JPH01270298A - Cooling structure for semiconductor element - Google Patents

Abstract

PURPOSE:To realize the high efficient cooling structure of a water cooling system, by applying mutually pushing force to a heat conduction plate and a multichip package, by a plate spring. CONSTITUTION:A multichip package 2 in which semiconductor elements 8, 9 being heating elements are provided is arranged between heat conduction plates 3 coupled with a cold plate 5. The multichip package 2 is tightly brought into contact with the heat conduction plate 3 by a plate spring 4, via a cool sheet and the plate spring 4. As a result, cooling of the memory system semiconductor elements 9, wherein the heating value of each element is small but the number of mounted elements is large, can be effectively achieved by water cooling system, thereby extending the freedom of mounting mode.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a cooling method for a package mounted with a semiconductor element used in an electronic equipment device, and in particular, the present invention relates to a cooling method for a package equipped with a semiconductor element used in an electronic equipment device, and in particular, the present invention relates to a cooling method for a package mounted with a semiconductor element used in an electronic device. -Related to cooling structures for semiconductor elements such as RAM.

[Conventional technology]

In general, a package used for a storage device that constitutes a part of an electronic device is equipped with a large number of semiconductor elements of various types including a memory system such as a CMOS-RAM and its control system. In recent years, improvements in the degree of integration of semiconductor devices themselves, larger packages, and an increase in the number of devices mounted per package have dramatically improved the packaging density of semiconductor devices. This is spurring competition to develop cooling technologies that have higher performance and efficiency in terms of total heat output.

The flow of cooling technology development has progressed to natural air cooling, forced air cooling, indirect water cooling that uses a refrigerant in the air flow path, conduction water cooling, and immersion. Note that the latter method is disadvantageous in terms of cost, but provides a higher cooling capacity. In the storage devices mentioned above, especially in the field of large machines, the heat generation of the semiconductor elements in the control system has exceeded the limit of forced air cooling, so the heat generating surface of the semiconductor element is heated by a cold plate with a coolant flow path. Water-cooling systems, such as conduction cooling systems, are being actively adopted.

Although the water cooling method requires an external cold water supply device,
Since there is no need to provide air flow paths such as fans and air intake ports and discharge ports as in forced air cooling, there is a high degree of freedom in mounting form. Also, there is no need to comply with noise regulations. On the other hand, in terms of efficiency, forced air cooling is the most suitable cooling method for memory-based semiconductor devices, which each generate a small amount of heat and are mounted in a large number of devices per package.

[Problem to be solved by the invention]

As mentioned above, both water-cooling and air-cooling systems have advantages and disadvantages, but in electronic equipment that includes control system and memory-based semiconductor devices, water-cooling methods for control system semiconductor devices and forced air cooling methods for memory-based semiconductor devices are recommended. Mixing them results in the loss of the advantages of the water cooling system described above. Therefore, in order to effectively utilize the water channels brought into the Hara cage, there is a demand for a cooling structure using a water cooling method suitable for memory semiconductor devices.

[Means to solve the problem]

A semiconductor device cooling structure according to the present invention includes a printed board,
A plurality of multi-chip packages (MCPs) mounted with a plurality of semiconductor elements and arranged in a row on the printed board, a cold plate having a coolant flow path, and arranged in a row so that each of the multi-chip packages is located between each of them. a plurality of heat conductive plates thermally coupled to the cold plate; and a plate spring provided between the heat conductive plates and the multi-chip package and applying force to press the heat conductive plates and the multi-chip package toward each other. It consists of:

〔Example〕

Next, the present invention will be explained by way of example with reference to the drawings.

FIG. 1 is a front view of a package showing an embodiment of the present invention. FIG. 2 is a sectional view taken along line A--A in FIG. 1.

In FIGS. 1 and 2, a control system semiconductor element 8 is placed in the center on a printed wiring board 1, and above and below it are rows of DIP type long plate-shaped MCPs 2 with memory system semiconductor elements 9 mounted on both sides. (In the figure, 11 is the signal pin of MCP2). On one side of the long plate-like MCP 2, similarly arranged long plate-like heat conductive plates 3 are connected to semiconductor elements 9 via a cool sheet (a sheet made of silicone rubber whose thermal conductivity has been improved by additives) 10. The elongated heat conductive plate 3 is further thermally coupled by brazing or the like to a cold plate 5 provided with a pipe through which a water flow 7 passes. For convenience, the cold plate 5 is also shown for cooling the control system semiconductor element 8 which generates a large amount of heat.

The semiconductor element 9 mounted on the other surface of the elongated MCP 2 is also in thermal contact with the elongated heat conductive plate 3 via the cool sheet 10 and the leaf spring 4. The leaf spring 4 applies a force such that the long heat conductive plate 3 and the long plate MCP2 are pressed against each other L1, and the long heat conductive plate 3 and the long plate MCP2 are connected to the cool sheet 10 (and the leaf spring 4 ) are in close contact with each other. The heat generated by the semiconductor element 9 reaches the heat dissipation surface of the element case, the cool sheet 10 (and the leaf spring 4), the elongated heat conduction plate 3, and the cold plate 5 in this order, and then flows through the pipe provided in the cold plate 5. It is carried away from the package by the flowing water stream 7.

Note that 6 in FIG. 1 indicates a connector. In addition, long plate-like MC
P2 may be an SIP type with a semiconductor element mounted on one side. Moreover, a compound with excellent thermal conductivity may be used instead of the cool sheet 10.

In any case, this embodiment can absorb variations in the mounting height of semiconductor elements to some extent and can be constructed at low cost.

〔Effect of the invention〕

As explained above, in the present invention, an MCP provided with a semiconductor element as a heating element is arranged between heat conductive plates coupled to a cold plate, and a plate spring connects the MCP to the heat conductive plate (via a cool sheet and a plate spring). By placing them in close contact with each other, it is possible to efficiently cool memory-based semiconductor elements, which each generate a small amount of heat or have a large number of installed elements, using a water-cooling method. This has the advantage of increasing the degree of freedom in implementation.

[Brief explanation of the drawing]

FIG. 1 is a front view of one embodiment of the present invention, and FIG. 2 is an AA@ plane view shown in FIG. 1. 1... Printed wiring board, 2... Long plate-shaped MCP, 3.
・・Long heat conduction plate, 4・Plate spring, 5・Cold plate, 6・Connector, 7・Water flow, 8・・
- Control system semiconductor element, 9...Memory system semiconductor element, 1
0...Cool sheet, 11...Signal bin.

Claims (1)

[Claims] a printed board, a plurality of multi-chip packages mounted with a plurality of semiconductor elements and arranged in rows on the printed board, and a cold plate having a coolant flow path, arranged in rows such that each of the multi-chip packages is located between each of them. a plurality of heat conduction plates provided and thermally coupled to the cold plate; and a plate provided between the heat conduction plates and the multi-chip package and applying force to press the heat conduction plates and the multi-chip package toward each other. A cooling structure for a semiconductor device, characterized in that it includes a spring.