JPH02138465U - - Google Patents
Info
- Publication number
- JPH02138465U JPH02138465U JP4851489U JP4851489U JPH02138465U JP H02138465 U JPH02138465 U JP H02138465U JP 4851489 U JP4851489 U JP 4851489U JP 4851489 U JP4851489 U JP 4851489U JP H02138465 U JPH02138465 U JP H02138465U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- holding device
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
Description
第１図は本考案の一実施例を示す斜視図、第２
図は同第１図の部分断面側面図、第３図は従来例
を示した斜視図、第４図は同第３図の部分断面側
面図である。
１……第１のプリント基板、２……第２のプリ
ント基板、３……放熱板、４……保持装置、４ａ
，４ｂ……切起し、５……間隙、６……突出部、
７……透孔、８……電気部品（ピンジヤツク）、
９……ねじ取付部、１０……キヤビネツト側面（
パネル）、１１，１２……透孔、１３……ねじ、
１４……半田付部、２１……第１のプリント基板
、２２……第２のプリント基板、２３……突出部
、２４，２７，２９，３１……透孔、２５……保
持金具、２６，２８……突起部、３０……突起部
、３２……銅箔、３３……半田付部。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figures are a partially sectional side view of FIG. 1, FIG. 3 is a perspective view showing a conventional example, and FIG. 4 is a partially sectional side view of FIG. 3. DESCRIPTION OF SYMBOLS 1... First printed circuit board, 2... Second printed circuit board, 3... Heat sink, 4... Holding device, 4a
, 4b... cut and raised, 5... gap, 6... protrusion,
7... Through hole, 8... Electrical parts (pin jack),
9... Screw mounting part, 10... Cabinet side (
panel), 11, 12...through hole, 13...screw,
14...Soldering portion, 21...First printed circuit board, 22...Second printed circuit board, 23...Protrusion portion, 24, 27, 29, 31...Through hole, 25...Holding metal fitting, 26 , 28...Protrusion, 30...Protrusion, 32...Copper foil, 33...Soldering part.
Claims (1)
を接続する構造にあつて、ほぼプリント基板の厚
さの間隙を有する左右二個の略Ｌ字形切起しを金
属製放熱板の上端部に設け、左右の切起し間隙間
に垂直に立てた第２のプリント基板の上部を挿着
し、同第２のプリント基板の下部に設けた銅箔を
有する突出部を前記第１のプリント基板に形成し
た透孔に挿入し、同第１のプリント基板の透孔の
周辺に設けた銅箔と前記突出部の銅箔とを半田付
固着してなるプリント基板の保持装置。 (2) 金属製放熱板の上端部に形成した切起しに
挿着する第２のプリント基板の他方側に、ねじの
取付部を有する電気部品を固着し、同電気部品と
機器のキヤビネツト側面とをねじ止め固着してな
る請求項(1)記載のプリント基板の保持装置。[Claims for Utility Model Registration] (1) In a structure in which a second printed circuit board is connected to a first printed circuit board, there are two approximately L-shaped cutouts on the left and right sides with a gap approximately the thickness of the printed circuit board. is provided at the upper end of the metal heat sink, the upper part of a second printed circuit board standing vertically in the gap between the left and right cut and raised parts is inserted, and the copper foil is provided at the lower part of the second printed circuit board. A print formed by inserting a protruding part into a through hole formed in the first printed circuit board, and fixing the copper foil of the protruding part to a copper foil provided around the through hole of the first printed circuit board by soldering. Board holding device. (2) An electrical component with a screw attachment part is fixed to the other side of the second printed circuit board that is inserted into the cutout formed at the upper end of the metal heat sink, and the electrical component and the side surface of the equipment cabinet are fixed. 2. The printed circuit board holding device according to claim 1, wherein the printed circuit board holding device is fixed by screwing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4851489U JPH02138465U (en) | 1989-04-24 | 1989-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4851489U JPH02138465U (en) | 1989-04-24 | 1989-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138465U true JPH02138465U (en) | 1990-11-19 |
Family
ID=31565387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4851489U Pending JPH02138465U (en) | 1989-04-24 | 1989-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019426A (en) * | 2005-07-11 | 2007-01-25 | Maspro Denkoh Corp | Electronic apparatus |
-
1989
- 1989-04-24 JP JP4851489U patent/JPH02138465U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019426A (en) * | 2005-07-11 | 2007-01-25 | Maspro Denkoh Corp | Electronic apparatus |
| JP4723299B2 (en) * | 2005-07-11 | 2011-07-13 | マスプロ電工株式会社 | Electronics |
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