JPH01153697U - - Google Patents
Info
- Publication number
- JPH01153697U JPH01153697U JP4523888U JP4523888U JPH01153697U JP H01153697 U JPH01153697 U JP H01153697U JP 4523888 U JP4523888 U JP 4523888U JP 4523888 U JP4523888 U JP 4523888U JP H01153697 U JPH01153697 U JP H01153697U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- screw
- heat dissipation
- dissipation structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａおよびｂは本考案に係る電子部品の放
熱構造を示す平面図と局部断面図、第２図ａおよ
びｂは同じく本考案における電子部品を示す平面
図と側面図、第３図ａおよびｂは従来の電子部品
の放熱構造を示す平面図と側面図、第４図ａおよ
びｂはその電子部品を示す平面図と側面図である
。
６……ねじ、１１……プリント基板、１１ａ…
…被接触部、１２……透孔、１３……半導体装置
、１３ａ……放熱部、１４……ねじ孔。
Figures 1 a and b are a plan view and a local sectional view showing the heat dissipation structure of an electronic component according to the present invention, Figures 2 a and b are a plan view and a side view showing the electronic component also according to the present invention, and Figure 3 a 4A and 4B are a plan view and a side view showing a conventional heat dissipation structure of an electronic component, and FIGS. 4A and 4B are a plan view and a side view showing the electronic component. 6...screw, 11...printed circuit board, 11a...
... Contacted part, 12 ... Through hole, 13 ... Semiconductor device, 13a ... Heat dissipation part, 14 ... Screw hole.
Claims (1)
り付けてなる電子部品の放熱構造において、前記
基板の被接触部および前記電子部品の接触部のう
ちいずれか一方の部位にねじが挿通する透孔を設
け、他方の部位に前記ねじが螺合するねじ孔を設
けたことを特徴とする電子部品の放熱構造。 In a heat dissipation structure for an electronic component in which an electronic component is attached with a part of the electronic component in contact with a substrate, a through hole through which a screw is inserted into one of the contacted portion of the substrate and the contact portion of the electronic component. 1. A heat dissipation structure for an electronic component, characterized in that the other part is provided with a screw hole into which the screw is screwed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4523888U JPH01153697U (en) | 1988-04-05 | 1988-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4523888U JPH01153697U (en) | 1988-04-05 | 1988-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153697U true JPH01153697U (en) | 1989-10-23 |
Family
ID=31271553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4523888U Pending JPH01153697U (en) | 1988-04-05 | 1988-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153697U (en) |
-
1988
- 1988-04-05 JP JP4523888U patent/JPH01153697U/ja active Pending