JP5047095B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device equipped with a cooling device that suppresses a rise in temperature of a memory module that can be inserted and removed from a circuit board.

  In recent years, with the increase in performance of electronic devices and the increase in processing speed due to the clock-up of the CPU, the memory module is also used with the clock-up, so the amount of heat generation is naturally increasing. On the other hand, electronic devices tend to be miniaturized, and the mounting density inside the electronic devices is increasing, so measures for heat dissipation are becoming increasingly important. Among them, the memory module has generally been subjected to heat radiation cooling processing by forced air blowing by a fan or the like.

  Regarding cooling of this memory module, Patent Document 1 discloses a memory module that effectively uses the wind from a fan to improve heat dissipation and a mounting method thereof.

  On the other hand, Patent Document 2 discloses a heat radiating device for a memory module that is easy to mount and has high versatility.

JP 2006-41381 A JP 2004-79940 A

  In the above-described conventional technology, there is a problem to be solved.

  The technology described in Patent Document 1 is detachable and has good heat dissipation by connecting the board and the module with a connection pin or a spring, and screwing and connecting the power supply wiring of the board and the module with a fixing jig. It is supposed to be a mounting method that can obtain a module. However, in this method, when replacing a module in a board in use, the socket must be removed from the board and changed, or a new board must be replaced. In addition, the pins alone are insufficient in strength, and there is a possibility of deformation when the module is inserted and removed. Furthermore, it is necessary to fix with a screw, and there exists a subject that the man-hour at the time of module replacement increases.

  The technology described in Patent Document 2 is such that a memory module heat dissipation device having a heat conductive component having a thermal conductivity of a predetermined value or more and an elastic component that exerts a force that makes contact with the heat conductive component is inserted between the semiconductor memory modules. Then, the heat transfer rate is increased using the thermal conductivity, and the semiconductor memory module is radiated by other members. However, although this memory module heat radiating device has a heat transfer function, its heat radiating effect is small, and a drastic temperature drop cannot be expected only by inserting it between the semiconductor memory modules. Furthermore, since the memory module heat dissipating device is disposed between the memory modules, there are concerns about problems such as obstructing ventilation.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device that is small in size, has good cooling efficiency, and has improved ease of mounting.

  In order to solve the above-described problem, the present invention provides an electronic device including a memory module that is detachably mounted on a circuit board, and a cooling device that cools the heat generated by the memory module. A heat receiving member that receives heat by the refrigerant liquid, and a heat radiating member that radiates heat from the refrigerant liquid, and the heat receiving member and the heat radiating member are connected by a pipe through which the refrigerant liquid flows. The refrigerant liquid is circulated between the heat sink and the heat receiving member is disposed so as to face the plane of the substrate of the memory module, and presses the memory module to thermally connect it. And a jacket portion having a sealed space through which the refrigerant liquid can be circulated, and the heat conduction portion and the jacket portion are configured to be thermally connected by integral bonding. And butterflies.

  According to the present invention, a high-speed and stable processing capability of a memory module is maintained by a cooling device that is small in size, has good cooling efficiency, and is easy to mount against clock-up of a memory module in an electronic device. It is possible to provide an electronic device that can

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a front view schematically showing a schematic configuration of an electronic apparatus equipped with a memory module cooling device according to the present invention.

  In FIG. 1, the configuration of the electronic device 1 will be described. A circuit board 3, an HDD 5, an optical disk device 6, a power source 7, and the like are mounted inside the main body case 2 of the electronic device 1. On the circuit board 3, a socket 11 (11a, 11b) for mounting a plurality of memory modules 4 (4a, 4b, 4c, 4d) and a CPU 8 are attached. Furthermore, it has the cooling device 9 for cooling the heat generating body mounted in the electronic device 1.

  Although details of the memory module 4 will be described later, the memory module 4 can be removably mounted in the socket 11 on the circuit board 3.

  Here, the object to be cooled in the present embodiment is the memory module 4 among the heating elements mounted on the electronic device 1. Of course, the HDD 5 and the CPU 8 are also heat generating elements, and when the HDD 5 and the CPU 8 are similarly to be cooled, heat receiving heat that is thermally connected to each of the HDD 5 and the CPU 8 in a circulation passage of the cooling device 9 to be described in detail later. It is possible to cool the memory module 4 together with a member by controlling the circulation amount of the refrigerant liquid. However, the present embodiment relates to a cooling technique for stably maintaining the capacity of the memory module 4 at high speed, and the arrangement space for cooling the generated heat in the memory module 4 is suppressed and efficiently. It demonstrates as a cooling device to cool. That is, the cooling device 9 for cooling the memory module 4 has no structural difference regardless of whether or not the HDD 5 or the CPU 8 is cooled. Therefore, the description regarding the cooling of the HDD 5 or the CPU 8 is omitted here. And

  Next, the cooling device 9 for the memory module 4 mounted on the electronic device 1 will be described. The cooling device 9 is thermally connected to the memory module 4 that is the object to be cooled, a heat receiving member 91 (details will be described later), to which heat from the memory module 4 is transmitted by the refrigerant liquid that circulates inside, and the refrigerant liquid. The heat receiving member 92 and the heat radiating member 92 are connected to each other by a group of pipes 94. This group of pipes 94 is configured such that the refrigerant liquid is circulated therein, and the refrigerant liquid is circulated by driving the pump 93. Furthermore, a tank 95 for storing the refrigerant liquid is provided in the middle of the circulation flow path. That is, the cooling device 9 according to the present embodiment is a liquid cooling type cooling device.

  The heat receiving member 91 is provided with a plurality of flat plate-like heat conducting portions 911 (911a, 911b, 911c, 911d) that can receive heat generated in the plurality of memory modules 4 (4a, 4b, 4c, 4d) so as to face each other. Yes.

  The heat dissipating member 92 is installed by protruding a part of the heat dissipating member 92 from the rear inner wall of the main body case 2 or the main body case 2 in order to discharge the heat received by the heat receiving member 91 to the outside of the main body case 2. ing.

  Here, the plurality of memory modules 4 (4a, 4b, 4c, 4d) are detachably attached to the sockets 11 provided on the circuit board 3. In addition, since there are a large number of memory modules 4 mounted on the electronic apparatus 1, a plurality of sockets 11 (two in the embodiment, 11a, 11b) may be mounted. In this case, a plurality of sets of heat receiving portions 91 (91a, 91b) are mounted.

  Here, the memory module 4 will be described.

  FIG. 2 is a schematic explanatory diagram of the memory module according to the present embodiment. As shown in FIG. 2, the memory module 4 is generally constituted by a flat DIMM (Dual inline memory module) substrate 41, and a plurality of memory ICs 42, capacitors 43, and the like are mounted on the substrate 41. A metal terminal portion 44 for electrical connection with the substrate 3 is provided.

  In the form of the memory module 4, the memory IC 42 may be mounted only on one side of the memory module substrate 41 or on both sides. In addition, in the mounted state in the electronic device 1, the memory module 4 may not be mounted in any part of the socket 11. In this embodiment, the memory module 4 can be cooled in any case.

  Further, since the heating element is the memory IC 42, it is preferable that the heat receiving member 91 of the cooling device 9 is thermally connected to the memory IC 42 to receive heat. Therefore, when the memory ICs 42 are mounted on both planes of the substrate 41, the heat receiving member 91 (details will be described later) is constituted by the heat conducting portions 911 and 913 that face both surfaces of the substrate 41. It is preferable to hold the substrate 41 by pressing from both sides.

  Next, the structure of the heat receiving member 91 that is thermally connected to the memory module 4 will be described.

  FIG. 3 is an exploded perspective view showing the structure of the heat receiving member of the cooling device according to the present embodiment. As shown in FIG. 3, the memory module 4 is mounted on a socket 11 provided on the circuit board 3, and is held so as to be freely inserted and removed in the Z-axis direction. The socket 11 has a structure in which four memory modules 4a, 4b, 4c, and 4d can be mounted, but this number is not limited to this.

  The heat receiving member 91 in the cooling device 9 is arranged to face the substrate 41 on both planes of the substrate 41 of the memory module 4, and moves freely on the X axis to separate the thermal connection with the memory module 4. Plate-like heat conducting portions 911, 913, and jacket portions 912, 914 having sealed spaces capable of circulating a coolant liquid that is integrally joined to the heat conducting portions 911, 913 and thermally connected thereto. ing. The heat conducting portions 911 and 913 and the jacket portions 912 and 914 are preferably made of a metal material having good heat conductivity.

  In addition, the heat conducting units 911 and 913 are arranged to be thermally connected to the memory ICs 42 mounted on both sides of the substrate 41 of the plurality of memory modules 4a, 4b, 4c, and 4d. 4c and 4d are provided with the same number of heat conducting portions 911a, 911b, 911c, 911d, and 913a, 913b, 913c, 914d arranged opposite to both sides of the substrate 41. Further, on the opposing flat surfaces of the respective substrates 41 in the heat conducting portions 911 and 913, in order to improve the thermal connection with the memory module 4, the heat conducting sheet 915 having excellent elasticity and excellent heat conductivity. Is attached.

  Furthermore, the jacket portions 912 and 914 have refrigerant liquid circulation inlets 916 and 917 and circulation outlets 918 and 919, respectively. The circulation outlet 918 and the circulation inlet 917 are connected by a pipe, and the circulation inlet 916 and the circulation outlet 919 are connected to a circulation pipe, thereby constituting the refrigerant liquid circulation passage shown in FIG. .

  Further, the jacket portions 912 and 914 are arranged in a state of covering the upper portions of the other heat conducting portions 913 and 911 at planar positions having substantially the same height.

  In addition, a heat receiving holding member 920 for holding the heat receiving member 91 and operating the heat conducting portion 911 to move forward and backward in the X-axis direction and heat receiving operation members 921 and 922 are provided on the upper portions of the jacket portions 912 and 914. It has been.

  Next, heat conversion between the heat receiving member 91 of the cooling device 9 and the memory module 4 will be described.

  FIG. 4 is a configuration perspective view illustrating the heat receiving member of the cooling device according to the present embodiment before the thermal connection state with the memory module. FIG. 5 is a structural perspective view showing a state in which the heat receiving member of the cooling device according to the present embodiment is thermally connected to the memory module. FIG. 6 is a partial cross-sectional view schematically showing the thermal connection between the heat receiving member and the memory module according to this embodiment.

  FIG. 6 shows that the memory IC 42 of the memory module 4 is installed only on one side of the substrate 41 and is opposed to the one side for easy understanding of the separation of the thermal connection between the memory module 4 and the heat receiving member 91. Only the heat receiving member 91 is described. When the memory ICs 42 are mounted on both surfaces of the substrate 41 of the memory module 4, it is easily assumed that they are thermally connected from both planes of the memory module 4 with the same structure as shown by the broken line. Is.

  FIG. 6A shows a state where the memory module 4 and the heat conducting unit 911 are separated from each other, and the heat conducting unit 911 is removed from the socket 11 on the circuit board 3 in the direction indicated by the white arrow. It shows the state of being moved to. FIG. 6 (2) shows a state in which the heat conduction part 911 is pressed against the memory module 4 in order to cool the heat generation of the memory module 4 in the operating state of the electronic device 1, and is thermally connected to receive and cool. Show.

  Since the plurality of heat conducting portions 911 a, 911 b, 911 c, and 911 d have an integral structure, they move integrally in the direction of the arrow and are thermally connected simultaneously with the plurality of memory modules 4.

  Here, in order to improve the physical contact between the memory IC 42 which is a heat generating element of the memory module 4 and the heat conducting part 911 and to improve the heat transfer efficiency, it is pressed through the heat conducting sheet 915. . It is preferable to set the thickness (T) of the heat conductive sheet to be larger than the thickness (t) of the memory module. By doing so, even if the memory IC 42 is mounted only on one surface of the substrate 41, the heat conductive sheet 915 of the heat conductive portion 911 facing the other surface of the substrate 41 Since it contacts and presses the other surface, it is possible to receive the heat conducted to the substrate 41.

  Of course, when any of the memory modules 4 is not attached to the socket 11, the corresponding heat conducting portion 911 is not thermally connected, but is attached to another heat conducting portion 911. There is no problem in the thermal connection state with the memory module 4.

  Due to the thermal connection between the memory module 4 and the heat conducting unit 911 as described above, the heat of the memory module 4 is transmitted to the heat conducting unit 911 via the heat conducting sheet 915. The heat received by the heat conducting portion 911 is transferred to the jacket portion 912 by the heat conducting portion 911 and is transmitted to the refrigerant liquid flowing through the inside in the jacket portion 912. The heat transferred to the refrigerant liquid in the jacket part 912 is transferred to the heat radiating member 92 through the circulation of the refrigerant liquid in the pipe, and is radiated to the atmosphere in the heat radiating part 92.

  Further, since the jacket portion 912 is disposed so as to cover the upper portion of the memory module 4, the air heated by the heat generated by the memory module 4 rises and is secondarily transferred to the jacket portion 912. Further, the effect of heat reception can be further improved.

  Here, the moving operation for separating the thermal connection of the heat conducting unit 911 is performed by the heat receiving holding member 920 and the heat receiving operation members 921 and 922 shown in FIGS.

The set of heat receiving members 91 described above has guide pins 924 (924a, 924b, 924c, 924d) that are operated so as to be able to advance and retreat in order to press each of them against the memory module 4.
The guide pins 924 are disposed in engagement with guide holes 923 (923a, 923b, 923c, and 923d) provided in heat receiving operation members 921 and 922 that are installed in the upper part through the heat receiving holding member 920. The guide hole 923 is a cam hole opened at a predetermined angle with respect to the X-axis and Y-axis directions.

  As shown in FIG. 4, by expanding the heat receiving operation members 921 and 922 in the Y-axis direction in the direction of the arrow (A), the guide pins 924a and 924b are guided in the direction of the arrow (C) by the guide holes 923a and 923b. The guide pins 924c and 924d are moved against the urging force of the pressing elastic members 925a and 925b in the direction of the arrow (d) by the guide holes 923c and 923d. That is, the movement of the guide pin 924 brings the heat receiving member 91 into a state of being released from thermal bonding with the memory module 4.

  Here, as shown in FIG. 5, by contracting the heat receiving operation members 921 and 922 in the Y-axis direction in the arrow (b) direction, the guide pins 924a and 924b are moved in the arrow (e) direction by the guide holes 923a and 923b. Further, the guide pins 924c and 924d are moved in the arrow (f) direction by the guide holes 923c and 923d. Accordingly, the heat conducting portion 911 of the heat receiving member 91 is pressed against the memory module 4 by the respective pressing elastic members 925a and 925b, and the memory module 4 and the heat conducting member 911 are thermally connected.

  Further, the heat receiving member 91 can be inserted into and removed from the electronic apparatus 1 in the same direction as the insertion / extraction direction of the memory module 4 from the circuit board 3. The heat receiving member 91 includes the memory module 4 of the heat conducting units 911 and 913. The heat receiving member 91 can be detached by an operation of releasing the pressing force to the memory module 4.

  With the above configuration, it is possible to provide a cooling device that can efficiently cool a plurality of memory modules with a simple structure, and can be freely performed without interfering with memory module replacement and expansion / removal operations. Can be provided.

It is a front view which shows typically schematic structure of the electronic device carrying the cooling device of the memory module which concerns on the Example of this invention. It is a schematic explanatory drawing of the memory module which concerns on a present Example. It is a disassembled perspective view which shows the structure of the heat receiving member of the cooling device which concerns on a present Example. It is a structure perspective view in which the heat receiving member of the cooling device concerning a present example shows the state before thermal connection with a memory module. It is a composition perspective view in which the heat receiving member of the cooling device concerning this example shows a thermal connection state with a memory module. It is a figure which shows a part of structure cross section which showed typically the thermal connection of the heat receiving member and memory module which concern on a present Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Main body case, 3 ... Circuit board, 4 ... Memory module, 5 ... HDD, 6 ... Optical disk apparatus, 7 ... Power supply, 8 ... CPU, 9 ... Cooling device, 91 ... Heat receiving member, 92 ... Heat dissipation Element. 911, 913 ... heat conduction part, 912, 914 ... jacket part, 915 ... heat conduction sheet, 916, 917 ... inflow inlet, 918, 919 ... outflow outlet, 920 ... heat receiving holding member, 921, 922 ... heat receiving operation member 93 ... Pump, 94 ... Piping, 95 ... Tank.

Claims (4)

An electronic device including a memory module that is detachably mounted on a circuit board, and a cooling device that cools heat generated by the memory module,
The cooling device includes a heat receiving member that receives heat from the refrigerant liquid, and a heat radiating member that radiates heat from the refrigerant liquid, and the heat receiving member and the heat radiating member are connected by a pipe through which the refrigerant liquid flows. The refrigerant liquid is configured to circulate between the member and the heat dissipation member,
The heat-receiving member, on both sides of the circuit board on which the memory modules are mounted, respectively, wherein a pair of the heat conductive portion that will be disposed opposite to the plane of the substrate, a sealed space can flow the refrigerant liquid The heat conduction part and the jacket part are thermally connected by integral joining, and the set of heat conduction parts move forward and backward relative to each other to press and narrow the memory module. An electronic device characterized by having a structure that can be held . The electronic device according to claim 1,
A plurality of the memory modules can be mounted on the circuit board so as to be parallel to each other,
The heat conducting part is configured by integrally providing a plurality of flat plates corresponding to the plurality of memory modules in parallel with the jacket part, and is thermally coupled to the plurality of memory modules. An electronic device characterized in that connection can be separated. The electronic device according to claim 2,
Each jacket part joined to the one set of flat plates is joined at the upper end of each heat conducting part,
An electronic apparatus, wherein a pair of jacket portions is configured as a planar arrangement covering the plurality of memory modules and an upper portion of the set of heat conducting portions. The electronic device according to claim 1,
The heat receiving member can be inserted into and removed from the electronic device in the same direction as the memory module inserted into and removed from the circuit board, and the heat receiving member is held by the pressing force of the heat conducting portion to the memory module. An electronic device , wherein the heat receiving member can be detached by an operation of releasing the pressing force to the memory module .

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