JPH01101700A - Electronic component attaching structure - Google Patents

Abstract

PURPOSE:To allow electronic components to be easily mounted without losing radiating effects by allowing a radiating plate to be integrally in contact with an electronic part in advance and fixing both electronic components and the radiating plate on a printed wiring board when inserting the lead wires into the throughholes of the printed wiring board. CONSTITUTION:An electronic component 1 and a plate 7 are mounted by a flat screw 4 while clamping a radiating plate 2, a lead wire 11 being prearranged. Then by bonding one side of a pressure sensitive adhesive double coated tape 8 on the bottom of the plate 7 to insert the lead wire 11 into a throughhole 6, the electronic component 1, radiating plate 2, and plate 7 that have been integrally formed are fixedly bonded on top of a printed wiring board 3 by the pressure sensitive adhesive double coated tape 8. This not only allows both radiating plate 2 and electronic component 1 to be in good contact, thereby increasing the radiating effects, but also prevents unnecessary forces from being applied to the lead wire 11 and the soldering part, thus facilitating the mounting operation of the electronic component 1 and radiating plate 2 on the printed wiring board 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure for attaching heat-generating electronic components such as ICs to a printed wiring board via a heat sink.

[Conventional technology]

A heat generating component such as an RC is attached to a printed wiring board together with a heat sink made of aluminum or the like.

FIG. 2 is a longitudinal cross-sectional view showing the structure of mounting an electronic component disclosed in, for example, Japanese Utility Model Application No. 61-42899. The electronic component 1 is sandwiched between the heat dissipation plate 2 on
．． It is attached by screws 4 passing through the heat sink 2 and the printed wiring board 3.

A lead wire 11 protruding from the electronic component 1 is inserted into a through hole 6 provided at an end of a conductive pattern 5 formed on the upper surface of the printed wiring board 3 and soldered.

[Problem that the invention seeks to solve]

Incidentally, in recent years, soldering of electronic components, etc. has been automated in order to save labor and cope with mass production.
When automatic soldering is performed using a device or the like, soldering is performed from the back side of the printed wiring board 3 with the lead wires 11 shaped in advance inserted into the through holes 6. After the electronic component l and the heat dissipation vi2 are soldered, the screws 4 are inserted and fixed to the printed wiring board 3.

After soldering the electronic components 1 and the heat sink 2 using the screws 4, if you fix the screws 4 first, you can also solder the nut side part of the screw 4 that protrudes from the back side of the printed wiring board 3. This is to prevent it from becoming unremovable or short-circuiting.

Therefore, when the electronic component 1 is slightly moved left and right or up and down by soldering the lead wire 11 which has poor flexibility, and when the electronic component 1 is fixed by screwing the screw 4, the lead wire 11 is soldered. Unreasonable force is applied to the wires 11 and soldering parts, which may lead to breakage or poor continuity of the lead wires 11. Also, if the heat sink 2 is separate and is installed at the same time as the electronic component 1 is fixed, When soldering the lead wire 11 in advance, sometimes
It is necessary to provide a space between the electronic component 1 and the printed wiring board 3 in which the heat dissipation plate 2 can be inserted, and if the spacing of this space is not appropriate, the lead mechanism 1 may break or conductivity failure may occur. Furthermore, there may arise a problem that the electronic component 1 and the heat sink 2 do not come into good contact with each other, and the heat dissipation effect is impaired.

The present invention has been made in view of the above circumstances, and aims to improve the adhesion between the heat sink and electronic components, improve the heat dissipation effect, and easily connect lead wires and solder without applying unnecessary force to the parts. The purpose of mounting electronic components and heat sinks on printed wiring boards is to provide a possible mounting structure.

[Means for solving problems]

The electronic component mounting structure according to the present invention is such that the electronic component is attached to a printed wiring board via a heat sink, the electronic component is tightly attached to the heat sink, and the closely attached heat sink is adhered to the printed wiring board.

[Effect]

The electronic component and the heat sink are brought into close contact with each other, and the heat sink is attached to the printed wiring board.

[Embodiments of the invention]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof. FIG. 1 is a vertical cross-sectional view showing the structure of mounting an electronic component according to the present invention, in which a heat sink 2 made of, for example, aluminum, has a part of its upper surface in close contact with the lower surface of the electronic component 1, and the lower surface side A part of the plate 7 is also made of metal such as aluminum.
It is attached tightly to the top surface of the Electronic parts 1. The heat dissipation plate 2 and the brake door are integrally fixed by countersunk screws 4 passing through them concentrically, and the 40 heads of the countersunk screws are fitted into countersunk holes formed in the lower surface of the plate 7. and is buried in the plate 7. On the bottom surface of plate 7,
One side of the double-sided adhesive tape 8 is attached, and thereby the electronic component 1. The heat sink 2 and the plate 7 are fixed to the upper surface of the printed wiring board 3.

A lead wire 11 protruding from the electronic component 1 is inserted into a through hole 6 provided at an end of a conductive pattern 5 formed on the upper surface of the printed wiring board 3 and soldered.

Now, I will explain how to install it.

First, the lead wire 11 is shaped in advance, and the electronic component 1 and the plate 7 are fixed with flat head screws 4 with the heat sink 2 sandwiched therebetween. Next, one side of the double-sided adhesive tape 8 is attached to the lower surface of the plate 7, the lead wire 11 is inserted into the through hole 6, and the integrated electronic component 1. The heat sink 2 and the plate 7 are fixed to the upper surface of the printed wiring board 3 using the double-sided adhesive tape 8. After this, the lead wires 11 are soldered from the back side of the printed wiring board 3.

In this embodiment, the heat dissipation plate and the plate are constructed as separate bodies, but instead of this, integrally molded ones may be used, and the material of these is not limited to metal.

Furthermore, an adhesive may be used instead of the double-sided adhesive tape for attachment to the printed wiring board.

〔Effect of the invention〕

As described above, in the structure of mounting the electronic component according to the present invention, the heat sink is integrally attached to the electronic component in advance,
When inserting the lead wires into the through holes of the printed wiring board, the electronic components and heat sink are fixed to the printed wiring board, and then the lead wires are soldered, so the lead wires and soldering do not touch the parts. No unreasonable force is applied at all, and there is no risk of lead wire breakage or poor continuity. Since the heat sink is fixed to the electronic components before soldering, there is no need to prepare a space for inserting the heat sink when soldering as in the conventional method. The parts can be kept in good contact with each other, and the heat dissipation effect is not impaired. Furthermore, since the electronic components and the heat dissipation device are fixed to the printed wiring board with double-sided adhesive tape or the like, there is no need to place one end of the screw, etc. that fixes the electronic component and the heat dissipation board on the back side of the printed wiring board. There is no need to form a through hole in the printed wiring board for this purpose.

As described above, according to the present invention, the present invention has excellent effects such as easy installation and improved reliability of the device.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, and FIG.
FIG. 2 is a vertical cross-sectional view showing the structure of the electronic component mounting according to the present invention, and FIG. 2 is a vertical cross-sectional view of a conventional device. DESCRIPTION OF SYMBOLS 1... Electronic component 2... Heat sink 3... Printed wiring board 4... Flat head screw 7... Plate In the drawings, the same reference numerals are the same, and the text indicates corresponding parts. Agent Masuo Oiwa

Claims (1)

[Claims] 1. In a structure in which an electronic component is attached to a printed wiring board via a heat sink, the heat sink and the electronic component are in close contact with each other, and the heat sink is adhered to the printed wiring board. Mounting structure.