JPH0767021B2 - Semiconductor element cooling structure - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a cooling method for a package in which a semiconductor element used in an electronic device is mounted, and in particular, a CMOS having a low heat generation amount per unit but a large number mounted. -Relating to the cooling structure of semiconductor elements such as RAM.

[Conventional technology]

In general, a large number of semiconductor elements of various types including a memory system such as CMOS / RAM and a control system thereof are mounted on a package used for a storage device which constitutes a part of an electronic device. In recent years, the improvement in the degree of integration of these semiconductor elements themselves, the increase in the size of the package, and the increase in the number of mounted elements per package have dramatically improved the mounting density of the semiconductor elements, while the number of semiconductor elements has increased. It is accelerating the race to develop more efficient and efficient cooling technology for the total calorific value.

The development of cooling technology has proceeded to natural air cooling, forced air cooling, indirect water cooling with a refrigerant intervening in the air flow path, conduction water cooling method, and immersion method. It should be noted that the latter method provides a higher cooling capacity although it is disadvantageous in terms of cost. In the storage device described above, especially in the field of large machines, the heat generation amount of the semiconductor element of the control system has already exceeded the limit of forced air cooling, so that the heat generation surface of the semiconductor element is thermally converted into a cold plate having a coolant flow path. The water-cooling method, which is represented by the conduction cooling method to be combined, is actively used.

The water cooling method requires an external cold water supply device,
Since it is not necessary to secure an air flow path such as a fan, an air intake port, and a discharge port in the case of forced air cooling, there is a large degree of freedom in mounting form. There is no need to worry about noise regulations. On the other hand, the forced air cooling method is the most suitable in terms of efficiency as the cooling method for the semiconductor elements of the memory system in which the heat generation amount of each individual is low and the number of mounted devices per package is large.

[Problems to be Solved by the Invention]

As described above, both the water-cooling method and the air-cooling method have advantages and disadvantages. However, in electronic devices including control-system and memory-type semiconductor elements, the water-cooling method for the control-system semiconductor element and the forced air-cooling method for the memory-type semiconductor element are used. Mixing results in the loss of the advantages of the water cooling system described above. Therefore, there is a demand for a cooling structure by a water cooling method suitable for a semiconductor element of a memory system in order to effectively use a water channel brought into the package.

[Means for Solving the Problems]

A semiconductor element cooling structure according to the present invention includes a printed board,
A plurality of multi-chip packages (MCP) mounted with a plurality of semiconductor elements arranged in a row on the printed board, a cold plate having a coolant flow path, and a plurality of multi-chip packages arranged so that the multi-chip packages are located between them. A plurality of heat conducting plates thermally coupled to the cold plate, and a leaf spring provided between the heat conducting plate and the multi-chip package for giving a force to press the heat conducting plate and the multi-chip package against each other. It is configured to include and.

〔Example〕

 Next, the present invention will be described by way of examples with reference to the drawings.

FIG. 1 is a front view of a package showing an embodiment of the present invention. FIG. 2 is a sectional view taken along the line AA in FIG.

In FIGS. 1 and 2, on the printed wiring board 1, a control system semiconductor element 8 is arranged in the center, and above and below the memory system semiconductor element 9 are mounted DIP type long plate-shaped MCPs 2 on both sides. It is installed (11 in the figure is the signal pin of MCP2). On one side of the long plate-shaped MCP 2, the long plate-shaped heat conduction plates 3 arranged in the same manner are provided with a semiconductor element 9 through a cool sheet (sheet made of silicon rubber whose heat conductivity is improved by an additive) 10. , And the long plate-shaped heat conduction plate 3 is further thermally coupled to the cold plate 5 provided with the pipe through which the water flow 7 passes by brazing or the like. Note that the cold plate 5 is also shown for cooling the control system semiconductor element 8 having a high heat generation amount for convenience.

The semiconductor element 9 mounted on the other surface of the long plate-shaped MCP 2 also has the long plate-shaped heat conduction plate 3 through the cool sheet 10 and the plate spring 4.
Is in thermal contact with. The leaf spring 4 is a long plate-shaped heat conduction plate 3
And the long plate-shaped MCP2 are pressed against each other, and the long plate-shaped heat conduction plate 3 and the long plate-shaped MCP2 are brought into close contact with each other via the cool sheet 10 (and the plate spring 4). The heat generated by the semiconductor element 9 is generated by the heat dissipation surface of the element case and the cool sheet 10.
(And the leaf spring 4), the long plate-shaped heat conduction plate 3, and the cold plate 5 are reached in this order, and are carried out of the package by the water flow 7 flowing in the pipe provided in the cold plate 5.

In addition, 6 in FIG. 1 shows a connector. Also, long plate-shaped MCP2
May be a SIP type with a semiconductor element mounted on one side. Further, instead of the cool sheet 10, a compound having excellent thermal conductivity may be used.

In any case, this embodiment can absorb variations in the mounting height of the semiconductor element to some extent and can be constructed at a low cost.

〔The invention's effect〕

As described above, according to the present invention, the MCP provided with the semiconductor element, which is a heating element, is arranged between the heat conduction plates coupled to the cold plate, and the MCP is provided by the leaf spring (via the cool sheet or the leaf spring). By closely contacting with each other, it is possible to efficiently cool a semiconductor element of a memory system, which has a low heat generation amount but has a large number of mounted elements, by a water cooling method. This has the advantage that the degree of freedom of the mounting form can be expanded.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA shown in FIG. 1 ... Printed wiring board, 2 ... Long plate-shaped MCP, 3 ... Long plate-shaped heat conduction plate, 4 ... Leaf spring, 5 ... Cold plate,
6 ... Connector, 7 ... Water flow, 8 ... Control system semiconductor element, 9 ... Memory system semiconductor element, 10 ... Cool sheet,
11 …… Signal pin.

Claims (1)

[Claims] 1. A printed circuit board, a plurality of multi-chip packages on which a plurality of semiconductor elements are mounted and arranged in a row on the printed circuit board, a cold plate having a coolant channel, and the multi-chip package respectively interposed therebetween. A plurality of heat conducting plates arranged in a row and thermally coupled to the cold plate, and provided between the heat conducting plate and the multi-chip package and pressed against each other by the heat conducting plate and the multi-chip package. A cooling structure for a semiconductor device, comprising: a leaf spring that applies a matching force.