JP2001144232A - Heat-dissipating box for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a natural air cooling heat-dissipating box for an electronic apparatus which has high heat-dissipating effect. SOLUTION: In a heat-dissipating box for an electronic apparatus 3 mounting a heat-generating electronic component 1, a lattice-shaped sectional area of a cooling heat-dissipating fin 4 formed in the heat-dissipating box 3 has a larger cooling air stream inlet and a smaller air stream outlet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating housing for electronic equipment, and more particularly to a heat radiating housing suitable for cooling air-cooled electronic equipment by natural air.

[0002]

2. Description of the Related Art Electric parts such as semiconductor parts and transformers generate heat during use and reach high temperatures, so that it is necessary to cool them. When such an electric component is cooled, as shown in FIG. 6, a heat radiating housing 33 having a number of comb-shaped heat radiating fins 34 made of a material having good thermal conductivity such as aluminum is formed. The heat source 31 which is an electric component as described above is attached, and the heat generated from the heat source 31 is radiated from the radiating fins 34 and cooled.

Japanese Patent Application Laid-Open No. 6-221791 describes that a comb-shaped heat radiation fin is improved to improve a cooling effect. In this apparatus, a heat radiator having fins having a lattice-shaped cross section and a structure having a heat generator are separately formed, and they are brought into contact with each other and integrally connected.

A similar cooling device is disclosed in Japanese Patent Application Laid-Open No. Sho 62-14775.
No. 0 publication. This document describes that the lattice-shaped radiating fins are thicker at the center and thinner at the ends.

[0005]

By the way, in the case of a comb-shaped cooling fin as shown in FIG.
Since the fin interval cannot be made smaller than necessary, the surface area required for heat dissipation is insufficient. If the surface area is increased, it is difficult to reduce the size.

In the case of the cooling fin described in Japanese Patent Application Laid-Open No. 6-221791, the heat radiating portion and the heat generating portion have different structures, so that heat resistance is generated between them and the heat radiating efficiency is reduced. It will be.

In the cooling fin described in Japanese Patent Application Laid-Open No. 62-147750, since the plate thickness at the center of the cooling fin is large, the core is pulled out from both ends, or
Alternatively, there is a problem in that it is difficult to manufacture because it must be manufactured by cutting.

Accordingly, it is an object of the present invention to provide a heat radiating housing for electronic equipment in which these problems are solved.

[0009]

FIG. 1 shows the principle configuration of the present invention.
This will be described more simply. In FIG. 1, 1 is a heat source as a heat-generating electronic component, 2 is a base plate, 3 is a heat-radiating housing,
Reference numeral 4 denotes a lattice-shaped heat radiation fin, 5 denotes a horizontal fin, 6 denotes a vertical fin, and 7 denotes a core.

In the present invention, the fin is structured so that the core can be pulled out from one side, and is set so as not to hinder the convection of air. In addition, the present invention is configured such that the heat radiator and the structure having the heat generating portion are integrally formed of the same component so that thermal resistance does not occur between the heat radiator and the structure having the heat generating portion. It is configured in shape.

The above object of the present invention is attained by the following constitutions (1) and (2).

(1) In the heat dissipating housing 3 for electronic equipment on which the heat-generating electronic components 1 are mounted, the lattice-shaped cross-sectional area of the cooling and heat dissipating fins 4 formed in the heat dissipating housing 3 is set so that the cooling air inlet is large and The outlet is characterized by being small.

(2) In the above (1), the mounting part 2 on which the heat-generating electronic component 1 is mounted and the cooling fins 4 are integrated.

Thus, the following functions and effects can be obtained.

(1) Since the radiating fins are formed in a lattice shape, the surface area of the radiating portion is increased without increasing the envelope volume of the radiating portion. As a result, the size and weight can be reduced. In addition, the cooling air inflow area of the grid is large and the cooling air outflow area is small, so the effect of increasing the flow velocity of the air nearer to the outlet is that the convection required for heat radiation must rely on the buoyancy of the air. In air cooling, convection can be promoted and the heat radiation effect can be improved.

(2) Since the mounting part on which the heat-generating electronic components are mounted and the cooling radiating fins are integrally formed, there is no thermal resistance between them, and the heat generated from the heat-generating electronic components generates the contact heat. It can move to the radiator having the radiating fins without being affected by the resistance, and can effectively radiate heat to the atmosphere from the radiating fins.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 shows an embodiment of the present invention.
FIG. 2 is an explanatory view of a lattice fin, and FIG. 3 is an explanatory view of a relationship between a fin interval and a fin partial cross-sectional area in the lattice fin. In the figure, 1 is a heat source which is a heat-generating electronic component such as a semiconductor component or a transformer, 2 is a base plate on which the heat source is arranged, 3 is a heat-dissipating housing having the base plate 2 and lattice-shaped heat-dissipating fins 4, Reference numeral 5 denotes a horizontal fin constituting the lattice-shaped heat radiation fins 4, 6 denotes a vertical fin similarly, and 7 denotes a core used when manufacturing the lattice heat radiation fins 4.

As shown in FIG. 2, a base plate 2 on which a heat source 1, which is a heat-generating electronic component, is mounted, and a heat-radiating housing 3 having a plurality of lattice-shaped heat-radiating fins 4 are manufactured by integral molding, for example, by die casting. Thus, since the base plate 2 and the lattice-shaped radiating fins 4 are formed by integral molding, the heat resistance can be minimized and the heat from the heat source 1 can be efficiently transmitted to the lattice-shaped radiating fins 4. The heat radiating housing 3 is made of an aluminum alloy or a magnesium alloy which has a high thermal conductivity and is lightweight and can be integrally molded.

The lattice-shaped radiating fins 4 are provided on the base plate 2.
And a vertical fin 6 perpendicular to the base plate 2.

Now, the depth of the lattice shape is, for example, 130 mm.
At this time, if the interval L indicating one size of the lattice shape in FIG. 2 is 13 mm or less, it becomes impossible to integrally mold the core 7 from one side.

When the lattice is manufactured by extracting the core 7 from one side, a difference occurs in the opening area of the lattice due to the draft angle. If the air inlet is widened and the outlet is narrowed, the air flow speed becomes faster as the air outlet is approached, the convection is promoted and the heat radiation effect can be improved. FIG. 1
Then, only one core 7 is shown for the sake of simplicity.

As shown in FIG. 2, the width W is set to 220 mm, and the height H
When the distance between the fins is 34 mm, as shown in FIG. 3, when the fin spacing is 20 mm or more, the surface area of the lattice-shaped radiating fins 4 decreases when the fin spacing is 20 mm or more, and the heat radiation effect is not good. In FIG. 3, the vertical axis indicates the fin partial cross-sectional area, that is, the surface area of the fin 4. 1.20E-03 on the vertical axis is 1.20 × 10 ^−3.
Is shown. The same applies hereinafter. From these facts, it is desirable that one interval L of the lattice shape is about 13 mm to 20 mm.

The heat generated from the heat source 1 on the base plate 2 is transmitted through the base plate 2 and transmitted to the grid-shaped radiating fins 4. This heat is radiated by the air passing between the lattice-shaped radiating fins 4. At that time, even in natural air cooling where only the buoyancy of air can be expected as the fluidity of air,
Since the opening area of the lattice-shaped radiating fins 4 is 13 mm to 20 mm, which is sufficient, the air velocity can be secured without stagnation of air.

When the −Y direction is set as the lower side in the direction of gravity, the fin opening area of the lattice portion is smaller at the outflow port than at the inflow port of the air, so that the flow velocity of the air is increased, and the radiating effect is further increased. Obtainable.

A second embodiment of the present invention will be described with reference to FIG. Although FIG. 1 shows a state in which the lattice-shaped heat radiation fins are formed on only one surface, the present invention is not limited to this, and as shown in FIG. May be formed. Thereby, the heat radiation area increases, and the heat generated by the plurality of heat sources 1 can be radiated.
In FIG. 4, reference numeral 8 denotes a left surface of the heat radiating housing, and reference numeral 9 denotes a right surface of the heat radiating housing.

A third embodiment of the present invention will be described with reference to FIG. The example shown in FIG. 5 shows a case where the grid-like heat radiation fins are provided not only on the lower surface but also on the heat radiation housing left surface 8 and the heat radiation housing right surface 9. In this way, the heat generated by the plurality of heat sources 1 can be effectively radiated by increasing the heat radiation area.

Of course, in the present invention, grid-like heat radiation fins can be formed on each of the upper, lower, left and right surfaces.

As described above, according to the present invention, the following advantages can be obtained.

Since the plate portion on which the heat source is mounted and the fin portion for radiating heat are integrated, the heat resistance is small and the heat radiation efficiency is good.

Further, since the heat dissipating fins have a lattice shape, the surface area of the heat dissipating portion can be increased without increasing the envelope volume of the heat dissipating portion, and the size can be reduced.

The size of one grid is 13 mm to 20 mm
By doing so, it can be manufactured by a manufacturing method in which the core is pulled out from one side.

By pulling out the core from one side, the draft increases the flow velocity of the air in the grid during natural air cooling, thereby improving the cooling effect.

[0033]

According to the present invention, the following effects can be obtained.

(1) Since the radiating fins are formed in a lattice shape, the surface area of the radiating portion is increased without increasing the envelope volume of the radiating portion. As a result, the size and weight can be reduced. In addition, the cooling air inflow area of the grid is large and the cooling air outflow area is small, so the effect of increasing the flow velocity of the air nearer to the outlet is that the convection required for heat radiation must rely on the buoyancy of the air. In air cooling, convection can be promoted and the heat radiation effect can be improved.

(2) Since the mounting portion on which the heat-generating electronic components are mounted and the cooling radiating fins are integrally formed, there is no thermal resistance between them, and the heat generated from the heat-generating electronic components generates contact heat. It can move to the radiator having the radiating fins without being affected by the resistance, and can effectively radiate heat to the atmosphere from the radiating fins.

[Brief description of the drawings]

FIG. 1 is an embodiment of the present invention.

FIG. 2 is an explanatory view of a lattice fin.

FIG. 3 is an explanatory diagram showing a relationship between a fin interval and a fin partial cross-sectional area in a lattice fin.

FIG. 4 is a second embodiment of the present invention.

FIG. 5 is a third embodiment of the present invention.

FIG. 6 is a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat source 2 Base plate 3 Heat radiating case 4 Lattice radiating fin 5 Horizontal fin 6 Vertical fin 7 Core

 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Takamitsu Tsuna 1-13-1 Nihombashi, Chuo-ku, Tokyo TDK Corporation F-term (reference) 5E322 AA01 AB11 BA01 BA05 5F036 AA01 BA04 BA26 BB05

Claims (2)

[Claims] 1. A heat dissipation casing for electronic equipment on which heat-generating electronic components are mounted, wherein the cooling heat dissipation fin formed on the heat dissipation casing has a large lattice-shaped cross-sectional area at the cooling air inlet and a small air outlet. A heat-radiating enclosure for electronic equipment with natural air cooling. 2. A heat radiating housing for a natural air-cooled electronic device according to claim 1, wherein a mounting portion on which the heat-generating electronic component is mounted and a heat radiating fin for cooling are integrated.