JPH02110392U - - Google Patents
Info
- Publication number
- JPH02110392U JPH02110392U JP14208488U JP14208488U JPH02110392U JP H02110392 U JPH02110392 U JP H02110392U JP 14208488 U JP14208488 U JP 14208488U JP 14208488 U JP14208488 U JP 14208488U JP H02110392 U JPH02110392 U JP H02110392U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation plate
- circuit board
- printed circuit
- metal case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000002470 thermal conductor Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例の部分分解斜視図、
第２図は組立て状態の要部の断面図、第３図は従
来の放熱装置の部分分解斜視図である。
１……プリント基板、１ａ……グランドパター
ン、１ｂ……回路パターン、２……電子部品、２
ａ……パツケージ、３……放熱プレート、３ａ…
…窓、３ｂ……孔、４……取付具、５……金属ケ
ース、６ａ，６ｂ……ねじ、７……ヒートシンク
。
FIG. 1 is a partially exploded perspective view of an embodiment of the present invention;
FIG. 2 is a sectional view of main parts in an assembled state, and FIG. 3 is a partially exploded perspective view of a conventional heat dissipation device. 1... Printed circuit board, 1a... Ground pattern, 1b... Circuit pattern, 2... Electronic component, 2
a...Package cage, 3...Radiation plate, 3a...
...Window, 3b...hole, 4...fitting, 5...metal case, 6a, 6b...screw, 7...heat sink.
Claims (1)
ンドパターンと略同一形状をした熱良導体の放熱
プレートを該グランドパターンに沿つて配設する
とともに、前記プリント基板に搭載する発熱性の
電子部品をこの放熱プレートに接触させ、かつ放
熱プレートを前記金属ケースに接触させた状態で
前記プリント基板と共に金属ケースに取着したこ
とを特徴とする電子部品の放熱装置。 A heat dissipation plate made of a good thermal conductor and having approximately the same shape as the ground pattern of the printed circuit board housed in the metal case is disposed along the ground pattern, and heat generating electronic components mounted on the printed circuit board are placed on this heat dissipation plate. 1. A heat dissipation device for an electronic component, characterized in that the heat dissipation plate is attached to a metal case together with the printed circuit board with the heat dissipation plate in contact with the metal case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14208488U JPH02110392U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14208488U JPH02110392U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110392U true JPH02110392U (en) | 1990-09-04 |
Family
ID=31407726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14208488U Pending JPH02110392U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110392U (en) |
-
1988
- 1988-10-31 JP JP14208488U patent/JPH02110392U/ja active Pending