
Liquid cold head or other cavitys for accommodating coolant.In this embodiment, the second liquid cooled module 324 can be by copper
It is made, but is not limited.In this embodiment, the second liquid cooling system 322 can additionally comprise a pumping 3220,
An at least radiator 3222 and at least a fan 3224, wherein pumping 3220, radiator 3222 and
Two liquid cooled modules 324 are connected with each other via pipeline 3226, and fan 3224 is arranged at radiator 3222
Side.In practical application, coolant is accommodated in the second liquid cooling system 322 and the second liquid cooled module 324
(for example, water or other liquid).
In general, the second liquid cooled module 324 of electronic installation 32 is attached at the electricity inside electronic installation 32
In subcomponent (not shown), to absorb heat produced during electronic component running.Then, then by second
322 pair of second liquid cooled module 324 of liquid cooling system radiates.When the second liquid cooling system 322 can not be by electronics
When heat produced by the electronic component of device 32 is excluded in time, electronic installation 32 can be arranged at scattered by user
On hot seat 30, make the second liquid cooled module of the first liquid cooled module 304 and electronic installation 32 of radiating seat 30
322 contact with each other.Now, the heat produced by the electronic component of electronic installation 32 is that meeting is cold via the second liquid
Module 322 is conducted to the first liquid cooled module 304 of radiating seat 30, then by the cold system of the first liquid of radiating seat 30
302 pair of first liquid cooled module 304 of system radiates, to promote the radiating efficiency to electronic installation 32.
As shown in figure 9, the first liquid cooled module 304 is held on the limiting section 3060 and elasticity of support frame 306
Between part 308.When electronic installation 32 is arranged on radiating seat 30, the second liquid of electronic installation 32 is cold
Module 322 can push the first liquid cooled module 304 of radiating seat 30.Now, elastic component 308 can be produced
Upward the first liquid cooled module of pushing tow 304 of elastic force, and then ensure the second liquid cooled module 322 of electronic installation 32
Can smooth the first liquid cooled module 304 in radiating seat 30.
Figure 11 to Figure 15 is referred to, Figure 11 shows for the electronic system 5 according to another embodiment of the present invention
It is intended to, Figure 12 is the explosive view of the electronic system 5 in Figure 11, and Figure 13 is the electronic system 5 in Figure 11
Explosive view in another visual angle, Figure 14 is the explosive view of the radiating seat 50 in Figure 11, and Figure 15 is Figure 11
In electronic installation 52 explosive view.As shown in Figure 11 to Figure 13, electronic system 5 includes a radiating seat
50 and an electronic installation 52.In practical application, electronic installation 52 can be notebook computer or other electricity
Sub-device.
As shown in Figure 12 and Figure 14, radiating seat 50 includes a pedestal 500 and one first liquid cooling system 502.
In this embodiment, the first liquid cooling system 502 can comprising one first liquid cooled module 504, a pumping 5020,
One radiator 5022 and a fan 5024, wherein pumping 5020, the liquid chill of radiator 5022 and first
Block 504 is connected with each other via pipeline 5026, and fan 5024 is arranged at the side of radiator 5022.Need
Illustrate, pumping 5020, the structure design of the liquid cooled module 504 of radiator 5022 and first and effect are former
Reason and above-mentioned pumping 3020, the structure design of the liquid cooled module 304 of radiator 3022 and first and effect are former
Reason is roughly the same, will not be repeated here.
As shown in Figure 13 and Figure 15, electronic installation 52 includes a housing 520 and one second liquid cooling system
522.In this embodiment, the second liquid cooling system 522 can include one second liquid cooled module 524, a pumping
5220th, an at least radiator 5222 and at least a fan 5224, wherein pumping 5220, radiator 5222
It is connected with each other with the second liquid cooled module 524 via pipeline 5226, and fan 5224 is arranged at radiator 5222
Side.It should be noted that, pumping 5220, the structure of radiator 5222 and the second liquid cooled module 524 are set
Meter is set with action principle and the structure of above-mentioned pumping 3220, radiator 3222 and the second liquid cooled module 324
Meter is roughly the same with action principle, will not be repeated here.
In general, the second liquid cooled module 524 of electronic installation 52 is attached at the electricity inside electronic installation 52
In subcomponent (not shown), to absorb heat produced during electronic component running.Then, then by second
522 pair of second liquid cooled module 524 of liquid cooling system radiates.When the second liquid cooling system 522 can not be by electronics
When heat produced by the electronic component of device 52 is excluded in time, electronic installation 52 can be arranged at scattered by user
On hot seat 50, make the second liquid cooled module of the first liquid cooled module 504 and electronic installation 52 of radiating seat 50
522 contact with each other.Now, the heat produced by the electronic component of electronic installation 52 is that meeting is cold via the second liquid
Module 522 is conducted to the first liquid cooled module 504 of radiating seat 50, then by the cold system of the first liquid of radiating seat 50
502 pair of first liquid cooled module 504 of system radiates, to promote the radiating efficiency to electronic installation 52.
In summary, in an embodiment, radiating seat has can be connected with each other first respectively with electronic installation
Connector and the second connector, wherein the first connector is connected to the first liquid cooling system in radiating seat, and
Two connectors are connected to the liquid cooled module in electronic installation.When electronic installation is because long-time is used and radiates
During not enough the problem of, the first connector and the second connector can be connected with each other by user so that the first liquid is cold
System is with liquid cooled module via the first connector and the second connector formation liquid SAPMAC method path.Now, radiate
First liquid cooling system of seat can carry out auxiliary heat dissipation to electronic installation.In another embodiment, radiating seat can
With the first liquid cooling system, and electronic installation can have the second liquid cooling system.When the second liquid cooling system can not be by
When heat produced by electronic installation is excluded in time, electronic installation can be arranged on radiating seat by user, make the
One liquid cooled module contacts with each other with the second liquid cooled module.Now, the heat produced by electronic installation be can be via the
Two liquid cooled modules are conducted to the first liquid cooled module, and then carry out aiding in dissipating using the first liquid cooling system of radiating seat
Heat.
It the foregoing is only presently preferred embodiments of the present invention, all equalizations done according to scope of the present invention patent
Change and modification, should all belong to the covering scope of the present invention.
Claims (16)
1. a kind of electronic system, it is characterised in that include：
One radiating seat, comprising a pedestal, one first liquid cooling system and at least one first connector, this first
Liquid cooling system is arranged in the pedestal with first connector, and first connector is connected to the cold system of first liquid
Unite and exposed from the pedestal；And
One electronic installation, includes a housing, a liquid cooled module and at least one second connector, the liquid chill
Block and second connector are arranged in the housing, and second connector is connected to the liquid cooled module and from the shell
External dew；
Wherein, when first connector and second connector are connected with each other, first liquid cooling system is with being somebody's turn to do
Liquid cooled module is via first connector and second connector, one liquid SAPMAC method path of formation.
2. electronic system according to claim 1, it is characterised in that first connector with this
One of two connectors are a public fast access head, and first connector is wherein another with second connector is
One female fast joint.
3. electronic system according to claim 1, it is characterised in that when first connector is with being somebody's turn to do
When second connector is separated from each other, first connector can prevent the liquid SAPMAC method path with second connector
In a coolant leak.
4. electronic system according to claim 1, it is characterised in that first liquid cooling system is included
One pumping, a radiator and a fan.
5. electronic system according to claim 1, it is characterised in that the electronic installation additionally comprises one
Second liquid cooling system, second liquid cooling system be arranged in the housing and comprising a pumping, an at least radiator,
An at least fan and the liquid cooled module.
6. electronic system according to claim 5, it is characterised in that when first connector is with being somebody's turn to do
When second connector is separated from each other, second liquid cooling system carries out liquid-cooling heat radiation to the liquid cooled module；When this
When a connection piece is connected with each other with second connector, it is cold that first liquid cooling system carries out liquid to the liquid cooled module
Radiating, and second liquid cooling system stopping carries out liquid-cooling heat radiation to the liquid cooled module.
7. electronic system according to claim 5, it is characterised in that when first connector is with being somebody's turn to do
When second connector is separated from each other, second liquid cooling system carries out liquid-cooling heat radiation to the liquid cooled module；When this
When a connection piece is connected with each other with second connector, first liquid cooling system and second liquid cooling system are simultaneously
Liquid-cooling heat radiation is carried out to the liquid cooled module.
8. electronic system according to claim 1, it is characterised in that the electronic installation additionally comprises one
Radiating module, the radiating module is arranged in the housing, and the liquid cooled module is arranged on the radiating module.
9. electronic system according to claim 8, it is characterised in that the radiating module is led comprising one
Hot plate, at least a heat pipe, at least a radiating fin combination and at least a fan.
10. electronic system according to claim 1, it is characterised in that the electronic installation is an one
Formula computer, a notebook computer, a projector or a light supply apparatus.
11. a kind of electronic system, it is characterised in that include：
One radiating seat, comprising a pedestal and one first liquid cooling system, first liquid cooling system is arranged at the seat
In body and comprising one first liquid cooled module, first liquid cooled module is exposed from the pedestal；And
One electronic installation, comprising a housing and one second liquid cooling system, second liquid cooling system is arranged at this
In housing and comprising one second liquid cooled module, second liquid cooled module is exposed from the housing；
Wherein, when the electronic installation is arranged on the radiating seat, first liquid cooled module and second liquid are cold
Module contacts with each other.
12. electronic system according to claim 11, it is characterised in that first liquid cooling system is another
Include a pumping, a radiator and a fan.
13. electronic system according to claim 11, it is characterised in that second liquid cooling system is another
Include a pumping, at least a radiator and an at least fan.
14. electronic system according to claim 11, it is characterised in that first liquid cooled module with
Second liquid cooled module is made of copper.
15. electronic system according to claim 11, it is characterised in that the radiating seat additionally comprises one
Support frame and at least an elastic component, the support frame are arranged in the pedestal with an at least elastic component, the branch
Support has a limiting section, and first liquid cooled module is movably arranged in the support frame, an at least bullet
Two ends of property part are connected to first liquid cooled module and the support frame, and it is cold that the limiting section limits first liquid
Module departs from the support frame.
16. electronic system according to claim 11, it is characterised in that the electronic installation is one by one
Body formula computer, a notebook computer, a projector or a light supply apparatus.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662278472P | 2016-01-14 | 2016-01-14 | |
| US62/278,472 | 2016-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106973544A true CN106973544A (en) | 2017-07-21 |
| CN106973544B CN106973544B (en) | 2019-03-15 |
Family
ID=59334850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610284514.3A Active CN106973544B (en) | 2016-01-14 | 2016-04-29 | Electronic system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106973544B (en) |
| TW (1) | TWI615088B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201515582U (en) * | 2009-09-24 | 2010-06-23 | 微星科技股份有限公司 | External radiator and related electronic device thereof |
| CN201557360U (en) * | 2009-11-20 | 2010-08-18 | 英业达股份有限公司 | Cooling fan device and electronic computing system thereof |
| CN104349648A (en) * | 2013-08-09 | 2015-02-11 | 技嘉科技股份有限公司 | Composite type heat radiating assembly |
| CN204425880U (en) * | 2015-03-09 | 2015-06-24 | 讯凯国际股份有限公司 | Portable electronic devices and detachable auxiliary heat dissipation module thereof |
| CN204761925U (en) * | 2015-05-27 | 2015-11-11 | 奇鋐科技股份有限公司 | Water cooling plant that can buckle |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200733856A (en) * | 2006-02-20 | 2007-09-01 | Sunonwealth Electr Mach Ind Co | Composite heat-dissipating module |
| TWI347824B (en) * | 2007-09-13 | 2011-08-21 | Fujitsu Ltd | Liquid cooling unit and electronic apparatus |
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2016
- 2016-03-15 TW TW105107844A patent/TWI615088B/en active
- 2016-04-29 CN CN201610284514.3A patent/CN106973544B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201515582U (en) * | 2009-09-24 | 2010-06-23 | 微星科技股份有限公司 | External radiator and related electronic device thereof |
| CN201557360U (en) * | 2009-11-20 | 2010-08-18 | 英业达股份有限公司 | Cooling fan device and electronic computing system thereof |
| CN104349648A (en) * | 2013-08-09 | 2015-02-11 | 技嘉科技股份有限公司 | Composite type heat radiating assembly |
| CN204425880U (en) * | 2015-03-09 | 2015-06-24 | 讯凯国际股份有限公司 | Portable electronic devices and detachable auxiliary heat dissipation module thereof |
| CN204761925U (en) * | 2015-05-27 | 2015-11-11 | 奇鋐科技股份有限公司 | Water cooling plant that can buckle |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI615088B (en) | 2018-02-11 |
| TW201725962A (en) | 2017-07-16 |
| CN106973544B (en) | 2019-03-15 |
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