JPH0363951U - - Google Patents
Info
- Publication number
- JPH0363951U JPH0363951U JP12529489U JP12529489U JPH0363951U JP H0363951 U JPH0363951 U JP H0363951U JP 12529489 U JP12529489 U JP 12529489U JP 12529489 U JP12529489 U JP 12529489U JP H0363951 U JPH0363951 U JP H0363951U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat dissipation
- hole
- heat
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、この考案の一実施例を示す集積回路
用放熱装置の分解斜視図、第２図は従来の集積回
路用放熱装置の分解斜視図である。
図において、１……集積回路素子、１ａ……凹
部、１ｂ……コネクターピン、２……プリント基
板、２ａ……スルーホール、２ｂ……長円スルー
ホール、３……放熱器、３ａ……放熱面、３ｄ…
…取付足、３ｅ……開口である。なお、各図中同
一符号は同一、または相当部分を示す。
FIG. 1 is an exploded perspective view of a heat dissipation device for integrated circuits showing an embodiment of this invention, and FIG. 2 is an exploded perspective view of a conventional heat dissipation device for integrated circuits. In the figure, 1... integrated circuit element, 1a... recess, 1b... connector pin, 2... printed circuit board, 2a... through hole, 2b... oval through hole, 3... radiator, 3a... Heat dissipation surface, 3d...
...Mounting foot, 3e...Opening. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
をハンダ付して実装される集積回路の背面に密着
する放熱面を持ち上記スルーホールの特定なもの
にその取付足がハンダ付される放熱器を備えた集
積回路用放熱装置において、上記集積回路背面に
設けられている極性を示す凹部と対面する部位の
上記放熱面に設けられた開口、上記コネクターピ
ンの相隣複数が同居して挿入される長円スルーホ
ール、この長円スルーホールに同居して挿入され
る取付足を備えたことを特徴とする集積回路用放
熱装置。 An integrated circuit that is mounted by soldering connector pins to through-holes on a printed circuit board, and has a heat-radiating surface that comes into close contact with the back surface of the integrated circuit, and has a heat sink whose mounting legs are soldered to specific through-holes. In the heat dissipation device for the integrated circuit, an opening provided in the heat dissipation surface at a portion facing the polarity indicating recess provided on the back surface of the integrated circuit, and an oval through hole into which a plurality of adjacent connector pins are inserted together. A heat dissipation device for an integrated circuit, characterized in that it is equipped with a mounting foot that is inserted into the oblong through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12529489U JPH0363951U (en) | 1989-10-25 | 1989-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12529489U JPH0363951U (en) | 1989-10-25 | 1989-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0363951U true JPH0363951U (en) | 1991-06-21 |
Family
ID=31673171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12529489U Pending JPH0363951U (en) | 1989-10-25 | 1989-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0363951U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010526369A (en) * | 2007-05-04 | 2010-07-29 | トムソン ライセンシング | Smart card heat sink |
-
1989
- 1989-10-25 JP JP12529489U patent/JPH0363951U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010526369A (en) * | 2007-05-04 | 2010-07-29 | トムソン ライセンシング | Smart card heat sink |
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