JPH0221795U - - Google Patents
Info
- Publication number
- JPH0221795U JPH0221795U JP9908488U JP9908488U JPH0221795U JP H0221795 U JPH0221795 U JP H0221795U JP 9908488 U JP9908488 U JP 9908488U JP 9908488 U JP9908488 U JP 9908488U JP H0221795 U JPH0221795 U JP H0221795U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- generating component
- heat dissipation
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 5
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１実施例を示す要部斜視図
、第２図は本考案の第２実施例を示す側断面図、
第３図は従来例の要部斜視図、第４図は他従来例
の側断面図である。
１１，２１…印刷配線板、１１ａ，２１ｃ…透
孔、１１ｂ…電気的接続点、１２，２３…放熱板
、１３，２２…発熱部品、１３ａ…端子、２２ａ
…リード端子、２３ａ…絶縁用透孔、２４…絶縁
板。
FIG. 1 is a perspective view of essential parts showing a first embodiment of the present invention, FIG. 2 is a side sectional view showing a second embodiment of the present invention,
FIG. 3 is a perspective view of essential parts of a conventional example, and FIG. 4 is a side sectional view of another conventional example. DESCRIPTION OF SYMBOLS 11, 21... Printed wiring board, 11a, 21c... Through hole, 11b... Electrical connection point, 12, 23... Heat sink, 13, 22... Heat generating component, 13a... Terminal, 22a
...Lead terminal, 23a...Insulating through hole, 24...Insulating plate.
Claims (1)
と、 この印刷配線板の部品実装面と反対側に積層さ
れた放熱板と を備え、 この放熱板の前記印刷配線板の透孔に対向する
位置に発熱部品を取り付けたことを特徴とする発
熱部品の放熱構造。 ２ 表面実装形印刷配線板であり、少なくとも、
この印刷配線板と同一大の放熱板を配設してなる
請求項１記載の発熱部品の放熱構造。 ３ リード部品実装形印刷配線板であり、部品の
電気的接続点に対向して放熱板にそれぞれ絶縁用
透孔を穿設してなる請求項１記載の発熱部品の放
熱構造。[Claims for Utility Model Registration] 1. A printed wiring board with through holes provided at heat generating component mounting positions, and a heat sink laminated on the side opposite to the component mounting surface of the printed wiring board, A heat dissipation structure for a heat generating component, characterized in that the heat generating component is mounted at a position facing a through hole in a printed wiring board. 2 A surface-mounted printed wiring board, which includes at least the following:
2. The heat dissipation structure for a heat generating component according to claim 1, further comprising a heat dissipation plate having the same size as the printed wiring board. 3. The heat dissipation structure for a heat generating component according to claim 1, which is a lead component mounted printed wiring board, and wherein insulating through holes are formed in the heat dissipation plate facing the electrical connection points of the components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9908488U JPH0221795U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9908488U JPH0221795U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221795U true JPH0221795U (en) | 1990-02-14 |
Family
ID=31325916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9908488U Pending JPH0221795U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221795U (en) |
-
1988
- 1988-07-28 JP JP9908488U patent/JPH0221795U/ja active Pending
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