JP5926928B2 - Power semiconductor module cooling device - Google Patents

Power semiconductor module cooling device Download PDF

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JP5926928B2
JP5926928B2 JP2011242242A JP2011242242A JP5926928B2 JP 5926928 B2 JP5926928 B2 JP 5926928B2 JP 2011242242 A JP2011242242 A JP 2011242242A JP 2011242242 A JP2011242242 A JP 2011242242A JP 5926928 B2 JP5926928 B2 JP 5926928B2
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cooler
plate
male screw
power semiconductor
semiconductor module
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JP2013098468A (en
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誠二 松島
誠二 松島
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Showa Denko KK
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Showa Denko KK
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Priority to JP2011242242A priority Critical patent/JP5926928B2/en
Priority to US13/661,594 priority patent/US20130112369A1/en
Priority to KR1020120123352A priority patent/KR20130049739A/en
Priority to CN2012104323614A priority patent/CN103094228A/en
Priority to CN2012205751802U priority patent/CN202977400U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

この発明は、たとえばＩＧＢＴモジュールやインテリジェントパワーモジュールなどの半導体素子およびその制御回路が一体化されたパワー半導体モジュールを冷却するパワー半導体モジュール冷却装置に関する。   The present invention relates to a power semiconductor module cooling device for cooling a power semiconductor module in which semiconductor elements such as IGBT modules and intelligent power modules and their control circuits are integrated.

たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）は、近年では、制御回路と一体化されて同一パッケージに収納されたＩＧＢＴモジュール（以下、ＩＧＢＴＭと称する）や、ＩＧＢＴＭにさらに保護回路が一体化されて同一パッケージに収納されたインテリジェントパワーモジュール（以下、ＩＰＭと称する）として用いられることも多くなっている。   For example, in recent years, power devices (semiconductor elements) such as IGBTs (Insulated Gate Bipolar Transistors) used in power conversion devices mounted on electric cars, hybrid cars, trains, etc. have been integrated with control circuits into the same package. It is often used as a stored IGBT module (hereinafter referred to as IGBTTM) or an intelligent power module (hereinafter referred to as IPM) in which a protection circuit is further integrated with the IGBTTM and stored in the same package.

従来、ＩＧＢＴＭを冷却する冷却装置として、板状の外壁部材で構成されるとともに、内部にＩＧＢＴＭから発せられる熱を受けて沸騰する冷媒を収容した冷媒槽と、冷媒槽の上部に冷媒槽と連通して設けられ、かつ冷媒槽から上昇してくる気相冷媒を凝縮液化する放熱器とを備え、冷媒槽の相対向する外壁部材間に、めねじ穴が形成されたスペーサが介在されており、ＩＧＢＴＭが、ＩＧＢＴＭに設けられたねじ挿通穴に通されたおねじ部品を、外壁部材に貫通させてスペーサのめねじ穴内にねじ嵌めることによって、外壁部材の外面に取り付けられたものが知られている（特許文献１参照）。   Conventionally, as a cooling device for cooling the IGBTTM, it is composed of a plate-like outer wall member, and a refrigerant tank containing therein a refrigerant that is boiled by receiving heat generated from the IGBTTM, and a refrigerant tank communicated with the upper part of the refrigerant tank. And a radiator for condensing and liquefying the gas-phase refrigerant rising from the refrigerant tank, and a spacer having a female screw hole is interposed between the opposing outer wall members of the refrigerant tank. , IGBTTM is attached to the outer surface of the outer wall member by threading the male threaded part passed through the screw insertion hole provided in the IGBTTM into the female threaded hole of the spacer through the outer wall member. (See Patent Document 1).

しかしながら、特許文献１記載の冷却装置においては、おねじ部品が冷媒槽の外壁部材を貫通しているので、冷媒が洩れるおそれがある。   However, in the cooling device described in Patent Document 1, since the male screw component penetrates the outer wall member of the refrigerant tank, the refrigerant may leak.

一方、モジュール化されていないＩＧＢＴなどのパワーデバイスを冷却する冷却装置としては、放熱基板および放熱基板の片面に一体に形成された放熱フィンからなる冷却器と、セラミック板、セラミック板の片面に設けられた多孔質金属層および多孔質金属層の表面を覆う金属層からなる絶縁回路基板とからなり、絶縁回路基板のセラミック板における多孔質層が設けられた側とは反対側の面が、高熱伝導性グリースを介して冷却器の放熱基板の他面に載せられ、セラミック板の周縁部が、冷却器の放熱基板に固定された治具を介して放熱基板に取り付けられ、治具が、治具に設けられたねじ挿通穴に通されたおねじ部品を冷却器の放熱基板に形成されためねじ穴にねじ嵌めることにより固定されており、絶縁回路基板の金属層上に複数のパワーデバイスがはんだ付けされるようになされたものが知られている（特許文献２参照）。   On the other hand, as a cooling device for cooling power devices such as IGBTs that are not modularized, a cooling device composed of a heat radiation board and a heat radiation fin integrally formed on one surface of the heat radiation board, and a ceramic plate, provided on one surface of the ceramic plate A porous metal layer and an insulating circuit board comprising a metal layer covering the surface of the porous metal layer, and the surface of the insulating circuit board opposite to the side on which the porous layer is provided is heated The conductive plate is placed on the other surface of the heat dissipation board of the cooler, and the peripheral edge of the ceramic plate is attached to the heat dissipation board via a jig fixed to the heat dissipation board of the cooler. Since the male screw parts passed through the screw insertion holes provided on the fixture are formed on the heat dissipation board of the cooler, they are fixed by screwing them into the screw holes. Lower devices are known which are adapted to be soldered (see Patent Document 2).

しかしながら、特許文献２記載の冷却装置では、冷却器が、放熱基板および放熱基板の片面に一体に形成された放熱フィンからなり、放熱フィン間を流れる空気によって、絶縁回路基板の金属層上にはんだ付けされた複数のパワーデバイスが冷却されるので、冷却効率が不足する。   However, in the cooling device described in Patent Document 2, the cooler includes a heat radiation board and heat radiation fins integrally formed on one side of the heat radiation board, and the air flowing between the heat radiation fins is soldered onto the metal layer of the insulating circuit board. Since a plurality of attached power devices are cooled, the cooling efficiency is insufficient.

さらに、モジュール化されていないＩＧＢＴなどのパワーデバイスを、特許文献２記載の冷却装置に比べて効率良く冷却する冷却装置として、頂壁、底壁および周壁からなりかつ内部に冷却流体通路を有するケーシングと、ケーシングの流体通路内に配置されたコルゲート状の放熱フィンと、ケーシングに接続されてケーシング内に冷却液を流入させる流入パイプと、ケーシングに接続されてケーシング内から冷却液を流出させる流出パイプと、ケーシングの頂壁外面に接合された絶縁回路基板とを備えており、絶縁回路基板上にパワーデバイスが接合されるようになされたものが知られている（特許文献３参照）。   Further, as a cooling device that efficiently cools power devices such as IGBTs that are not modularized as compared with the cooling device described in Patent Document 2, a casing that includes a top wall, a bottom wall, and a peripheral wall and has a cooling fluid passage inside. A corrugated heat dissipating fin arranged in the fluid passage of the casing, an inflow pipe connected to the casing and allowing the coolant to flow into the casing, and an outflow pipe connected to the casing and allowing the coolant to flow out from the casing And an insulated circuit board joined to the outer surface of the top wall of the casing, and a power device is known to be joined on the insulated circuit board (see Patent Document 3).

ところで、特許文献３記載の冷却装置をＩＧＢＴＭやＩＰＭなどのパワー半導体モジュールの冷却に適用する場合、ケーシングの頂壁外面に絶縁回路基板を接合する代わりに、特許文献３記載の冷却装置のケーシング内に特許文献１記載のスペーサを配置し、パワー半導体モジュールに設けられたねじ挿通穴に通されたおねじ部品を、ケーシングの頂壁に貫通させてスペーサのめねじ穴にねじ嵌めることにより治具をケーシングに固定し、固定された治具を介して、パワー半導体モジュールをケーシングに取り付けることになる。しかしながら、この場合、おねじ部品がケーシングの頂壁を貫通するので、冷却液体が洩れるおそれがある。また、スペーサがケーシング内での冷却液体のスムーズの流れを妨げることになって、冷却効率が低下するおそれがある。さらに、スペーサをフィンが存在する部分に配置することができないので、パワー半導体モジュールの設置の自由度が低くなる。   By the way, when the cooling device described in Patent Document 3 is applied to cooling power semiconductor modules such as IGBTM and IPM, the inside of the casing of the cooling device described in Patent Document 3 is used instead of joining an insulating circuit board to the outer surface of the top wall of the casing. The spacer described in Patent Document 1 is placed on the power semiconductor module, and a male screw part passed through a screw insertion hole provided in the power semiconductor module is passed through the top wall of the casing and screwed into the female screw hole of the spacer. Is fixed to the casing, and the power semiconductor module is attached to the casing through the fixed jig. However, in this case, since the male screw component penetrates the top wall of the casing, the cooling liquid may leak. In addition, the spacers hinder the smooth flow of the cooling liquid in the casing, which may reduce the cooling efficiency. Furthermore, since the spacer cannot be disposed in the portion where the fin exists, the degree of freedom in installing the power semiconductor module is reduced.

特許文献３記載の冷却装置をパワー半導体モジュールの冷却に適用した場合の上述した問題を解決するためには、ケーシングの頂壁の肉厚を大きくし、ケーシングの頂壁に、おねじ部品をねじ嵌めるめねじ穴を形成することが考えられるが、この場合、パワー半導体モジュールからケーシング内を流れる冷却流体への熱伝導性の低下に起因して、冷却効率が不足するおそれがある。   In order to solve the above-mentioned problem when the cooling device described in Patent Document 3 is applied to cooling of a power semiconductor module, the thickness of the top wall of the casing is increased, and a male screw component is screwed onto the top wall of the casing. Although it is conceivable to form a female screw hole to be fitted, in this case, the cooling efficiency may be insufficient due to a decrease in thermal conductivity from the power semiconductor module to the cooling fluid flowing in the casing.

特開平８−１８６２０９号公報JP-A-8-186209 特開２００３−２９８００９号公報JP 2003-298209 A 特開２００９−１９５９１２号公報JP 2009-195912 A

この発明の目的は、上記問題を解決し、冷却流体の洩れを防止しうるとともに、冷却効率の低下を抑制しうるパワー半導体モジュール冷却装置を提供することにある。   An object of the present invention is to provide a power semiconductor module cooling device that can solve the above-described problems, prevent leakage of cooling fluid, and suppress a decrease in cooling efficiency.

本発明は、上記目的を達成するために以下の態様からなる。   In order to achieve the above object, the present invention comprises the following aspects.

1)内部に冷却流体通路が設けられた冷却器と、冷却器に固定されかつパワー半導体モジュールを冷却器に取り付ける取付器とを備えており、冷却器における内面が冷却流体通路に臨んだ壁部分の外面全体のうち少なくとも一部に、パワー半導体モジュールを搭載する搭載部が設けられ、取付器が、熱伝導性材料からなりかつ冷却器の搭載部に沿わされてろう材層により接合された伝熱板と、板状頭部およびおねじ部からなり、かつ板状頭部が冷却器側に位置するとともにおねじ部が伝熱板を貫通しているおねじ部品とよりなり、おねじ部品の板状頭部が、伝熱板の冷却器側の面に形成された凹所内に、当該面から冷却器側に突出せずかつおねじ部の軸線回りの回転が阻止されるように嵌め入れられているパワー半導体モジュール冷却装置。 1) A wall portion having a cooler having a cooling fluid passage therein and an attachment device fixed to the cooler and attaching the power semiconductor module to the cooler, the inner surface of the cooler facing the cooling fluid passage at least a portion of the entire outer surface, the mounting portion is provided for mounting a power semiconductor module, heat of the mounting device is comprised of thermally conductive material and is along the mounting portion of the cooler are joined by brazing material layer It consists of a heat plate and a male screw part that consists of a plate-shaped head and a male screw part, the plate-shaped head part is located on the cooler side, and the male screw part penetrates the heat transfer plate. The plate head is inserted into a recess formed on the cooler side surface of the heat transfer plate so that it does not protrude from the surface to the cooler side and rotation around the axis of the external thread is prevented. Power semiconductor module cooling device.

2)おねじ部品の板状頭部が伝熱板よりも硬質の材料で形成されており、おねじ部品の板状頭部が、伝熱板の冷却器側の面に圧入されることによって、伝熱板の冷却器側の面に凹所が形成されるとともに、当該凹所内に、おねじ部品の板状頭部が、当該面から冷却器側に突出せずかつおねじ部の軸線回りの回転が阻止されるように嵌め入れられている上記1)記載のパワー半導体モジュール冷却装置。   2) The plate-shaped head of the male screw component is made of a material harder than the heat transfer plate, and the plate-shaped head of the male screw component is pressed into the cooler side surface of the heat transfer plate. A recess is formed on the surface of the heat transfer plate on the cooler side, and the plate-shaped head portion of the male screw component does not protrude from the surface to the cooler side and is around the axis of the male screw portion. The power semiconductor module cooling device according to 1), which is fitted so as to prevent rotation of the power semiconductor module.

3)おねじ部品の板状頭部におけるおねじ部側を向いた面に、複数の突起が一体に形成されている上記1)または2)記載のパワー半導体モジュール冷却装置。   3) The power semiconductor module cooling device according to 1) or 2) above, wherein a plurality of protrusions are integrally formed on a surface of the plate-like head of the male screw component facing the male screw portion side.

4)冷却器が、内部に冷却流体通路を有するケーシングを備えており、ケーシング内の冷却流体通路に放熱フィンが配置され、ケーシングの壁部分における内面が冷却流体通路に臨んだ部分の外面全体のうち少なくとも一部に、パワー半導体モジュールを搭載する搭載部が設けられている上記1)〜3)のうちのいずれかに記載のパワー半導体モジュール冷却装置。   4) The cooler is provided with a casing having a cooling fluid passage therein, and heat radiation fins are arranged in the cooling fluid passage in the casing, and the entire outer surface of the portion where the inner surface of the wall portion of the casing faces the cooling fluid passage. 4. The power semiconductor module cooling device according to any one of the above 1) to 3), wherein a mounting portion for mounting the power semiconductor module is provided at least in part.

上記1)〜4)のパワー半導体モジュール冷却装置によれば、内部に冷却流体通路が設けられた冷却器と、冷却器に固定されかつパワー半導体モジュールを冷却器に取り付ける取付器とを備えており、冷却器における内面が冷却流体通路に臨んだ壁部分の外面全体のうち少なくとも一部に、パワー半導体モジュールを搭載する搭載部が設けられ、取付器が、熱伝導性材料からなりかつ冷却器の搭載部に沿わされてろう材層により接合された伝熱板と、板状頭部およびおねじ部からなり、かつ板状頭部が冷却器側に位置するとともにおねじ部が伝熱板を貫通しているおねじ部品とよりなり、おねじ部品の板状頭部が、伝熱板の冷却器側の面に形成された凹所内に、当該面から冷却器側に突出せずかつおねじ部の軸線回りの回転が阻止されるように嵌め入れられているので、取付器のおねじ部品のおねじ部をパワー半導体モジュールに設けられたねじ挿通穴に通し、おねじ部の先端部からナットをねじ嵌めることによってパワー半導体モジュールを取付器に取り付けることが可能になる。したがって、おねじ部品が冷却器の壁部分を貫通していないので、冷却器内からの冷却流体の洩れを防止することができる。さらに、伝熱板は、おねじ部品の板状頭部を嵌め入れる凹所を形成しうる厚みを有しているだけでよいので、特許文献３記載のケーシングにおけるめねじ穴を形成する頂壁に比べて、肉厚を薄くすることが可能になる。したがって、パワー半導体モジュールから冷却器内の冷却流体通路を流れる冷却流体への熱伝導性の低下および熱伝導性の低下に起因する冷却効率の低下を抑制することができる。
According to the power semiconductor module cooling device of the above 1) to 4), it is provided with a cooler provided with a cooling fluid passage inside, and an attachment device fixed to the cooler and attaching the power semiconductor module to the cooler. A mounting portion for mounting the power semiconductor module is provided on at least a part of the entire outer surface of the wall portion where the inner surface of the cooler faces the cooling fluid passage, and the mounter is made of a heat conductive material and It consists of a heat transfer plate along the mounting part joined by a brazing material layer , a plate-shaped head and a male screw, and the plate-shaped head is located on the cooler side and the male screw serves as the heat transfer plate. The plate-shaped head portion of the male screw component does not protrude from the surface to the cooler side and is externally threaded in a recess formed on the cooler side surface of the heat transfer plate. Fitting to prevent rotation around the axis of the part Since the male thread part of the male part of the fixture is passed through the screw insertion hole provided in the power semiconductor module and the nut is screwed from the tip of the male thread part, the power semiconductor module is attached to the fixture. It becomes possible to install. Therefore, since the male screw component does not penetrate the wall portion of the cooler, leakage of the cooling fluid from the cooler can be prevented. Further, the heat transfer plate only needs to have a thickness that can form a recess into which the plate-like head portion of the male screw part is fitted, so that the top wall that forms the female screw hole in the casing described in Patent Document 3 Compared to, it becomes possible to reduce the wall thickness. Therefore, it is possible to suppress a decrease in thermal conductivity from the power semiconductor module to the cooling fluid flowing through the cooling fluid passage in the cooler and a decrease in cooling efficiency due to the decrease in thermal conductivity.

この発明による冷却装置にＩＰＭを取り付けた状態を示す斜視図である。It is a perspective view which shows the state which attached IPM to the cooling device by this invention. 図１のＡ−Ａ線拡大断面図である。It is an AA line expanded sectional view of FIG. 図２の部分拡大図である。FIG. 3 is a partially enlarged view of FIG. 2. 図１の冷却装置を製造する方法において、伝熱板におねじ部品を取り付ける前の状態を示す斜視図である。FIG. 2 is a perspective view showing a state before screw components are attached to a heat transfer plate in the method for manufacturing the cooling device of FIG. 1. おねじ部品の変形例を示す斜視図である。It is a perspective view which shows the modification of a external thread component.

以下、この発明の実施形態を、図面を参照して説明する。この実施形態は、この発明によるパワー半導体モジュール冷却装置をＩＰＭの冷却に適用したものである。   Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the power semiconductor module cooling device according to the present invention is applied to the cooling of the IPM.

なお、以下の説明において、図２の上下、左右を上下、左右といい、図１の右側を前、これと反対側を後というものとする。   In the following description, the top and bottom, left and right in FIG. 2 are referred to as top and bottom, and left and right, and the right side in FIG.

また、以下の説明において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。   In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

図１〜図３はこの発明による冷却装置にＩＰＭを取り付けた状態を示し、図４はこの発明による冷却装置を製造する方法の一工程を示す。   1 to 3 show a state in which the IPM is attached to the cooling device according to the present invention, and FIG. 4 shows one step of the method for manufacturing the cooling device according to the present invention.

図１および図２において、ＩＰＭ冷却装置(1)（パワー半導体モジュール冷却装置）は、冷却器(2)と、冷却器(2)に固定されかつ必要数のＩＰＭ(I)を冷却器(2)に取り付ける取付器(3)とを備えている。   1 and 2, an IPM cooling device (1) (power semiconductor module cooling device) includes a cooler (2) and a required number of IPM (I) fixed to the cooler (2). ) And a fixture (3) to be attached.

冷却器(2)は、内部に冷却流体通路(5)を有するケーシング(4)と、ケーシング(4)内の冷却流体通路(5)に配置されたアルミニウム製放熱フィン(6)と、ケーシング(4)に接続されかつケーシング(4)内に冷却流体を流入させるアルミニウム製入口パイプ(7)と、ケーシング(4)に接続されかつケーシング(4)内から冷却流体を流出させる出口パイプ(8)とを備えている。   The cooler (2) includes a casing (4) having a cooling fluid passage (5) therein, an aluminum radiation fin (6) disposed in the cooling fluid passage (5) in the casing (4), and a casing ( 4) and an aluminum inlet pipe (7) for flowing the cooling fluid into the casing (4), and an outlet pipe (8) connected to the casing (4) and for allowing the cooling fluid to flow out of the casing (4) And.

ケーシング(4)は、頂壁(9)、底壁(11)および周壁(12)からなり、前側縁部の右端部に冷却流体流入部(13)が前方突出状に設けられるとともに、同じく前側縁部の左端部に冷却流体流出部(14)が前方突出状に設けられ、入口パイプ(7)が冷却流体流入部(13)に接続され、出口パイプ(8)が冷却流体流出部(14)に接続されている。ケーシング(4)は、頂壁(9)、ならびに周壁(12)、冷却流体流入部(13)および冷却流体流出部(14)の上半部を構成するアルミニウム製上構成部材(15)と、底壁(11)、ならびに周壁(12)、冷却流体流入部(13)および冷却流体流出部(14)の下半部を構成するアルミニウム製下構成部材(16)とが、相互にろう付されることにより形成されている。ケーシング(4)の右端部に冷却流体流入部(13)に通じる入口ヘッダ部(17)が、ケーシング(4)の前後方向の全長にわたって設けられ、ケーシング(4)の左端部に冷却流体流出部(14)に通じる出口ヘッダ部(18)が、ケーシング(4)の前後方向の全長にわたって設けられている。   The casing (4) is composed of a top wall (9), a bottom wall (11) and a peripheral wall (12), and a cooling fluid inflow portion (13) is provided at the right end portion of the front edge portion so as to protrude forward, and also on the front side. A cooling fluid outflow portion (14) is provided at the left end of the edge so as to protrude forward, the inlet pipe (7) is connected to the cooling fluid inflow portion (13), and the outlet pipe (8) is connected to the cooling fluid outflow portion (14 )It is connected to the. The casing (4) includes a top wall (9), a peripheral wall (12), a cooling fluid inflow portion (13), and an aluminum upper component member (15) constituting the upper half of the cooling fluid outflow portion (14), The bottom wall (11), the peripheral wall (12), the cooling fluid inflow portion (13), and the lower aluminum component (16) constituting the lower half of the cooling fluid outflow portion (14) are brazed to each other. Is formed. An inlet header portion (17) communicating with the cooling fluid inflow portion (13) is provided at the right end portion of the casing (4) over the entire length in the front-rear direction of the casing (4), and a cooling fluid outflow portion is provided at the left end portion of the casing (4). An outlet header portion (18) leading to (14) is provided over the entire length of the casing (4) in the front-rear direction.

ケーシング(4)の冷却流体通路(5)は、周壁(12)の前後両側壁部間でかつ入口ヘッダ部(17)と出口ヘッダ部(18)との間の部分に、冷却流体が右方から左方に流れるように設けられている。放熱フィン(6)は、波頂部(6a)、波底部(6b)および波頂部(6a)と波底部(6b)とを連結する連結部(6c)からなるコルゲート状であり、波頂部(6a)および波底部(6b)が長さ方向を左右方向を向くように冷却流体通路(5)に配置されており、波頂部(6a)がケーシング(4)の頂壁(9)にろう付されるとともに波底部(6b)が同底壁(11)にろう付されている。そして、冷却器(2)のケーシング(4)の頂壁(9)における内面が冷却流体通路(5)に臨んだ部分の外面全体に、ＩＰＭ(I)を搭載する搭載部(19)が設けられている。   The cooling fluid passage (5) of the casing (4) has a cooling fluid to the right between the front and rear side walls of the peripheral wall (12) and between the inlet header (17) and the outlet header (18). It is provided to flow from left to right. The radiating fin (6) has a corrugated shape composed of a wave crest (6a), a wave bottom (6b), and a connecting portion (6c) connecting the wave crest (6a) and the wave bottom (6b). ) And the wave bottom portion (6b) are arranged in the cooling fluid passage (5) so that the length direction is directed in the left-right direction, and the wave crest portion (6a) is brazed to the top wall (9) of the casing (4). The wave bottom (6b) is brazed to the bottom wall (11). A mounting portion (19) for mounting IPM (I) is provided on the entire outer surface of the portion of the top wall (9) of the casing (4) of the cooler (2) where the inner surface faces the cooling fluid passage (5). It has been.

取付器(3)は、アルミニウムや銅（銅合金を含む）などの熱伝導率が１５０〜４５０Ｗ／ｍＫ程度の熱伝導性材料からなり、かつ冷却器(2)のケーシング(4)の頂壁(9)の搭載部(19)に重ね合わされてろう付された伝熱板(21)と、板状頭部(23)およびおねじ部(24)からなり、かつ板状頭部(23)が冷却器(2)側（下側）に位置するようにおねじ部(24)が伝熱板(21)を貫通しているおねじ部品(22)とよりなる。伝熱板(21)を頂壁(9)の搭載部(19)にろう付しているろう材層を(25)で示す。おねじ部品(22)のおねじ部(24)は伝熱板(21)に形成された貫通穴(26)に下方から通されており、板状頭部(23)は、伝熱板(21)の下面(21a)（冷却器(2)側の面）に形成された凹所(28)内に、下面から冷却器(2)側に突出せずかつおねじ部(24)の軸線回りの回転が阻止されるように嵌め入れられている。   The fixture (3) is made of a thermally conductive material having a thermal conductivity of about 150 to 450 W / mK, such as aluminum or copper (including copper alloy), and the top wall of the casing (4) of the cooler (2) The heat transfer plate (21) superposed on the mounting portion (19) of (9) and brazed, and a plate-shaped head (23) and a male screw portion (24), and the plate-shaped head (23) The screw part (24) is composed of a male screw part (22) passing through the heat transfer plate (21) so that is located on the cooler (2) side (lower side). A brazing material layer brazing the heat transfer plate (21) to the mounting portion (19) of the top wall (9) is indicated by (25). The male thread part (24) of the male thread part (22) is passed from below through a through hole (26) formed in the heat transfer plate (21), and the plate head (23) is connected to the heat transfer plate ( In the recess (28) formed in the lower surface (21a) of 21) (surface on the cooler (2) side), it does not protrude from the lower surface to the cooler (2) side and is around the axis of the external thread (24) It is fitted so that rotation of the motor is prevented.

おねじ部品(22)の板状頭部(23)、ここではおねじ部(24)を含んでおねじ部品(22)の全体が、伝熱板(21)よりも硬質の材料、たとえば炭素鋼やステンレス鋼などによって形成されている。図３に示すように、おねじ部品(22)の板状頭部(23)は円形であり、板状頭部(23)の上面（おねじ部(24)側の面）に上方に突出した複数の突起(27)が周方向に間隔をおいて一体に形成されている。おねじ部品(22)としては、たとえばセルジャパン社製のセルスタッド（商品名）が用いられる。そして、おねじ部品(22)の板状頭部(23)が、伝熱板(21)の下面(21a)における貫通穴(26)の周囲の部分に下方から圧入されることによって、伝熱板(21)の下面(21a)に凹所(28)が形成されるとともに、当該凹所(28)内に、おねじ部品(22)の板状頭部(23)が、下面(21a)から冷却器(2)側に突出せずかつおねじ部(24)の軸線回りの回転が阻止されるように嵌め入れられている。おねじ部品(22)の数は、取付器(3)に取り付けるＩＰＭ(I)の数に応じて適宜選択される。   A plate-shaped head part (23) of the male screw part (22), here the male screw part (22) including the male screw part (24) is harder than the heat transfer plate (21), for example, carbon. It is made of steel or stainless steel. As shown in FIG. 3, the plate-like head (23) of the male screw part (22) is circular and protrudes upward on the upper surface (surface on the male screw (24) side) of the plate-like head (23). The plurality of protrusions (27) are integrally formed at intervals in the circumferential direction. As the male thread component (22), for example, Cell Stud (trade name) manufactured by Cell Japan is used. Then, the plate-like head (23) of the male screw component (22) is press-fitted from below into the portion around the through hole (26) in the lower surface (21a) of the heat transfer plate (21), thereby heat transfer. A recess (28) is formed in the lower surface (21a) of the plate (21), and a plate-like head (23) of the male screw component (22) is formed in the lower surface (21a) in the recess (28). Is inserted into the cooler (2) so that it does not protrude to the cooler (2) side and is prevented from rotating around the axis of the external thread (24). The number of male thread parts (22) is appropriately selected according to the number of IPMs (I) attached to the fixture (3).

ＩＰＭ冷却装置(1)における冷却器(2)へのＩＰＭ(I)の取付は、取付器(3)のおねじ部品(22)のおねじ部(24)をＩＰＭ(I)に設けられたねじ挿通穴(29)に下方から通し、おねじ部(24)におけるねじ挿通穴(29)から上方に突出した部分に、上端部側からナット(31)をねじ嵌めることにより行われる。   The IPM (I) is mounted on the cooler (2) in the IPM cooling device (1) by providing the male thread part (24) of the male thread part (22) of the mounter (3) on the IPM (I). It is carried out by screwing a nut (31) from the upper end side into a portion projecting upward from the screw insertion hole (29) in the male screw portion (24) through the screw insertion hole (29) from below.

上記構成のＩＰＭ冷却装置(1)において、入口パイプ(7)から冷却流体流入部(13)を経て入口ヘッダ部(17)内に流入した液体や気体からなる冷却流体は、入口ヘッダ部(17)において前後方向に分流し、放熱フィン(6)の隣り合う連結部(6c)間を通って冷却流体通路(5)内を左方に流れる。冷却流体通路(5)内を左方に流れた冷却流体は、出口ヘッダ部(18)内に入り、冷却流体流出部(14)を経て出口パイプ(8)に流出する。そして、ＩＰＭ(I)から発せられる熱は、伝熱板(21)、ケーシング(4)の頂壁(9)および放熱フィン(6)を経て冷却流体通路(5)内を流れる冷却流体に伝わり、ＩＰＭ(I)が冷却される。   In the IPM cooling device (1) configured as described above, the cooling fluid composed of liquid or gas flowing from the inlet pipe (7) through the cooling fluid inflow portion (13) into the inlet header portion (17) is supplied to the inlet header portion (17 ) In the front-rear direction and flows between the adjacent connecting portions (6c) of the heat dissipating fins (6) to the left in the cooling fluid passage (5). The cooling fluid that has flowed to the left in the cooling fluid passage (5) enters the outlet header (18), and flows out to the outlet pipe (8) through the cooling fluid outlet (14). The heat generated from the IPM (I) is transferred to the cooling fluid flowing in the cooling fluid passage (5) through the heat transfer plate (21), the top wall (9) of the casing (4) and the heat radiation fin (6). , IPM (I) is cooled.

以下、ＩＰＭ冷却装置(1)を製造する方法について、図４を参照して説明する。   Hereinafter, a method of manufacturing the IPM cooling device (1) will be described with reference to FIG.

まず、少なくとも一面のろう材層を有するアルミニウムブレージングシートにプレス加工を施すことによって内面側にろう材層を有するケーシング(4)の上構成部材(15)および下構成部材(16)を形成する。また、必要な大きさの伝熱板(21)に、取り付けるＩＰＭ(I)の数に応じた数の貫通穴(26)を形成しておく。また、アルミニウムベア材または両面にろう材層を有するアルミニウムブレージングシートからなる放熱フィン(6)と、板状頭部(23)およびおねじ部(24)からなるおねじ部品(22)とを用意しておく。   First, the upper component member (15) and the lower component member (16) having the brazing material layer on the inner surface side are formed by pressing an aluminum brazing sheet having at least one brazing material layer. In addition, a number of through holes (26) corresponding to the number of IPMs (I) to be attached are formed in the heat transfer plate (21) having a required size. Also available are heat dissipation fins (6) made of aluminum brazing material or aluminum brazing sheet with brazing filler metal layers on both sides, and male screw parts (22) consisting of a plate-shaped head (23) and male screw part (24). Keep it.

そして、図４に示すように、すべてのおねじ部品(22)のおねじ部(24)を、伝熱板(21)のすべての貫通穴(26)に、冷却器(2)のケーシング(4)にろう付される面(21a)側から通す。ついで、伝熱板(21)を図示しない金型により面(21a)とは反対面側から支持するとともに、伝熱板(21)の貫通穴(26)から突出したおねじ部(24)を前記金型に形成された穴内に挿入する。ついで、全おねじ部品(22)の板状頭部(23)を、図示しないパンチにより金型側に押圧し、突起(27)を含んで板状頭部(23)の全体を伝熱板(21)における冷却器(2)にろう付すべき面(21a)に圧入することによって、当該面に凹所(28)を形成するとともに、当該凹所(28)内に、板状頭部(23)を、当該面から冷却器(2)側に突出せずかつおねじ部(24)の軸線回りの回転が阻止されるように嵌め入れる。   Then, as shown in FIG. 4, the male screw parts (24) of all the male screw parts (22) are inserted into all the through holes (26) of the heat transfer plate (21) to the casing ( Pass through the surface (21a) to be brazed to 4). Next, the heat transfer plate (21) is supported by a mold (not shown) from the side opposite to the surface (21a), and the external thread portion (24) protruding from the through hole (26) of the heat transfer plate (21) is provided. It inserts in the hole formed in the said metal mold | die. Next, the plate head (23) of all the male thread parts (22) is pressed to the mold side by a punch (not shown), and the entire plate head (23) including the protrusion (27) is heated. By pressing into the surface (21a) to be brazed to the cooler (2) in (21), a recess (28) is formed in the surface, and a plate-shaped head ( 23) is inserted so as not to protrude from the surface to the cooler (2) side and to prevent rotation of the external thread portion (24) around the axis.

ついで、上下両構成部材(15)(16)、放熱フィン(6)、入口パイプ(7)および出口パイプ(8)を組み合わせるとともに、上構成部材(15)の頂壁(9)外面にろう材箔を介して取付器(3)の伝熱板(21)を載せる。そして、すべての部品を適当な治具により仮止めして、炉内において所定温度に加熱することにより上下両構成部材(15)(16)どうし、上下両構成部材(15)(16)と放熱フィン(6)、上下両構成部材(15)(16)と入口パイプ(7)および出口パイプ(8)、ならびに上構成部材(15)と伝熱板(21)とを同時にろう付する。こうして、ＩＰＭ冷却装置(1)が製造される。   Next, the upper and lower constituent members (15) and (16), the radiating fin (6), the inlet pipe (7) and the outlet pipe (8) are combined, and the top member (15) of the upper constituent member (15) is brazed on the outer surface Place the heat transfer plate (21) of the fixture (3) through the foil. All parts are temporarily fixed with an appropriate jig and heated to a predetermined temperature in the furnace to dissipate heat between the upper and lower component members (15) and (16) and the upper and lower component members (15) and (16). The fin (6), the upper and lower constituent members (15) and (16), the inlet pipe (7) and the outlet pipe (8), and the upper constituent member (15) and the heat transfer plate (21) are brazed simultaneously. Thus, the IPM cooling device (1) is manufactured.

上述した製造方法において、上構成部材(15)の頂壁(9)と伝熱板(21)との間にろう材箔を介在させることに代えて、上構成部材(15)を両面にろう材層を有するアルミニウムブレージングーシートを用いて形成してもよく、あるいは伝熱板(21)を上構成部材(15)にろう付される面(21a)にろう材層を有するアルミニウムブレージングーシートを用いて形成してもよい。   In the manufacturing method described above, instead of interposing the brazing foil between the top wall (9) of the upper component (15) and the heat transfer plate (21), the upper component (15) is brazed on both sides. The aluminum brazing sheet may be formed using an aluminum brazing sheet having a material layer, or an aluminum brazing sheet having a brazing material layer on a surface (21a) where the heat transfer plate (21) is brazed to the upper component member (15). You may form using.

上記実施形態のおねじ部品(22)において、板状頭部(23)には、必ずしも突起(27)が形成されている必要はない。   In the male thread component (22) of the above-described embodiment, the projection (27) does not necessarily have to be formed on the plate-shaped head (23).

図５は取付器(3)に用いられるおねじ部品の変形例を示す。   FIG. 5 shows a modification of the male thread component used in the fixture (3).

図５に示すおねじ部品(40)の場合、板状頭部(41)は四角形であり、そのおねじ部(24)側の面には突起(27)は形成されていない。このおねじ部品(40)の板状頭部(41)も、上述したおねじ部品(40)の場合と同様にして、伝熱板(21)の冷却器(2)にろう付される面(21a)における貫通穴(26)の周囲の部分に圧入され、これにより伝熱板(21)の冷却器(2)にろう付される面に凹所(28)が形成されるとともに、当該凹所(28)内に、おねじ部品(40)の板状頭部(41)が、当該面(21a)から冷却器(2)側に突出せずかつおねじ部(24)の軸線回りの回転が阻止されるように嵌め入れられる。   In the case of the external thread part (40) shown in FIG. 5, the plate-shaped head part (41) has a quadrangular shape, and no projection (27) is formed on the surface on the external thread part (24) side. The plate head (41) of the male screw part (40) is also brazed to the cooler (2) of the heat transfer plate (21) in the same manner as the male screw part (40) described above. A recess (28) is formed on the surface of the heat transfer plate (21) brazed to the cooler (2) by being press-fitted into a portion around the through hole (26) in (21a), and In the recess (28), the plate-like head (41) of the male thread component (40) does not protrude from the surface (21a) toward the cooler (2) and is around the axis of the male thread (24). It is fitted to prevent rotation.

なお、図５に示す板状頭部(41)のおねじ部(24)側の面に、複数の突起がおねじ部(24)の周方向に間隔をおいて一体に形成されていてもよい。また、図５に示すおねじ部品(40)において、板状頭部(41)の形状は四角形に限定されず、その他の多角形であってもよい。   Note that a plurality of protrusions may be integrally formed on the surface of the male screw portion (24) side of the plate-shaped head portion (41) shown in FIG. 5 at intervals in the circumferential direction of the male screw portion (24). Good. Moreover, in the external thread part (40) shown in FIG. 5, the shape of the plate-shaped head (41) is not limited to a quadrangle, and may be another polygon.

上述した実施形態においては、この発明によるパワー半導体モジュール冷却装置がＩＰＭの冷却に適用されているが、これに限定されるものではなく、ＩＧＢＴＭやその他のパワー半導体モジュールの冷却にも適用可能である。   In the embodiment described above, the power semiconductor module cooling device according to the present invention is applied to the cooling of the IPM, but is not limited to this, and can be applied to the cooling of the IGBTTM and other power semiconductor modules. .

産業上の利用分野Industrial application fields

この発明のパワー半導体モジュール冷却装置は、ＩＧＢＴＭやＩＰＭの冷却に好適に用いられる。   The power semiconductor module cooling device of the present invention is suitably used for cooling IGBTM and IPM.

(1)：ＩＰＭ冷却装置（パワー半導体モジュール冷却装置）
(2)：冷却器
(3)：取付器
(4)：ケーシング
(5)：冷却流体通路
(9)：頂壁
(19)：搭載部
(21)：伝熱板
(22)(40)：おねじ部品
(23)(41)：板状頭部
(24)：おねじ部
(27)：突起
(28)：凹所
(I)：ＩＰＭ (1): IPM cooling device (power semiconductor module cooling device)
(2): Cooler
(3): Mounting device
(4): Casing
(5): Cooling fluid passage
(9): Top wall
(19): Mounted part
(21): Heat transfer plate
(22) (40): Male thread parts
(23) (41): Plate head
(24): Male thread
(27): Projection
(28): Recess
(I): IPM

Claims (4)

内部に冷却流体通路が設けられた冷却器と、冷却器に固定されかつパワー半導体モジュールを冷却器に取り付ける取付器とを備えており、冷却器における内面が冷却流体通路に臨んだ壁部分の外面全体のうち少なくとも一部に、パワー半導体モジュールを搭載する搭載部が設けられ、取付器が、熱伝導性材料からなりかつ冷却器の搭載部に沿わされてろう材層により接合された伝熱板と、板状頭部およびおねじ部からなり、かつ板状頭部が冷却器側に位置するとともにおねじ部が伝熱板を貫通しているおねじ部品とよりなり、おねじ部品の板状頭部が、伝熱板の冷却器側の面に形成された凹所内に、当該面から冷却器側に突出せずかつおねじ部の軸線回りの回転が阻止されるように嵌め入れられているパワー半導体モジュール冷却装置。 A cooler having a cooling fluid passage therein; and an attachment that is fixed to the cooler and attaches the power semiconductor module to the cooler, the outer surface of the wall portion facing the cooling fluid passage. At least a part of the whole is provided with a mounting portion for mounting the power semiconductor module, and the mounting device is made of a heat conductive material and is joined to the mounting portion of the cooler by a brazing material layer. And a male screw component that is composed of a plate-shaped head and a male screw, the plate-shaped head is positioned on the cooler side, and the male screw penetrates the heat transfer plate. The head portion is fitted in a recess formed on the cooler side surface of the heat transfer plate so as not to protrude from the surface to the cooler side and to prevent rotation around the axis of the external thread portion. Power semiconductor module cooling device. おねじ部品の板状頭部が伝熱板よりも硬質の材料で形成されており、おねじ部品の板状頭部が、伝熱板の冷却器側の面に圧入されることによって、伝熱板の冷却器側の面に凹所が形成されるとともに、当該凹所内に、おねじ部品の板状頭部が、当該面から冷却器側に突出せずかつおねじ部の軸線回りの回転が阻止されるように嵌め入れられている請求項１記載のパワー半導体モジュール冷却装置。 The plate head of the male screw component is formed of a material harder than the heat transfer plate, and the plate head of the male screw component is pressed into the cooler side surface of the heat transfer plate, thereby A recess is formed in the surface of the heat plate on the cooler side, and the plate-shaped head of the male screw part does not protrude from the surface to the cooler side and rotates about the axis of the male screw portion. The power semiconductor module cooling device according to claim 1, wherein the power semiconductor module cooling device is fitted in such a manner as to be prevented. おねじ部品の板状頭部におけるおねじ部側を向いた面に、複数の突起が一体に形成されている請求項１または２記載のパワー半導体モジュール冷却装置。 The power semiconductor module cooling device according to claim 1, wherein a plurality of protrusions are integrally formed on a surface of the plate-shaped head portion of the male screw component facing the male screw portion side. 冷却器が、内部に冷却流体通路を有するケーシングを備えており、ケーシング内の冷却流体通路に放熱フィンが配置され、ケーシングの壁部分における内面が冷却流体通路に臨んだ部分の外面全体のうち少なくとも一部に、パワー半導体モジュールを搭載する搭載部が設けられている請求項１〜３のうちのいずれかに記載のパワー半導体モジュール冷却装置。 The cooler includes a casing having a cooling fluid passage therein, and the radiation fins are arranged in the cooling fluid passage in the casing, and at least the entire outer surface of the portion where the inner surface of the wall portion of the casing faces the cooling fluid passage The power semiconductor module cooling device according to claim 1, wherein a mounting portion for mounting the power semiconductor module is provided in part.
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JP2011242242A JP5926928B2 (en) 2011-11-04 2011-11-04 Power semiconductor module cooling device
US13/661,594 US20130112369A1 (en) 2011-11-04 2012-10-26 Power semiconductor module cooling apparatus
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CN2012104323614A CN103094228A (en) 2011-11-04 2012-11-02 Power Semiconductor Module Cooling Apparatus
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