JPH0330440U

JPH0330440U -

Info

Publication number: JPH0330440U
Application number: JP8982889U
Authority: JP
Priority date: 1989-08-01
Filing date: 1989-08-01
Publication date: 1991-03-26

Description

[Brief explanation of drawings]

第１図ａは本考案の電子機器の一部を模式的に
示す平面図、第１図ｂは同じくその側面図、第２
図ａは従来の電子機器の一部を模式的に示す平面
図、第２図ｂはその側面図である。１……放熱基板、２……第１の絶縁基板、３…
…電子部品、３ａ……発熱量の多い電子部品、４
……熱伝導性良好な材料で形成した第２の絶縁基
板。 FIG. 1a is a plan view schematically showing a part of the electronic device of the present invention, FIG. 1b is a side view thereof, and FIG.
FIG. 2A is a plan view schematically showing a part of a conventional electronic device, and FIG. 2B is a side view thereof. 1... heat dissipation board, 2... first insulating substrate, 3...
...Electronic component, 3a...Electronic component that generates a lot of heat, 4
...A second insulating substrate made of a material with good thermal conductivity.

Claims

[Scope of utility model registration request]

In an electronic device having a structure in which an insulating substrate is soldered and fixed on a heat dissipation board, and a plurality of electronic components are mounted and fixed on this insulating substrate, the electronic components that generate a relatively large amount of heat are mounted relatively to the insulating substrate. An electronic device characterized in that the electronic components are mounted and fixed on another independent insulating substrate with good thermal conductivity, and the electronic components that generate a relatively small amount of heat are mounted and fixed on the insulating substrate.