JPH0350787U - - Google Patents

Info

Publication number
JPH0350787U
JPH0350787U JP11148389U JP11148389U JPH0350787U JP H0350787 U JPH0350787 U JP H0350787U JP 11148389 U JP11148389 U JP 11148389U JP 11148389 U JP11148389 U JP 11148389U JP H0350787 U JPH0350787 U JP H0350787U
Authority
JP
Japan
Prior art keywords
heat
generating component
printed circuit
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11148389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11148389U priority Critical patent/JPH0350787U/ja
Publication of JPH0350787U publication Critical patent/JPH0350787U/ja
Pending legal-status Critical Current

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  • Manufacturing Of Electrical Connectors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の1実施例を示す斜視図、第
2図は、従来例を示す斜視図である。 3……放熱板、11……プリント基板、14…
…発熱部品、15……リード端子、18……孔。
FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 3... Heat sink, 11... Printed circuit board, 14...
...heat generating component, 15...lead terminal, 18...hole.

Claims (1)

【実用新案登録請求の範囲】 放熱板の所定面にリード端子を有する所定形状
の発熱部品を複数個配置してプリント基板に設け
られた孔に前記発熱部品の各リード端子を挿通し
、前記放熱板を前記プリント基板に立設して取付
けると共に前記各リード端子を前記プリント基板
の回路に半田接続してなる発熱部品取付け装置で
あつて、 前記各発熱部品は前記放熱板のプリント基板取
付け面に対して順次段差を以て傾斜配置されるよ
うに前記放熱板の所定面に配置して取付けること
を特徴とする発熱部品取付け装置。
[Claims for Utility Model Registration] A plurality of heat generating components each having a predetermined shape and having lead terminals are arranged on a predetermined surface of a heat sink, each lead terminal of the heat generating component is inserted into a hole provided in a printed circuit board, and the heat dissipating A heat-generating component mounting device in which a board is mounted upright on the printed circuit board and each of the lead terminals is soldered to a circuit on the printed circuit board, wherein each of the heat-generating components is mounted on the printed circuit board mounting surface of the heat sink. A heat-generating component mounting device characterized in that the heat-generating component mounting device is arranged and mounted on a predetermined surface of the heat sink so that the heat-generating component is mounted on a predetermined surface of the heat sink so that the heat-generating component is sequentially arranged at an angle with steps.
JP11148389U 1989-09-22 1989-09-22 Pending JPH0350787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11148389U JPH0350787U (en) 1989-09-22 1989-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11148389U JPH0350787U (en) 1989-09-22 1989-09-22

Publications (1)

Publication Number Publication Date
JPH0350787U true JPH0350787U (en) 1991-05-17

Family

ID=31659958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11148389U Pending JPH0350787U (en) 1989-09-22 1989-09-22

Country Status (1)

Country Link
JP (1) JPH0350787U (en)

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