JPH02131395U - - Google Patents

Info

Publication number
JPH02131395U
JPH02131395U JP3999789U JP3999789U JPH02131395U JP H02131395 U JPH02131395 U JP H02131395U JP 3999789 U JP3999789 U JP 3999789U JP 3999789 U JP3999789 U JP 3999789U JP H02131395 U JPH02131395 U JP H02131395U
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
printed circuit
contact
opposite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3999789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3999789U priority Critical patent/JPH02131395U/ja
Publication of JPH02131395U publication Critical patent/JPH02131395U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係る電子部品の取付構造の一
実施例を示す部分断面図、第2図は第1図中A矢
視図、第3図は従来の電子部品の取付構造の一例
を示す部分断面図である。 4……スルーホール、11……パワートランジ
スタ、11a……リード、12……箱体壁部、1
3……プリント基板。
FIG. 1 is a partial sectional view showing an embodiment of the electronic component mounting structure according to the present invention, FIG. 2 is a view taken in the direction of arrow A in FIG. 1, and FIG. 3 is an example of the conventional electronic component mounting structure. FIG. 4...Through hole, 11...Power transistor, 11a...Lead, 12...Box wall, 1
3...Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品をプリント基板に接触して実装し、該
プリント基板の電子部品実装位置の面と反対側の
面をヒートシンクに接触して取り付ける一方、プ
リント基板に、前記電子部品実装位置の面と反対
側の面とに通じる複数のスルーホールを開設した
ことを特徴とする電子部品の取付構造。
An electronic component is mounted in contact with a printed circuit board, and the surface of the printed circuit board opposite to the surface where the electronic component is mounted is mounted in contact with a heat sink, while the surface opposite to the surface where the electronic component is mounted is mounted on the printed circuit board. An electronic component mounting structure characterized by having a plurality of through holes that communicate with the surface.
JP3999789U 1989-04-06 1989-04-06 Pending JPH02131395U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3999789U JPH02131395U (en) 1989-04-06 1989-04-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3999789U JPH02131395U (en) 1989-04-06 1989-04-06

Publications (1)

Publication Number Publication Date
JPH02131395U true JPH02131395U (en) 1990-10-31

Family

ID=31549401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3999789U Pending JPH02131395U (en) 1989-04-06 1989-04-06

Country Status (1)

Country Link
JP (1) JPH02131395U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015085550A (en) * 2013-10-29 2015-05-07 セイコーエプソン株式会社 Liquid discharge device and control circuit board of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015085550A (en) * 2013-10-29 2015-05-07 セイコーエプソン株式会社 Liquid discharge device and control circuit board of the same

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