JPH02129794U - - Google Patents
Info
- Publication number
- JPH02129794U JPH02129794U JP3848789U JP3848789U JPH02129794U JP H02129794 U JPH02129794 U JP H02129794U JP 3848789 U JP3848789 U JP 3848789U JP 3848789 U JP3848789 U JP 3848789U JP H02129794 U JPH02129794 U JP H02129794U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- attached
- mounting structure
- positioning protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示すものであり、
放熱板のプリント基板への取付け前の状態を示す
斜視図、第２図は回路基板の筐体への組付け状態
を示す斜視図、第３図は第２図の−線に沿う
断面図、第４図は発熱電子部品の放熱板への取付
状態を示す正面図、第５図は第４図の側面図、第
６図は係合部の一実施例を示すもので第１図の
−線に沿う断面図、第７図は係合部の他の実施
例を示すもので第６図と同様な断面図である。
１ａ，１ｂ……発熱電子部品、２……プリント
基板（回路基板）、２Ａ，２Ｂ，２Ｃ……貫通孔
（係合部）、２Ａ′……凹部（係合部）、３……
筐体、５……放熱板、５Ａ，５Ｂ，５Ｃ……突起
。
FIG. 1 shows an embodiment of the present invention,
FIG. 2 is a perspective view showing the state of the heat sink before being attached to the printed circuit board; FIG. 2 is a perspective view showing the circuit board being assembled to the housing; FIG. 3 is a sectional view taken along the - line in FIG. 2; FIG. 4 is a front view showing how the heat-generating electronic component is attached to the heat sink, FIG. 5 is a side view of FIG. 4, and FIG. A sectional view taken along the line, FIG. 7, shows another embodiment of the engaging portion, and is a sectional view similar to FIG. 6. 1a, 1b... Heat generating electronic component, 2... Printed board (circuit board), 2A, 2B, 2C... Through hole (engaging part), 2A'... Recessed part (engaging part), 3...
Housing, 5... Heat sink, 5A, 5B, 5C... Protrusion.
Claims (1)
熱板を回路基板に取付け、さらに、該回路基板を
前記筐体に取付けるようにした放熱板の取付構造
において、前記放熱板及び前記回路基板のいずれ
か一方に少なくとも二つの位置決め用突起を設け
、そのいずれか他方にこれらの突起が夫々嵌合す
る複数の係合部を設けたことを特徴とする放熱板
の取付構造。 In a heat sink mounting structure in which a heat generating electronic component is attached to a heat sink, the heat sink is attached to a circuit board, and the circuit board is further attached to the casing, either the heat sink or the circuit board A mounting structure for a heat sink, characterized in that one side is provided with at least two positioning protrusions, and one of the two positioning protrusions is provided with a plurality of engaging parts into which these protrusions fit, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848789U JPH02129794U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3848789U JPH02129794U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129794U true JPH02129794U (en) | 1990-10-25 |
Family
ID=31546535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3848789U Pending JPH02129794U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129794U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147862A (en) * | 2004-11-19 | 2006-06-08 | Hoshizaki Electric Co Ltd | Operation control device of cooling storage |
-
1989
- 1989-03-31 JP JP3848789U patent/JPH02129794U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147862A (en) * | 2004-11-19 | 2006-06-08 | Hoshizaki Electric Co Ltd | Operation control device of cooling storage |
| JP4555057B2 (en) * | 2004-11-19 | 2010-09-29 | ホシザキ電機株式会社 | Cooling storage operation control device |