JPH0476094U - - Google Patents

Info

Publication number
JPH0476094U
JPH0476094U JP11936190U JP11936190U JPH0476094U JP H0476094 U JPH0476094 U JP H0476094U JP 11936190 U JP11936190 U JP 11936190U JP 11936190 U JP11936190 U JP 11936190U JP H0476094 U JPH0476094 U JP H0476094U
Authority
JP
Japan
Prior art keywords
electronic component
heat dissipation
board
dissipation fin
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11936190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11936190U priority Critical patent/JPH0476094U/ja
Publication of JPH0476094U publication Critical patent/JPH0476094U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案の一実施例を説明す
る図であり、第１図は断面図、第２図は分解斜視
図である。第３図乃至第６図は従来例を説明する
図であり、第３図は電子部品に小形放熱フインを
設けた状態の側面図、第４図は電子部品に大形放
熱フインを設けた状態の側面図、第５図及び第６
図はプリント配線板を間にして電子部品と放熱フ
インを設けた場合の断面図及び分解斜視図である
。 ２１……基板、２２……電子部品、２３……放
熱フイン、２８……突起部、３５……一方の面、
３８……穴部、４５……他方の面。 1 and 2 are diagrams illustrating an embodiment of the present invention, with FIG. 1 being a sectional view and FIG. 2 being an exploded perspective view. Figures 3 to 6 are diagrams explaining conventional examples; Figure 3 is a side view of an electronic component with small heat dissipation fins, and Figure 4 is a side view of an electronic component with large heat dissipation fins. Side view of Figures 5 and 6
The figures are a cross-sectional view and an exploded perspective view when electronic components and heat dissipation fins are provided with a printed wiring board in between. 21...Substrate, 22...Electronic component, 23...Radiation fin, 28...Protrusion, 35...One side,
38...hole, 45...other surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の一方の面に電子部品が取り付けられ他方
の面に前記電子部品から発生する熱を放出する放
熱フインが取り付けられる電子部品の放熱構造に
おいて、前記放熱フインには前記基板に対向する
面に熱伝導性部材で形成された突起部が設けられ
、前記基板の前記電子部品と対向する部分には前
記突起部が挿入される穴部が設けられ、前記放熱
フインは前記突起部が前記電子部品に当接するま
で前記穴部に挿入された状態で前記基板に取り付
けられていることを特徴とする電子部品の放熱構
造。 In a heat dissipation structure for an electronic component in which an electronic component is attached to one surface of a board and a heat dissipation fin that dissipates heat generated from the electronic component is attached to the other surface of the board, the heat dissipation fin has a heat dissipation fin that dissipates heat generated from the electronic component on the surface facing the board. A protrusion made of a conductive material is provided, a hole into which the protrusion is inserted is provided in a portion of the board facing the electronic component, and the heat dissipation fin is provided with a hole in which the protrusion is inserted into the electronic component. A heat dissipation structure for an electronic component, characterized in that the structure is attached to the substrate while being inserted into the hole until contact is made.
JP11936190U 1990-11-16 1990-11-16 Pending JPH0476094U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11936190U JPH0476094U (en) 1990-11-16 1990-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11936190U JPH0476094U (en) 1990-11-16 1990-11-16

Publications (1)

Publication Number Publication Date
JPH0476094U true JPH0476094U (en) 1992-07-02

Family

ID=31867325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11936190U Pending JPH0476094U (en) 1990-11-16 1990-11-16

Country Status (1)

Country Link
JP (1) JPH0476094U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347783A (en) * 2002-05-31 2003-12-05 Mitsubishi Electric Corp Power conversion apparatus
WO2008044485A1 (en) * 2006-10-06 2008-04-17 Kabushiki Kaisha Yaskawa Denki Mounting structure for power module and motor control device having the same
JP2010086071A (en) * 2008-09-29 2010-04-15 Toshiba Corp Electronic apparatus
JP2015528214A (en) * 2012-08-06 2015-09-24 ケーエムダブリュ・インコーポレーテッド Heat dissipation device via heat sink

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347783A (en) * 2002-05-31 2003-12-05 Mitsubishi Electric Corp Power conversion apparatus
WO2008044485A1 (en) * 2006-10-06 2008-04-17 Kabushiki Kaisha Yaskawa Denki Mounting structure for power module and motor control device having the same
US7872868B2 (en) 2006-10-06 2011-01-18 Kabushiki Kaisha Yaskawa Denki Mounting structure for power module, and motor controller including the same
TWI403258B (en) * 2006-10-06 2013-07-21 Yaskawa Denki Seisakusho Kk The installation of the power module and the motor control device
JP2010086071A (en) * 2008-09-29 2010-04-15 Toshiba Corp Electronic apparatus
JP2015528214A (en) * 2012-08-06 2015-09-24 ケーエムダブリュ・インコーポレーテッド Heat dissipation device via heat sink

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