JP6469521B2 - Liquid cooling system - Google Patents
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- JP6469521B2 JP6469521B2 JP2015101761A JP2015101761A JP6469521B2 JP 6469521 B2 JP6469521 B2 JP 6469521B2 JP 2015101761 A JP2015101761 A JP 2015101761A JP 2015101761 A JP2015101761 A JP 2015101761A JP 6469521 B2 JP6469521 B2 JP 6469521B2
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- 238000001816 cooling Methods 0.000 title claims description 59
- 239000007788 liquid Substances 0.000 title claims description 25
- 239000002826 coolant Substances 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 20
- 239000012809 cooling fluid Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
この発明は、たとえば半導体素子などの電子部品からなる発熱体を冷却する液冷式冷却装置に関する。 The present invention relates to a liquid cooling type cooling device that cools a heating element made of an electronic component such as a semiconductor element.
この明細書および特許請求の範囲において、図２の上下を上下というもとのとする。 In this specification and claims, the top and bottom of FIG.
たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）を冷却する液冷式冷却装置として、本出願人は、先に、内部に冷却液流路が設けられており、かつ頂壁に開口が形成されているケーシングと、ケーシングの前記開口内に配置されてケーシングに固定され、かつ第１面が冷却液流路に臨ませられるとともに第２面が発熱体取付面となされている放熱基板、および放熱基板の第１面に冷却液流路内に突出するように一体に設けられた複数のピンフィンからなる放熱器とを備えており、放熱器の放熱基板の第１面およびすべてのピンフィンの表面が犠牲腐食層で覆われ、すべてのピンフィンの先端とケーシングの底壁との間に隙間が存在している液冷式冷却装置を提案した(特許文献１参照)。 For example, as a liquid-cooled cooling device for cooling a power device (semiconductor element) such as an IGBT (Insulated Gate Bipolar Transistor) used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train, etc., First, a coolant flow path is provided in the interior and an opening is formed in the top wall; the casing is disposed in the opening of the casing and fixed to the casing; and the first surface has a coolant flow. A heat dissipation board composed of a heat dissipation board facing the road and having a second surface serving as a heating element mounting surface, and a plurality of pin fins integrally provided on the first surface of the heat dissipation board so as to protrude into the coolant flow path The first surface of the heat dissipation board of the radiator and the surface of all the pin fins are covered with a sacrificial corrosion layer, and between the tips of all the pin fins and the bottom wall of the casing. During proposed a liquid-cooling type cooling device is present (see Patent Document 1).
特許文献１記載の液冷式冷却装置によれば、冷却液流路内を流れる冷却液に水が含まれる場合であっても、全ピンフィンの表面が犠牲腐食層で覆われているので、冷却液による放熱基板およびピンフィンの腐食を防止することができる。
According to the liquid cooling type cooling device described in
しかしながら、特許文献１記載の液冷式冷却装置のすべてのピンフィンの先端とケーシングの底壁との間に隙間が存在していて、すべてのピンフィンの先端がケーシングの底壁に接合されていないので、使用状況によっては液冷式冷却装置のケーシングの耐圧性が不足するおそれがある。
However, there are gaps between the tip ends of all the pin fins and the bottom wall of the casing of the liquid cooling type cooling device described in
この発明の目的は、上記問題を解決し、ケーシングの耐圧性を向上しうる液冷式冷却装置を提供することにある。 An object of the present invention is to provide a liquid cooling type cooling device that can solve the above-described problems and improve the pressure resistance of the casing.
本発明は、上記目的を達成するために以下の態様からなる。 In order to achieve the above object, the present invention comprises the following aspects.
1)内部に冷却液流路が設けられており、かつ頂壁および底壁のうちのいずれか一方の壁に開口が形成されているケーシングと、ケーシングの前記開口内に配置されてケーシングに固定され、かつ第１面が冷却液流路に臨ませられるとともに第２面が発熱体取付面となされている放熱基板、および放熱基板の第１面に冷却液流路内に突出するように一体に設けられた複数のピンフィンからなる放熱器とを備えた液冷式冷却装置であって、
すべてのピンフィンのうちの一部のピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されている液冷式冷却装置。
1) A casing in which a coolant flow path is provided and an opening is formed in one of the top wall and the bottom wall, and the casing is disposed in the opening of the casing and fixed to the casing And the heat dissipation substrate having the first surface facing the coolant flow path and the second surface serving as a heating element mounting surface, and the first surface of the heat dissipation substrate so as to protrude into the coolant flow path. A liquid-cooling type cooling device provided with a radiator composed of a plurality of pin fins,
A liquid-cooling type cooling apparatus in which the tips of some of the pin fins are joined to the inner surface of the other wall of the top and bottom walls of the casing where no opening is formed.
2)発熱体を放熱器の第２面に取り付けるのに用いられる発熱体取付用めねじ穴が、放熱基板の第２面から一部のピンフィンの先端側に向かって形成されている上記1)記載の液冷式冷却装置。 2) The heating element mounting female screw hole used to attach the heating element to the second surface of the radiator is formed from the second surface of the heat dissipation board toward the tip side of some pin fins 1) The liquid cooling type cooling apparatus as described.
3)発熱体取付用めねじ穴が形成されているピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されている上記2)記載の液冷式冷却装置。 3) The liquid according to 2) above, wherein the tip end of the pin fin in which the female screw hole for heating element is formed is joined to the inner surface of the other wall of the top wall and bottom wall of the casing where no opening is formed. Cold cooling device.
4)先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されているピンフィンの長手方向と直交する方向の断面積が、先端が、前記他方の壁の内面に接合されていないピンフィンの長手方向と直交する方向の断面積よりも大きくなっている上記1)〜3)のうちのいずれかに記載の液冷式冷却装置。 4) The cross-sectional area in the direction perpendicular to the longitudinal direction of the pin fin joined to the inner surface of the other wall of the top wall and the bottom wall of the casing where no opening is formed is the tip is the other wall. The liquid cooling type cooling device according to any one of the above 1) to 3), which is larger than a cross-sectional area in a direction perpendicular to the longitudinal direction of the pin fins not joined to the inner surface of the pin fin.
上記1)〜3)の液冷式冷却装置によれば、すべてのピンフィンのうちの一部のピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されているので、液冷式冷却装置のケーシングの耐圧性が向上する。 According to the liquid cooling type cooling device of 1) to 3) above, the tip of some of the pin fins is the inner surface of the other wall of the top and bottom walls of the casing where no opening is formed. Therefore, the pressure resistance of the casing of the liquid cooling type cooling device is improved.
上記2)の液冷式冷却装置によれば、めねじ穴を利用することによって、発熱体を比較的簡単に放熱器の放熱基板の第２面に取り付けることができる。 According to the liquid cooling type cooling device of the above 2), the heating element can be attached to the second surface of the heat dissipation board of the radiator relatively easily by using the female screw hole.
上記3)の液冷式冷却装置によれば、ケーシング内部に圧力が負荷された時の強度を向上させることができる。 According to the liquid cooling type cooling apparatus of 3) above, the strength when pressure is applied to the inside of the casing can be improved.
上記4)の液冷式冷却装置によれば、液冷式冷却装置の耐圧性が効果的に向上する。特に、上記3)のように、発熱体取付用めねじ穴が形成されているピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されている場合には、その断面積が大きいと、めねじ穴を容易に形成することができる。 According to the liquid cooling type cooling device of 4), the pressure resistance of the liquid cooling type cooling device is effectively improved. In particular, as described in 3) above, the tip end of the pin fin in which the female screw hole for mounting the heating element is formed is joined to the inner surface of the other wall of the casing where the opening is not formed. If the cross-sectional area is large, the female screw hole can be easily formed.
以下、この発明の実施形態を、図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term “aluminum” includes aluminum alloys in addition to pure aluminum.
また、以下の説明において、図２の左右を左右といい、図３の上下方向を前後方向というものとする。 In the following description, the left and right in FIG. 2 are referred to as left and right, and the up and down direction in FIG. 3 is referred to as the front and rear direction.
図１〜図３は液冷式冷却装置を示す。 1 to 3 show a liquid cooling type cooling device.
図１〜図３において、液冷式冷却装置(1)は、頂壁(2a)、底壁(2b)および周壁(2c)を有するアルミニウム製ケーシング(2)と、ケーシング(2)に固定されたアルミニウム製放熱器(3)とを備えている。 1 to 3, the liquid cooling type cooling device (1) is fixed to an aluminum casing (2) having a top wall (2a), a bottom wall (2b) and a peripheral wall (2c), and the casing (2). And an aluminum radiator (3).
ケーシング(2)は、頂壁(2a)および周壁(2c)を構成する下方に開口した箱状のアルミニウム製上構成部材(4)と、上構成部材(4)の周壁(2c)を構成する部分内に嵌め入れられて上構成部材(4)にろう付され、かつ底壁(2b)を構成する板状のアルミニウム製下構成部材(5)とよりなる。ケーシング(2)内には、冷却液がケーシング(2)の長手方向の片側（左側）から他側（右側）に流れる冷却液流路(6)と、冷却液流路(6)よりも上流側（左側）に位置しかつ冷却液が流入する入口ヘッダ部(7)と、冷却液流路(6)よりも下流側（右側）に位置しかつ冷却液が流出する出口ヘッダ部(8)とが設けられている。ケーシング(2)の底壁(2b)の左側部分の前後方向中央部に、入口ヘッダ部(7)に通じる冷却液入口(9)が設けられ、ケーシング(2)の底壁(2b)の右側部分の前後方向中央部に、出口ヘッダ部(8)に通じる冷却液出口(11)が設けられている。ケーシング(2)の冷却液入口(9)に、入口ヘッダ部(7)内に冷却液を送り込むアルミニウム製入口パイプ(12)が接続され、冷却液出口(11)に、出口ヘッダ部(8)内から冷却液を送り出すアルミニウム製出口パイプ(13)が接続されている。 The casing (2) constitutes a box-shaped aluminum upper component member (4) opened downward and constituting the top wall (2a) and the peripheral wall (2c), and a peripheral wall (2c) of the upper component member (4). It consists of a plate-like aluminum lower component member (5) that is fitted into the portion and brazed to the upper component member (4) and constitutes the bottom wall (2b). In the casing (2), the coolant flows from one side (left side) in the longitudinal direction of the casing (2) to the other side (right side), and upstream from the coolant channel (6). The inlet header part (7) located on the side (left side) and into which the coolant flows, and the outlet header part (8) located on the downstream side (right side) from the coolant channel (6) and from which the coolant flows out And are provided. A coolant inlet (9) leading to the inlet header (7) is provided at the center in the front-rear direction of the left side of the bottom wall (2b) of the casing (2), and the right side of the bottom wall (2b) of the casing (2). A coolant outlet (11) communicating with the outlet header (8) is provided at the center in the front-rear direction of the portion. An aluminum inlet pipe (12) for feeding the coolant into the inlet header (7) is connected to the coolant inlet (9) of the casing (2), and the outlet header (8) is connected to the coolant outlet (11). An aluminum outlet pipe (13) for feeding the coolant from the inside is connected.
ケーシング(2)の頂壁(2a)および底壁(2b)のうちのいずれか一方の壁、ここでは頂壁(2a)に、放熱器(3)をケーシング(2)に固定するのに利用される開口(14)が、冷却液流路(6)に臨むように成されている。 Used to fix the radiator (3) to the casing (2) on either the top wall (2a) or the bottom wall (2b) of the casing (2), here the top wall (2a) The opening (14) to be formed faces the coolant channel (6).
放熱器(3)は、ケーシング(2)の開口(14)内に配置されてケーシング(2)の頂壁(2a)にろう付され、かつ第１面(15a)(下面)が冷却液流路(6)に臨ませられるとともに第２面(15b)(上面)が発熱体(P)を取り付ける発熱体取付面となされたアルミニウム放熱基板(15)と、放熱基板(15)の第１面(15a)に冷却液流路(6)内に突出するように一体に設けられた複数のピンフィン(16)(16A)とからなる。ここでは、すべてのピンフィン(16)(16A)の横断面形状は円形である。なお、ピンフィン(16)(16A)の横断面形状は円形に限定されるものではない。 The radiator (3) is disposed in the opening (14) of the casing (2), brazed to the top wall (2a) of the casing (2), and the first surface (15a) (lower surface) is a coolant flow. An aluminum heat dissipation board (15) facing the path (6) and having the second surface (15b) (upper surface) as a heating element mounting surface for mounting the heating element (P), and the first surface of the heat dissipation board (15) (15a) includes a plurality of pin fins (16) and (16A) integrally provided so as to protrude into the coolant channel (6). Here, the cross-sectional shape of all the pin fins (16) (16A) is circular. The cross-sectional shape of the pin fins (16) (16A) is not limited to a circle.
放熱器(3)のすべてのピンフィン(16)(16A)のうちの一部のピンフィン(16A)、ここでは放熱基板(15)の中央部に位置する１つのピンフィン(16A)は、当該ピンフィン(16A)を除いた他の残りのピンフィン(16)の長さよりも長くなっている。以下、長尺のピンフィン(16A)を長尺ピンフィン(16A)といい、他の短いピンフィン(16)を短尺ピンフィン(16)というものとする。長尺ピンフィン(16A)の先端は、ケーシング(2)の頂壁(2a)および底壁(2b)のうち開口(14)が形成されていない他方の壁、ここでは底壁(2b)内面まで至り、底壁(2b)内面にろう付されている。 Among the pin fins (16) and (16A) of the radiator (3), a part of the pin fins (16A), here, one pin fin (16A) located at the center of the heat dissipation board (15) is the pin fin ( It is longer than the length of the remaining pin fins (16) except 16A). Hereinafter, the long pin fin (16A) is referred to as a long pin fin (16A), and the other short pin fin (16) is referred to as a short pin fin (16). The tip of the long pin fin (16A) extends from the top wall (2a) and bottom wall (2b) of the casing (2) to the other wall where the opening (14) is not formed, here the inner surface of the bottom wall (2b) Finally, it is brazed to the inner surface of the bottom wall (2b).
放熱器(3)の長尺ピンフィン(16A)の長手方向と直交する方向の断面積(横断面積)は、短尺ピンフィン(16)の横断面積よりも大きくなっており、発熱体(P)を放熱器(3)の第２面(15b)に取り付けるのに用いられる有底の発熱体取付用めねじ穴(17)が、放熱基板(15)の第２面(15b)から長尺ピンフィン(16A)の先端に向かって先端近傍に至るように形成されている。 The cross-sectional area (cross-sectional area) in the direction perpendicular to the longitudinal direction of the long pin fin (16A) of the radiator (3) is larger than the cross-sectional area of the short pin fin (16), and the heat generating element (P) is dissipated. The bottomed heating element mounting female screw hole (17) used for mounting on the second surface (15b) of the heat sink (3) extends from the second surface (15b) of the heat dissipation substrate (15) to the long pin fin (16A ) Toward the tip of the).
発熱体(P)は、ＩＧＢＴなどのパワーデバイスや、ＩＧＢＴが制御回路と一体化されて同一パッケージに収納されたＩＧＢＴモジュールや、ＩＧＢＴモジュールにさらに保護回路が一体化されて同一パッケージに収納されたインテリジェントパワーモジュールなどからなり、電気絶縁部材(I)を介して放熱器(3)の放熱基板(15)の第２面(15b)に配置され、発熱体(P)および電気絶縁部材(I)を貫通して放熱基板(15)の発熱体取付用めねじ穴(17)にねじ嵌められたおねじ(18)により、放熱基板(15)の第２面(15b)に固定されている。 The heating element (P) is a power device such as an IGBT, an IGBT module in which the IGBT is integrated with a control circuit and stored in the same package, or a protection circuit integrated with the IGBT module and stored in the same package. It consists of an intelligent power module, etc., and is arranged on the second surface (15b) of the heat dissipation board (15) of the radiator (3) via the electric insulation member (I), and the heating element (P) and the electric insulation member (I) And is fixed to the second surface (15b) of the heat dissipation board (15) by a male screw (18) screwed into a female screw hole (17) for mounting the heat generating body of the heat dissipation board (15).
上記構成の液冷式冷却装置(1)において、入口パイプ(12)から冷却液入口(9)を通って入口ヘッダ部(7)内に流入した冷却液は、冷却液流路(6)に配置された放熱器(3)のピンフィン(16)(16A)間を通って右方に流れる。冷却液流路(6)を右方に流れた冷却液は、出口ヘッダ部(8)内に入り、冷却液出口(11)を通って出口パイプ(13)に送り出される。発熱体(P)から発せられる熱は、絶縁部材(I)、放熱器(3)の放熱基板(15)およびピンフィン(16)(16A)を経て冷却液流路(6)内を流れる冷却液に放熱され、発熱体(P)が冷却される。 In the liquid cooling type cooling device (1) having the above-described configuration, the coolant flowing from the inlet pipe (12) through the coolant inlet (9) into the inlet header (7) enters the coolant channel (6). It flows to the right through the pin fins (16) and (16A) of the radiator (3). The coolant that has flowed rightward through the coolant channel (6) enters the outlet header (8), passes through the coolant outlet (11), and is sent out to the outlet pipe (13). The heat generated from the heating element (P) is the coolant flowing in the coolant channel (6) through the insulating member (I), the heat sink (15) of the radiator (3), and the pin fins (16) (16A). The heat generating body (P) is cooled.
上述した実施形態においては、１つの長尺ピンフィン(16A)の先端がケーシング(2)の頂壁(2a)および底壁(2b)のうち開口(14)が形成されていない他方の底壁(2b)にろう付されているが、先端が底壁(2b)にろう付されるピンフィンの数は適宜変更可能である。ただし、多数のピンフィンの先端を開口(14)が形成されていない他方の壁にろう付するには、ピンフィンの高さの管理が困難であるから、その上限は１００程度が好ましい。 In the above-described embodiment, the tip of one long pin fin (16A) is the other bottom wall where the opening (14) is not formed among the top wall (2a) and the bottom wall (2b) of the casing (2) ( Although it is brazed to 2b), the number of pin fins whose tip is brazed to the bottom wall (2b) can be changed as appropriate. However, since it is difficult to manage the height of the pin fins to braze the tips of many pin fins to the other wall where the opening (14) is not formed, the upper limit is preferably about 100.
また、上述した実施形態において、長尺ピンフィン(16A)の横断面積が短尺ピンフィン(16)の横断面積よりも大きくなっており、長尺ピンフィン(16A)に発熱体取付用めねじ穴(17)が形成されているが、これに限定されるものではなく、少なくとも１つの短尺ピンフィン(16)の横断面積を大きくし、当該短尺ピンフィン(16)に発熱体取付用めねじ穴(17)が形成されていてもよい。 Further, in the above-described embodiment, the cross-sectional area of the long pin fin (16A) is larger than the cross-sectional area of the short pin fin (16), and the female pin hole (17) for attaching a heating element to the long pin fin (16A) However, the present invention is not limited to this. The cross-sectional area of at least one short pin fin (16) is increased, and a female screw hole (17) for mounting a heating element is formed in the short pin fin (16). May be.
さらに、上述した実施形態においては、ケーシングの頂壁に開口(14)が形成されているが、これとは逆に、ケーシングの底壁に開口(14)が形成されていてもよい。 Furthermore, in the embodiment described above, the opening (14) is formed in the top wall of the casing, but conversely, the opening (14) may be formed in the bottom wall of the casing.
この発明による液冷式冷却装置は、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴなどのパワーデバイスを冷却するのに好適に用いられる。 The liquid cooling type cooling device according to the present invention is suitably used for cooling a power device such as an IGBT used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train or the like.
(1)：液冷式冷却装置
(2)：ケーシング
(2a)：頂壁
(2b)：底壁
(3)：放熱器
(6)：冷却液流路
(14)：開口
(15)：放熱基板
(15a)：第１面
(15b)：第２面
(16)(16A)：ピンフィン
(17)：発熱体取付用めねじ穴
(1): Liquid cooling type cooling device
(2): Casing
(2a): Top wall
(2b): Bottom wall
(3): Heatsink
(6): Coolant flow path
(14): Opening
(15): Heat dissipation board
(15a): First side
(15b): Second side
(16) (16A): Pin fin
(17): Female thread hole for heating element mounting
Claims (2)
すべてのピンフィンのうちの一部のピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されており、
発熱体を放熱基板の第２面に取り付けるのに用いられる発熱体取付用めねじ穴が、放熱基板の第２面から一部のピンフィンの先端側に向かって形成されており、
発熱体取付用めねじ穴が形成されているピンフィンの先端が、ケーシングの頂壁および底壁のうち開口が形成されていない他方の壁の内面に接合されている液冷式冷却装置。 A cooling fluid flow path is provided therein, and a casing in which one of the top wall and the bottom wall is formed with an opening, and is disposed in the opening of the casing and fixed to the casing. In addition, the first surface is exposed to the coolant flow path and the second surface is a heating element mounting surface, and the first surface of the heat dissipation board is integrally provided so as to protrude into the coolant flow path. A liquid-cooling type cooling device comprising a plurality of pin fin radiators,
The tips of some of the pin fins are joined to the inner surface of the other wall of the top and bottom walls of the casing where no opening is formed ,
A heating element mounting female screw hole used to attach the heating element to the second surface of the heat dissipation board is formed from the second surface of the heat dissipation board toward the tip side of some pin fins,
A liquid-cooling type cooling device in which a tip end of a pin fin in which a female element mounting hole is formed is joined to the inner surface of the other wall of the top wall and bottom wall of the casing where no opening is formed .
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