JPH0476094U - - Google Patents
Info
- Publication number
- JPH0476094U JPH0476094U JP11936190U JP11936190U JPH0476094U JP H0476094 U JPH0476094 U JP H0476094U JP 11936190 U JP11936190 U JP 11936190U JP 11936190 U JP11936190 U JP 11936190U JP H0476094 U JPH0476094 U JP H0476094U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat dissipation
- board
- dissipation fin
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図は本考案の一実施例を説明す
る図であり、第１図は断面図、第２図は分解斜視
図である。第３図乃至第６図は従来例を説明する
図であり、第３図は電子部品に小形放熱フインを
設けた状態の側面図、第４図は電子部品に大形放
熱フインを設けた状態の側面図、第５図及び第６
図はプリント配線板を間にして電子部品と放熱フ
インを設けた場合の断面図及び分解斜視図である
。
２１……基板、２２……電子部品、２３……放
熱フイン、２８……突起部、３５……一方の面、
３８……穴部、４５……他方の面。
1 and 2 are diagrams illustrating an embodiment of the present invention, with FIG. 1 being a sectional view and FIG. 2 being an exploded perspective view. Figures 3 to 6 are diagrams explaining conventional examples; Figure 3 is a side view of an electronic component with small heat dissipation fins, and Figure 4 is a side view of an electronic component with large heat dissipation fins. Side view of Figures 5 and 6
The figures are a cross-sectional view and an exploded perspective view when electronic components and heat dissipation fins are provided with a printed wiring board in between. 21...Substrate, 22...Electronic component, 23...Radiation fin, 28...Protrusion, 35...One side,
38...hole, 45...other surface.
Claims (1)
の面に前記電子部品から発生する熱を放出する放
熱フインが取り付けられる電子部品の放熱構造に
おいて、前記放熱フインには前記基板に対向する
面に熱伝導性部材で形成された突起部が設けられ
、前記基板の前記電子部品と対向する部分には前
記突起部が挿入される穴部が設けられ、前記放熱
フインは前記突起部が前記電子部品に当接するま
で前記穴部に挿入された状態で前記基板に取り付
けられていることを特徴とする電子部品の放熱構
造。 In a heat dissipation structure for an electronic component in which an electronic component is attached to one surface of a board and a heat dissipation fin that dissipates heat generated from the electronic component is attached to the other surface of the board, the heat dissipation fin has a heat dissipation fin that dissipates heat generated from the electronic component on the surface facing the board. A protrusion made of a conductive material is provided, a hole into which the protrusion is inserted is provided in a portion of the board facing the electronic component, and the heat dissipation fin is provided with a hole in which the protrusion is inserted into the electronic component. A heat dissipation structure for an electronic component, characterized in that the structure is attached to the substrate while being inserted into the hole until contact is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11936190U JPH0476094U (en) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11936190U JPH0476094U (en) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476094U true JPH0476094U (en) | 1992-07-02 |
Family
ID=31867325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11936190U Pending JPH0476094U (en) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476094U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003347783A (en) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | Power conversion apparatus |
| WO2008044485A1 (en) * | 2006-10-06 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module and motor control device having the same |
| JP2010086071A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
| JP2015528214A (en) * | 2012-08-06 | 2015-09-24 | ケーエムダブリュ・インコーポレーテッド | Heat dissipation device via heat sink |
-
1990
- 1990-11-16 JP JP11936190U patent/JPH0476094U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003347783A (en) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | Power conversion apparatus |
| WO2008044485A1 (en) * | 2006-10-06 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module and motor control device having the same |
| US7872868B2 (en) | 2006-10-06 | 2011-01-18 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module, and motor controller including the same |
| TWI403258B (en) * | 2006-10-06 | 2013-07-21 | 安川電機股份有限公司 | The installation of the power module and the motor control device |
| JP2010086071A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
| JP2015528214A (en) * | 2012-08-06 | 2015-09-24 | ケーエムダブリュ・インコーポレーテッド | Heat dissipation device via heat sink |
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