JP2503480B2 - Integrated circuit cooling structure - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit, and more particularly to cooling a device such as a memory device of a computer main body in which a large number of integrated circuits having a relatively low heat generation amount are mounted. Regarding the structure.

[Prior Art] In general, a package used for a memory device that constitutes a part of an electronic device includes a plurality of types of integrated circuits including a memory system such as a CMOS RAM and its control system. The recent increase in the degree of integration of these integrated circuits, the increase in the size of the package, and the increase in the number of mounted elements per package have dramatically improved the packaging density of the integrated circuits. On the other hand, however, it is accelerating the competition to develop higher-performance and highly-efficient cooling technology against the increased total heat generation of integrated circuits.

The development of cooling technology has progressed to natural air cooling, forced air cooling, indirect water cooling with a refrigerant intervening in the air flow path, water cooling method, and immersion method. It should be noted that the latter becomes more disadvantageous in terms of price, but a higher cooling capacity can be obtained.

In the memory device described above, especially in the field of large machines, the heat generation amount of the integrated circuit of the control system has already exceeded the limit of forced air cooling. For this reason, the water cooling method represented by the conduction cooling method in which the heat generating surface of the integrated circuit is thermally coupled to the cooling plate having the coolant channel is actively used.

[Problems to be Solved] Although the above-described conventional water cooling system requires an external chilled water supply device, a fan for forced air cooling and an air flow path such as an air intake port and a discharge port are secured. Since there is no need, the degree of freedom of mounting is high. Also, there is no need to worry about noise regulation.

On the other hand, the forced cooling is most suitable for the cooling method of the integrated circuit of the memory system in which the heat generation amount of each is low and the number of mounted devices per package is large.

However, mixing the cooling system for the control system integrated circuit and the forced air cooling system for the memory system integrated circuit results in losing the advantages of the water cooling system. Therefore, in order to effectively utilize the water channels carried in the package, there is a demand for a water cooling type cooling structure suitable for a memory integrated circuit.

[Means for Solving the Problems] The present invention for solving the above-mentioned conventional problems provides a cooling structure for cooling a plurality of integrated circuits mounted on a substrate, and a refrigerant pipe in which a refrigerant circulates between the integrated circuits. The fins thermally coupled to the refrigerant pipe are arranged.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

1 is a plan view showing a cooling structure for an integrated circuit according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a part B of FIG. It is a perspective view taken out and shown. In the figure, a plurality of MOS type integrated circuits 5 are arranged and mounted on a substrate 1, and a plurality of integrated circuits (not shown) are also mounted below the cooling plate 6. On the other hand, the MOS type integrated circuit 5 is for a memory, and its heat generation amount is relatively small as described above. The integrated circuit below the other cooling plate 6 is for control, and its heat generation amount is large.

A refrigerant pipe 2 is arranged on the substrate 1 so as to surround the entire MOS type integrated circuit 5 and to cross between the integrated circuits 5. Refrigerant is injected into the refrigerant pipe 2 from a refrigerant inlet 8, the refrigerant circulates between the integrated circuits 5, and then is discharged from the refrigerant outlet 9.

In addition, between these integrated circuits 5, a radiation fin 3 is arranged in a direction perpendicular to the refrigerant pipe 2. The radiation fins 3 and the refrigerant tubes 2 are fixed so as to be thermally coupled to each other. The radiation fins 3 and the refrigerant tubes 2 form a large number of grids, and the integrated circuit 5 is housed in these grids. It is in a state.
FIG. 3 is a schematic representation of these structures.

In the structure of the present embodiment, the heat exchange between the integrated circuit 5 and the radiation fins 3 or the refrigerant tubes 2 is performed mainly by natural convection in the narrow space formed by the grid. In order to enhance the ability of this natural convection, a flat heat conduction plate 4 is further attached to the upper surface of the radiation fin 3.

As described above, the cooling structure for an integrated circuit according to the present invention is
Since a refrigerant pipe in which the refrigerant circulates and a fin thermally coupled to this refrigerant pipe are arranged between the integrated circuits mounted on the substrate, it is difficult to adopt a water cooling structure by conduction because it is used in large quantities Since it is a MOS type RAM, etc., which has a relatively small amount of heat generation, it is possible to adopt a completely water-cooled structure. Therefore, there is an effect that a conventional cooling fan is not required and a device with low noise and high reliability can be realized.

[Brief description of drawings]

1 is a plan view showing a cooling structure of an integrated circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA of FIG.
FIG. 3 is an enlarged perspective view of portion B in FIG. 1: Substrate, 2: Refrigerant tube 3: Radiating fin, 4: Heat conductor plate 5: Integrated circuit, 6: Cooling plate

Claims (1)

(57) [Claims] 1. A cooling structure for cooling a plurality of integrated circuits mounted on a substrate, wherein a refrigerant pipe through which a refrigerant circulates and fins thermally coupled to the refrigerant pipe are arranged between the integrated circuits. A cooling structure for an integrated circuit.