JP6534873B2 - Liquid cooling system - Google Patents
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- JP6534873B2 JP6534873B2 JP2015131163A JP2015131163A JP6534873B2 JP 6534873 B2 JP6534873 B2 JP 6534873B2 JP 2015131163 A JP2015131163 A JP 2015131163A JP 2015131163 A JP2015131163 A JP 2015131163A JP 6534873 B2 JP6534873 B2 JP 6534873B2
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- 238000001816 cooling Methods 0.000 title claims description 109
- 239000007788 liquid Substances 0.000 title claims description 27
- 239000002826 coolant Substances 0.000 claims description 43
- 230000017525 heat dissipation Effects 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 33
- 230000005855 radiation Effects 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 8
- 239000012809 cooling fluid Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
この発明は、たとえば半導体素子などの電子部品からなる発熱体を冷却する液冷式冷却装置に関する。 The present invention relates to a liquid-cooling type cooling device that cools a heating element made of an electronic component such as a semiconductor element, for example.
たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）を冷却する液冷式冷却装置として、本出願人は、先に、内部に冷却液流路が設けられており、かつ頂壁に開口が形成されているケーシングと、ケーシングの前記開口内に配置されてケーシングに固定され放熱器とを備えており、放熱器が、第１面が冷却液流路に臨ませられるとともに第２面に発熱体取付部が設けられている放熱基板と、放熱基板の第１面に、冷却液流路内に突出するとともに長手方向を冷却液流路での冷却液の流れ方向に向けた状態で間隔をおいて一体に設けられた複数の放熱フィンとよりなり、放熱器の放熱基板の第１面およびすべての放熱フィンの表面が犠牲腐食層で覆われ、すべての放熱フィンの先端とケーシングの底壁との間に隙間が存在している液冷式冷却装置を提案した(特許文献１参照)。 For example, as a liquid-cooled cooling device for cooling a power device (semiconductor element) such as an IGBT (Insulated Gate Bipolar Transistor) used in a power conversion device mounted on an electric car, a hybrid car, a train, etc. First, a cooling liquid flow path is provided inside, and a casing having an opening formed on the top wall, and a radiator disposed within the opening of the casing and fixed to the casing are provided. The heat sink projects into the coolant flow path to the heat dissipation board whose first surface faces the coolant flow path and the heat source mounting portion is provided on the second face, and the first face of the heat dissipation board. A plurality of heat dissipating fins integrally provided at intervals with the longitudinal direction directed to the flow direction of the coolant in the coolant flow path, the first surface of the heat dissipating substrate of the radiator and all the heat dissipating fins of Surface is covered with a sacrificial corrosion layer was proposed liquid-cooling type cooling device a gap is present between all of the heat radiating fin tip and the casing of the bottom wall (see Patent Document 1).
特許文献１記載の液冷式冷却装置によれば、冷却液流路内を流れる冷却液に水が含まれる場合であっても、全ピンフィンの表面が犠牲腐食層で覆われているので、冷却液による放熱基板およびピンフィンの腐食を防止することができる。
According to the liquid cooling type cooling device described in
しかしながら、特許文献１記載の液冷式冷却装置のすべてのピンフィンの先端とケーシングの底壁との間に隙間が存在していて、すべてのピンフィンの先端がケーシングの底壁に接合されていないので、使用状況によっては液冷式冷却装置のケーシングの耐圧性が不足するおそれがある。
However, since there is a gap between the tips of all the pin fins of the liquid cooling type cooling device described in
さらに、放熱器の放熱基板の発熱体取付部に発熱体を取り付ける際に、発熱体の位置決め作業が面倒である。 Furthermore, when attaching the heat generating body to the heat generating body mounting portion of the heat dissipation substrate of the heat dissipator, the work of positioning the heat generating body is troublesome.
この発明の目的は、上記問題を解決し、ケーシングの耐圧性を向上しうるとともに、放熱基板の発熱体取付部に発熱体を取り付ける際の発熱体の位置決め作業が簡単である液冷式冷却装置を提供することにある。 It is an object of the present invention to solve the above problems and improve the pressure resistance of the casing, and to simplify the positioning operation of the heat generating body when attaching the heat generating body to the heat generating body mounting portion of the heat dissipation substrate. To provide.
本発明は、上記目的を達成するために以下の態様からなる。 The present invention comprises the following aspects in order to achieve the above object.
1)内部に冷却液流路が設けられており、かつ頂壁および底壁のうちのいずれか一方の壁に開口が形成されているケーシングと、ケーシング内に配置された放熱器とを備えた液冷式冷却装置であって、
放熱器が、ケーシングの開口よりも大きく、かつ第１面が冷却液流路に臨ませられるとともに第２面に発熱体を取り付ける発熱体取付部が設けられている放熱基板と、放熱基板の第１面に、冷却液流路内に突出するように一体に設けられた複数の放熱フィンとよりなり、放熱器の放熱基板が、ケーシングの頂壁および底壁のうちの開口が形成された第１壁の内側に当該開口を塞ぐように配置され、放熱基板の第２面の周縁部がケーシングの前記第１壁の内面における開口の周囲の部分にろう付されるとともに、第２面の発熱体取付部が開口を通してケーシング外に露出しており、全放熱フィンのうちの少なくとも一部の放熱フィンの先端部が、ケーシングの頂壁および底壁のうち開口が形成されていない第２壁の内面にろう付されている液冷式冷却装置。
1) A casing provided with a coolant flow passage inside and an opening formed in any one of the top wall and the bottom wall, and a radiator disposed in the casing A liquid cooling type cooling device,
A radiator substrate having a radiator larger than the opening of the casing and having a first surface facing the coolant flow passage and a heater mounting portion for mounting the heater on the second surface; A plurality of heat dissipating fins integrally provided so as to project into the coolant flow path on one side, wherein the heat dissipating substrate of the heat dissipator is provided with an opening of the top wall and the bottom wall of the casing. It is arranged inside one wall so as to close the opening, and the peripheral portion of the second surface of the heat dissipation substrate is brazed to a portion around the opening in the inner surface of the first wall of the casing and heat generation of the second surface The body attachment portion is exposed to the outside of the casing through the opening, and the tip of the radiation fin of at least a part of all the radiation fins is the second wall of the top wall and the bottom wall of the casing where the opening is not formed. Liquid cooling brazed to the inside Cooling equipment.
2)放熱器が、純度９９％以上のアルミニウムからなる上記1)記載の液冷式冷却装置。 2) The liquid cooling type cooling device according to the above 1), wherein the radiator is made of aluminum having a purity of 99% or more.
3)全放熱フィンの先端部が、前記第２壁の内面にろう付されている上記1)または2)記載の液冷式冷却装置。 3) The liquid-cooling type cooling device according to the above 1) or 2), wherein the tips of all the radiation fins are brazed to the inner surface of the second wall.
4)全放熱フィンのうちの一部の放熱フィンの先端部のみが、前記第２壁の内面にろう付されている上記1)または2)記載の液冷式冷却装置。 4) The liquid-cooling type cooling device according to the above 1) or 2), wherein only a tip portion of a part of all the heat dissipating fins is brazed to the inner surface of the second wall.
5)放熱器がアルミニウム押出形材製であり、放熱基板の第１面に、複数の板状放熱フィンが、冷却液流路内に突出するとともに長手方向を冷却液流路での冷却液の流れ方向に向けた状態で間隔をおいて一体に設けられている上記1)または2)記載の液冷式冷却装置。 5) The radiator is made of an extruded aluminum material, and on the first surface of the heat dissipation substrate, a plurality of plate-like heat dissipation fins project into the coolant flow channel and the longitudinal direction of the coolant flow in the coolant flow channel The liquid-cooling type cooling device according to the above 1) or 2), wherein the liquid cooling type cooling device is integrally provided at intervals in a flow direction.
6)全放熱フィンの先端部が、前記第２壁の内面にろう付されている上記5)記載の液冷式冷却装置。 6) The liquid-cooling type cooling device according to 5), wherein tips of all the radiation fins are brazed to an inner surface of the second wall.
7)全放熱フィンのうちの一部の放熱フィンの先端部のみが、前記第２壁の内面にろう付されており、先端部が前記第２壁の内面にろう付された放熱フィンと、先端部が前記第２壁から離隔した放熱フィンとが交互に並んで存在している上記5)または6)記載の液冷式冷却装置。 7) A radiation fin in which only the tip end portion of a part of all the radiation fins is brazed to the inner surface of the second wall, and the tip end is brazed to the inner surface of the second wall; The liquid-cooling type cooling device according to the above 5) or 6), wherein heat radiation fins whose tip end portions are separated from the second wall are alternately arranged.
8)放熱器の放熱フィンの両側面が、放熱基板の第１面と直角をなしている上記5)〜7)のうちのいずれかに記載の液冷式冷却装置。 8) The liquid cooling type cooling device according to any one of the above 5) to 7), wherein both side surfaces of the heat dissipating fins of the heat sink are perpendicular to the first surface of the heat dissipating substrate.
9)放熱器の放熱フィンの放熱基板からの突出高さが３〜１２ｍｍ、放熱フィンの肉厚が０．３〜１．２ｍｍ、放熱フィンどうしのピッチが０．９〜２．２ｍｍである上記5)〜8)のうちのいずれかに記載の液冷式冷却装置。 9) The protrusion height of the heat dissipation fins from the heat dissipation substrate is 3 to 12 mm, the thickness of the heat dissipation fins is 0.3 to 1.2 mm, and the pitch between the heat dissipation fins is 0.9 to 2.2 mm 5) The liquid-cooling type cooling device in any one of-8).
上記1)〜9)の液冷式冷却装置によれば、放熱器が、ケーシングの開口よりも大きく、かつ第１面が冷却液流路に臨ませられるとともに第２面に発熱体を取り付ける発熱体取付部が設けられている放熱基板と、放熱基板の第１面に、冷却液流路内に突出するように一体に設けられた複数の放熱フィンとよりなり、放熱器の放熱基板が、ケーシングの頂壁および底壁のうちの開口が形成された第１壁の内側に当該開口を塞ぐように配置され、放熱基板の第２面の周縁部がケーシングの前記第１壁の内面における開口の周囲の部分にろう付されるとともに、第２面の発熱体取付部が開口を通してケーシング外に露出しているので、放熱基板の第２面の発熱体取付部が開口を通してケーシング外に露出している部分は、第１壁の外面よりも凹み、発熱体取付部と第１壁の外面との間には、発熱体取付部を取り囲むように段部が存在する。したがって、発熱体を発熱体取付部に取り付ける際に、前記段部を利用することが可能となり、発熱体の位置決め作業が容易になる。 According to the liquid-cooling type cooling device of the above 1) to 9), the radiator is larger than the opening of the casing, and the heat generation for attaching the heat generating body to the second surface while the first surface faces the coolant flow channel A heat dissipation substrate provided with the body attachment portion, and a plurality of heat dissipation fins integrally provided on the first surface of the heat dissipation substrate so as to project into the coolant flow path, and the heat dissipation substrate of the radiator is The casing is disposed so as to close the opening on the inside of the first wall formed with the opening of the top wall and the bottom wall of the casing, and the peripheral portion of the second surface of the heat dissipation substrate is an opening in the inner surface of the first wall of the casing And the heat generating body mounting portion on the second surface is exposed to the outside of the casing through the opening, so that the heat generating body mounting portion on the second surface of the heat dissipation substrate is exposed to the outside of the casing through the opening. Part is recessed from the outer surface of the first wall, and the heating element A step is present between the mounting portion and the outer surface of the first wall so as to surround the heating element mounting portion. Therefore, when attaching a heat generating body to a heat generating body attaching part, it becomes possible to utilize the said step part and the positioning operation | work of a heat generating body becomes easy.
また、全放熱フィンのうちの少なくとも一部の放熱フィンの先端部が、ケーシングの頂壁および底壁のうち開口が形成されていない第２壁の内面にろう付されているので、液冷式冷却装置のケーシングの耐圧性が向上する。 In addition, since the tips of the heat dissipating fins of at least a part of all the heat dissipating fins are brazed to the inner surface of the second wall having no opening in the top wall and the bottom wall of the casing, the liquid cooling type The pressure resistance of the casing of the cooling device is improved.
さらに、ケーシングの頂壁および底壁のうち開口が形成されている第１壁の肉厚を、熱伝導性を考慮することなく厚くすることが可能になるので、第１壁の少なくとも一部分を外方に突出させ、この外方突出部を利用して液冷式冷却装置を電気自動車、ハイブリッド自動車などに取り付けたり、あるいはカバーを取り付けたりすることが可能になる。 Furthermore, it is possible to increase the thickness of the first wall of the top and bottom walls of the casing in which the opening is formed without considering the thermal conductivity, so that at least a portion of the first wall is outside It is possible to make the liquid-cooling type cooling device attach to an electric car, a hybrid car or the like, or to attach a cover, by using the outward projecting portion.
上記2)の液冷式冷却装置によれば、放熱器の熱伝導率が高くなり、放熱性能が向上する。 According to the liquid-cooling type cooling device of the above 2), the heat conductivity of the radiator is increased, and the heat radiation performance is improved.
上記3)の液冷式冷却装置によれば、液冷式冷却装置のケーシングの耐圧性が効果的に向上する。 According to the liquid-cooling type cooling device of the above 3), the pressure resistance of the casing of the liquid-cooling type cooling device is effectively improved.
上記4)の液冷式冷却装置によれば、液冷式冷却装置の強度を適正に調整することができ、ケーシングの頂壁および底壁のうちの開口が形成された第１壁の平面度を向上させることができる。 According to the liquid-cooling type cooling device of the above 4), the strength of the liquid-cooling type cooling device can be properly adjusted, and the flatness of the first wall in which the opening of the top wall and the bottom wall of the casing is formed Can be improved.
上記5)の液冷式冷却装置によれば、放熱器がアルミニウム押出形材製であるので、放熱基板の肉厚を特許文献１記載の液冷式冷却装置の放熱器の放熱基板よりも薄肉にすることができる。したがって、放熱基板の第２面の発熱体取付部に取り付けられた発熱体から発せられる熱が、放熱基板および放熱フィンを経て冷却液流路内を流れる冷却液へ伝わる際の熱伝導性が向上する。特許文献１記載の液冷式冷却装置の放熱器は、芯材の片面が犠牲腐食槽で覆われたクラッド材に鍛造加工を施すことにより製造されているので、放熱基板の薄肉化には限度があって比較的厚肉になり、その結果放熱基板の第２面の発熱体取付部に取り付けられた発熱体から発せられる熱が、放熱基板および放熱フィンを経て冷却液流路内を流れる冷却液へ伝わる際の熱伝導性が不十分になるおそれがある。
According to the liquid-cooling type cooling device of the above 5), since the heat sink is made of an aluminum extruded member, the thickness of the heat-radiating substrate is thinner than that of the heat-radiating substrate of the liquid-cooling type cooling device described in
上記6)の液冷式冷却装置によれば、液冷式冷却装置のケーシングの耐圧性が効果的に向上する。 According to the liquid-cooling type cooling device of the above 6), the pressure resistance of the casing of the liquid-cooling type cooling device is effectively improved.
上記7)の液冷式冷却装置によれば、液冷式冷却装置の強度を適正に調整することができ、ケーシングの頂壁および底壁のうちの開口が形成された第１壁の平面度を向上させることができる。 According to the liquid cooling type cooling device of the above 7), the strength of the liquid cooling type cooling device can be properly adjusted, and the flatness of the first wall in which the opening of the top wall and the bottom wall of the casing is formed Can be improved.
上記8)の液冷式冷却装置によれば、放熱器の隣り合う放熱フィン間の間隔を小さくすることが可能になって、単位面積あたりの放熱フィンの数が増加する。したがって、放熱性能が向上する。 According to the liquid-cooling type cooling device of the above 8), it is possible to reduce the distance between the adjacent radiation fins of the radiator, and the number of radiation fins per unit area increases. Therefore, the heat dissipation performance is improved.
上記9)の製造装置によれば、製造される放熱器の放熱性能の低下を抑制した上で小型化を図ることができる。 According to the manufacturing apparatus of said 9), while suppressing the fall of the thermal radiation performance of the manufactured radiator, size reduction can be achieved.
以下、この発明の実施形態を、図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term "aluminum" includes aluminum alloys in addition to pure aluminum.
図１〜図４はこの発明の液冷式冷却装置を示す。 1 to 4 show a liquid cooling type cooling device of the present invention.
なお、以下の液冷式冷却装置に関する説明において、冷却液の流れ方向下流側(図２および図３の右側）を前、これと反対側を後といい、前から後を見た際の左右(図４の左右)を左右というものとする。また、図２および図４の上下を上下というものとする。 In the following description regarding the liquid cooling type cooling device, the downstream side of the flow direction of the cooling fluid (right side in FIGS. 2 and 3) is referred to as the front, and the opposite side is referred to as the back. Let (left and right in FIG. 4) be left and right. Moreover, the upper and lower sides of FIG. 2 and FIG. 4 shall be called upper and lower.
図１〜図４において、液冷式冷却装置(1)は、頂壁(2a)、底壁(2b)および周壁(2c)を有するアルミニウム製ケーシング(2)と、ケーシング(2)に固定されたアルミニウム押出形材製放熱器(3)とを備えている。 In FIGS. 1 to 4, the liquid cooling type cooling device (1) is fixed to an aluminum casing (2) having a top wall (2a), a bottom wall (2b) and a peripheral wall (2c), and a casing (2) And a radiator (3) made of an extruded aluminum material.
ケーシング(2)は、底壁(2b)および周壁(2c)を構成する上方に開口した箱状のアルミニウム製下構成部材(4)と、頂壁(2a)を構成する板状のアルミニウム製上構成部材(5)とよりなり、上構成部材(5)の周縁寄りの一定幅部分が、下構成部材(4)の周壁(2c)を構成する部分の上端に一体に設けられた外向きフランジ(4a)の上面にろう付されている。ケーシング(2)内には、冷却液がケーシング(2)の長手方向の片側（後側）から他側（前側）に流れる冷却液流路(6)と、冷却液流路(6)よりも上流側（後側）に位置しかつ冷却液が流入する入口ヘッダ部(7)と、冷却液流路(6)よりも下流側（前側）に位置しかつ冷却液が流出する出口ヘッダ部(8)とが設けられている。ケーシング(2)の底壁(2b)の後側部分の左右方向中央部に、入口ヘッダ部(7)に通じる冷却液入口(9)が設けられ、ケーシング(2)の底壁(2b)の前側部分の左右方向中央部に、出口ヘッダ部(8)に通じる冷却液出口(11)が設けられている。ケーシング(2)の冷却液入口(9)に、入口ヘッダ部(7)内に冷却液を送り込むアルミニウム製入口パイプ(12)の端部が挿入されて底壁(2b)にろう付され、冷却液出口(11)に、出口ヘッダ部(8)内から冷却液を送り出すアルミニウム製出口パイプ(13)の端部が挿入されて底壁(2b)にろう付されている。 The casing (2) is a box-like aluminum lower component (4) which is open at the upper side which constitutes the bottom wall (2b) and the peripheral wall (2c), and a plate-like aluminum upper which constitutes the top wall (2a) An outward flange integrally formed of the component (5), wherein the constant width portion near the periphery of the upper component (5) is integrally provided on the upper end of the portion constituting the peripheral wall (2c) of the lower component (4) It is brazed to the upper surface of (4a). In the casing (2), the coolant flow path (6) in which the coolant flows from one side (rear side) to the other side (front side) in the longitudinal direction of the casing (2), and the coolant flow path (6) An inlet header portion (7) located on the upstream side (rear side) where the coolant flows in, and an outlet header portion located on the downstream side (front side) of the coolant flow path (6) and where the coolant flows out 8) are provided. A cooling fluid inlet (9) communicating with the inlet header portion (7) is provided at the center in the left-right direction of the rear side portion of the bottom wall (2b) of the casing (2), and the bottom wall (2b) of the casing (2) A coolant outlet (11) communicating with the outlet header (8) is provided at the center in the left-right direction of the front part. The end of the aluminum inlet pipe (12) for feeding the coolant into the inlet header portion (7) is inserted into the coolant inlet (9) of the casing (2) and brazed to the bottom wall (2b) to cool it The end of an aluminum outlet pipe (13) for delivering the coolant from the outlet header (8) is inserted into the liquid outlet (11) and brazed to the bottom wall (2b).
ケーシング(2)の頂壁(2a)および底壁(2b)のうちのいずれか一方の壁、ここでは頂壁(2a)に、放熱器(3)をケーシング(2)に固定するのに利用される方形の開口(14)が、冷却液流路(6)に臨むように形成されている。 Used to secure the radiator (3) to the casing (2) on one of the top wall (2a) and bottom wall (2b) of the casing (2), here the top wall (2a) A rectangular opening (14) is formed to face the coolant channel (6).
放熱器(3)は、ケーシング(2)の開口(14)よりも大きい方形板状であり、かつ第１面(15a)(下面)が冷却液流路(6)に臨ませられるとともに第２面(15b)(上面)に発熱体(P)を取り付ける発熱体取付部(F)が設けられた放熱基板(15)と、放熱基板(15)の第１面(15a)に放熱基板(15)に対して立ち上がり状、ここでは垂下状となり、かつ左右方向に間隔をおいて並列状となるように一体に設けられた前後方向にのびる複数の垂直板状放熱フィン(16)とよりなる。 The radiator (3) has a rectangular plate shape larger than the opening (14) of the casing (2), and the first surface (15a) (lower surface) faces the coolant flow channel (6) while the second A heat dissipation board (15) provided with a heat generating body mounting portion (F) for attaching a heat generating body (P) to the surface (15b) (upper surface), and a heat dissipation board (15) on the first surface (15a) of the heat dissipation board (15) And a plurality of vertical plate-shaped heat dissipating fins (16) extending in the front-rear direction integrally provided in parallel so as to be drooping in this case and in parallel with a space in the left-right direction.
放熱器(3)はケーシング(2)内に、放熱基板(15)が開口(14)を塞ぐように頂壁の内側に位置するように配置されており、放熱基板(15)の第２面(15b)の周縁寄りの一定幅部分が、ケーシング(2)の頂壁(2a)下面における開口(14)の周りの部分にろう付され、放熱基板(15)の発熱体取付部(F)が開口(14)を通してケーシング(2)外に露出している。したがって、放熱基板(15)の第２面(15b)の発熱体取付部(F)が開口(14)を通してケーシング(2)外に露出している部分は、頂壁(2a)の外面よりも凹み、発熱体取付部(F)と頂壁(2a)の外面との間には、発熱体取付部(F)を取り囲むように段部(17)が存在する。また、放熱器(3)の放熱フィン(16)が冷却液流路(6)内に突出し、全放熱フィン(16)の先端はケーシング(2)の底壁(2b)内面にろう付されている。 The radiator (3) is disposed in the casing (2) so that the heat dissipation substrate (15) is positioned inside the top wall so as to close the opening (14), and the second surface of the heat dissipation substrate (15) The constant width portion near the periphery of (15b) is brazed to the portion around the opening (14) in the lower surface of the top wall (2a) of the casing (2), and the heat generating body mounting portion (F) of the heat dissipation substrate (15) Is exposed outside the casing (2) through the opening (14). Therefore, the portion of the heat sink attachment portion (F) on the second surface (15b) of the heat dissipation substrate (15) exposed outside the casing (2) through the opening (14) is more than the outer surface of the top wall (2a) A recess (17) is provided between the heating element attachment (F) and the outer surface of the top wall (2a) so as to surround the heating element attachment (F). Also, the heat dissipating fins (16) of the radiator (3) project into the coolant flow path (6), and the tips of all the heat dissipating fins (16) are brazed to the inner surface of the bottom wall (2b) of the casing (2) There is.
放熱器(3)は、純度９９％以上のアルミニウムで形成されていることが好ましい。また、放熱フィン(16)の左右両側面が、放熱ベース(15)の放熱フィン(16)が設けられた第１面(15a)と直角をなしていることが好ましい。さらに、放熱フィン(16)における放熱ベース(15)の第１面(15a)からの突出高さが３〜１２ｍｍ、放熱フィン(16)の肉厚が０．３〜１．２ｍｍ、隣り合う２つの放熱フィン(16)どうしの厚み方向中心間の間隔であるピッチが０．９〜２．２ｍｍであることが好ましい。いずれの場合も、放熱器(3)の放熱性能が向上し、放熱器(3)の小型軽量化を図ることが可能になる。 The radiator (3) is preferably formed of aluminum having a purity of 99% or more. Further, it is preferable that the left and right side surfaces of the heat dissipating fins (16) be perpendicular to the first surface (15a) on which the heat dissipating fins (16) of the heat dissipating base (15) are provided. Furthermore, the protrusion height of the heat dissipating fin (16) from the first surface (15a) of the heat dissipating base (15) is 3 to 12 mm, the thickness of the heat dissipating fin (16) is 0.3 to 1.2 mm, It is preferable that the pitch which is the space | interval between the thickness direction centers of two radiation fin (16) is 0.9-2.2 mm. In either case, the heat radiation performance of the radiator (3) is improved, and the size and weight of the radiator (3) can be reduced.
発熱体(P)は、ＩＧＢＴなどのパワーデバイスや、ＩＧＢＴが制御回路と一体化されて同一パッケージに収納されたＩＧＢＴモジュールや、ＩＧＢＴモジュールにさらに保護回路が一体化されて同一パッケージに収納されたインテリジェントパワーモジュールなどからなり、図示しない電気絶縁部材を介して放熱器(3)の放熱基板(15)の第２面(15b)に取り付けられている。 The heating element (P) is a power device such as an IGBT, an IGBT module in which the IGBT is integrated with the control circuit and housed in the same package, and a protective circuit is further integrated in the IGBT module and housed in the same package It consists of an intelligent power module etc., and is attached to the 2nd surface (15b) of the thermal radiation board | substrate (15) of a radiator (3) through the electrical insulation member which is not shown in figure.
上記構成の液冷式冷却装置(1)において、入口パイプ(12)から冷却液入口(9)を通って入口ヘッダ部(7)内に流入した冷却液は、冷却液流路(6)に配置された放熱器(3)の隣り合う放熱フィン(16)間、および前後両端の放熱フィン(16)と周壁(2c)との間を通って前方に流れる。冷却液流路(6)を前方に流れた冷却液は、出口ヘッダ部(8)内に入り、冷却液出口(11)を通って出口パイプ(13)に送り出される。発熱体(P)から発せられる熱は、放熱器(3)の放熱基板(15)および放熱フィン(16)を経て冷却液流路(6)内を流れる冷却液に放熱され、発熱体(P)が冷却される。 In the liquid cooling type cooler (1) of the above configuration, the coolant flowing from the inlet pipe (12) through the coolant inlet (9) into the inlet header portion (7) is sent to the coolant flow passage (6). It flows forward through between the adjacent radiation fins (16) of the disposed radiator (3), and between the radiation fins (16) on the front and rear ends and the peripheral wall (2c). The coolant that has flowed forward through the coolant flow path (6) enters the outlet header portion (8) and is delivered to the outlet pipe (13) through the coolant outlet (11). The heat generated from the heat generating body (P) is dissipated to the cooling fluid flowing in the coolant flow path (6) through the heat dissipation substrate (15) and the heat dissipating fins (16) of the radiator (3). ) Is cooled.
上述した実施形態においては、ケーシング(2)の頂壁(2a)に開口(14)が形成されているが、これとは逆に、ケーシング(2)の底壁(2b)に開口(14)が形成され、
ていてもよい。この場合、放熱器(3)は、上述した実施形態とは上下逆向きとなるようにケーシング(2)内に配置され、放熱基板(15)の第２面(15b)の周縁寄りの一定幅部分が、ケーシング(2)の底壁(2b)上面における開口(14)の周りの部分にろう付され、放熱フィン(16)が冷却液流路(6)内に突出し、少なくとも一部の放熱フィン(16)の先端がケーシング(2)の頂壁(2a)内面にろう付される。
In the embodiment described above, the opening (14) is formed in the top wall (2a) of the casing (2). Conversely, the opening (14) is formed in the bottom wall (2b) of the casing (2) Is formed,
It may be In this case, the radiator (3) is disposed in the casing (2) so as to be upside down from the embodiment described above, and has a constant width near the periphery of the second surface (15b) of the heat dissipation substrate (15) A portion is brazed to a portion around the opening (14) in the top surface of the bottom wall (2b) of the casing (2), the radiation fin (16) protrudes into the coolant flow passage (6), and at least a portion of the heat radiation The tip of the fin (16) is brazed to the inner surface of the top wall (2a) of the casing (2).
図５はこの発明の液冷式冷却装置(1)に用いられる放熱器の変形例を示す。 FIG. 5 shows a modified example of the radiator used in the liquid cooling type cooling device (1) of the present invention.
図５に示す放熱器(20)の場合、放熱基板(15)の第１面(15a)には、放熱基板(15)に対して立ち上がり状、ここでは垂下状となり、かつ高さの異なる２種類の垂直板状放熱フィン(21)(22)が、左右方向に交互に間隔をおきかつ並列状となるように一体に設けられている。高い放熱フィン(21)の先端はケーシング(2)の底壁(2b)内面にろう付され、低い放熱フィン(22)の先端はケーシング(2)の底壁(2b)内面から離隔している。 In the case of the radiator (20) shown in FIG. 5, the first surface (15a) of the heat dissipation substrate (15) has a rising shape with respect to the heat dissipation substrate (15). Kinds of vertical plate-shaped heat radiation fins (21) (22) are integrally provided so as to be alternately spaced in parallel in the left-right direction. The tip of the high radiation fin (21) is brazed to the inner surface of the bottom wall (2b) of the casing (2), and the tip of the low radiation fin (22) is separated from the inner surface of the bottom wall (2b) of the casing (2) .
上述した実施形態の放熱器(3)および変形例の放熱器(20)において、放熱フィン(16)(21)(22)は垂直板状であるが、これに限定されるものではなく、ピン状であってもよい。 In the heat sink (3) of the embodiment described above and the heat sink (20) of the modified example, the heat radiation fins (16) (21) (22) are in the form of vertical plates, but are not limited thereto. It may be a letter.
この発明による液冷式冷却装置は、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴなどのパワーデバイスを冷却するのに好適に用いられる。 The liquid-cooling type cooling device according to the present invention is suitably used to cool a power device such as an IGBT used in a power conversion device mounted on an electric car, a hybrid car, a train or the like.
(1)：液冷式冷却装置
(2)：ケーシング
(2a)：頂壁
(2b)：底壁
(3)(20)：放熱器
(6)：冷却液流路
(14)：開口
(15)：放熱基板
(15a)：第１面
(15b)：第２面
(16)(21)(22)：放熱フィン
(1): Liquid-cooled cooler
(2): Casing
(2a): top wall
(2b): Bottom wall
(3) (20): Radiator
(6): Coolant flow path
(14): Opening
(15): Heat dissipation board
(15a): First surface
(15b): Second surface
(16) (21) (22): Heat dissipation fin
Claims (9)
放熱器が、ケーシングの開口よりも大きく、かつ第１面が冷却液流路に臨ませられるとともに第２面に発熱体を取り付ける発熱体取付部が設けられている放熱基板と、放熱基板の第１面に、冷却液流路内に突出するように一体に設けられた複数の放熱フィンとよりなり、放熱器の放熱基板が、ケーシングの頂壁および底壁のうちの開口が形成された第１壁の内側に当該開口を塞ぐように配置され、放熱基板の第２面の周縁部がケーシングの前記第１壁の内面における開口の周囲の部分にろう付されるとともに、第２面の発熱体取付部が開口を通してケーシング外に露出しており、全放熱フィンのうちの少なくとも一部の放熱フィンの先端部が、ケーシングの頂壁および底壁のうち開口が形成されていない第２壁の内面にろう付されている液冷式冷却装置。 Liquid cooling provided with a casing provided with a coolant flow passage inside and an opening formed in any one of the top wall and the bottom wall, and a radiator disposed in the casing Type cooling device,
A radiator substrate having a radiator larger than the opening of the casing and having a first surface facing the coolant flow passage and a heater mounting portion for mounting the heater on the second surface; A plurality of heat dissipating fins integrally provided so as to project into the coolant flow path on one side, wherein the heat dissipating substrate of the heat dissipator is provided with an opening of the top wall and the bottom wall of the casing. It is arranged inside one wall so as to close the opening, and the peripheral portion of the second surface of the heat dissipation substrate is brazed to a portion around the opening in the inner surface of the first wall of the casing and heat generation of the second surface The body attachment portion is exposed to the outside of the casing through the opening, and the tip of the radiation fin of at least a part of all the radiation fins is the second wall of the top wall and the bottom wall of the casing where the opening is not formed. Liquid cooling brazed to the inside Cooling equipment.
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| JP7159617B2 (en) * | 2018-05-25 | 2022-10-25 | 富士電機株式会社 | Cooling device, semiconductor module, vehicle and manufacturing method |
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