JPH0476049U - - Google Patents
Info
- Publication number
- JPH0476049U JPH0476049U JP11911890U JP11911890U JPH0476049U JP H0476049 U JPH0476049 U JP H0476049U JP 11911890 U JP11911890 U JP 11911890U JP 11911890 U JP11911890 U JP 11911890U JP H0476049 U JPH0476049 U JP H0476049U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat radiator
- angle
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001154 acute effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Description
第１図は本考案の放熱器の概要を示す一部省略
一部断面正面図、第２図は同放熱器の正面図、第
３図は同平面図、第４図は同側面図、第５図は電
子部品の側面図、第６図は従来例の放熱器の斜視
図、第７図は同放熱器の組付け状態を示す一部省
略一部断面正面図である。
１２……放熱器、１３……一側面、１４……突
片、１５……底面、１８……電子部品、２２……
端子、２３……プリント基板。
Fig. 1 is a partially omitted partially sectional front view showing an outline of the radiator of the present invention, Fig. 2 is a front view of the radiator, Fig. 3 is a plan view of the same, Fig. 4 is a side view of the same, and Fig. 4 is a side view of the same. 5 is a side view of an electronic component, FIG. 6 is a perspective view of a conventional heat radiator, and FIG. 7 is a partially omitted partially sectional front view showing the assembled state of the heat radiator. 12...Radiator, 13...One side, 14...Protrusion piece, 15...Bottom surface, 18...Electronic component, 22...
Terminal, 23...Printed circuit board.
Claims (1)
を複数連設すると共に、同一側面に電子部品を密
接し、底面をプリント基板に当接して固定し、前
記電子部品より導出する複数の端子を前記プリン
ト基板の開孔に挿通後ハンダ付け接続して成る放
熱器であつて、前記一側面と前記底面との間の角
度を鋭角に形成せしめて成ることを特徴とする放
熱器。 (2) 前記突片の先端部を少なくとも上部におい
て前記底面に対して垂直に形成せしめて成ること
を特徴とする請求項(1)記載の放熱器。[Claims for Utility Model Registration] (1) A plurality of vertical fin-like protrusions are provided in a row from the back side of one side, electronic components are placed closely on the same side, and the bottom is fixed by touching the printed circuit board. and a heat radiator in which a plurality of terminals led out from the electronic component are inserted into openings in the printed circuit board and then connected by soldering, the angle between the one side surface and the bottom surface being formed at an acute angle. A heatsink characterized by: (2) The heat radiator according to claim (1), wherein the tip of the protruding piece is formed perpendicularly to the bottom surface at least in the upper part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11911890U JPH0476049U (en) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11911890U JPH0476049U (en) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476049U true JPH0476049U (en) | 1992-07-02 |
Family
ID=31867098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11911890U Pending JPH0476049U (en) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476049U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069756A (en) * | 2011-09-21 | 2013-04-18 | Toshiba Mitsubishi-Electric Industrial System Corp | Cooling device of semiconductor element |
-
1990
- 1990-11-14 JP JP11911890U patent/JPH0476049U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013069756A (en) * | 2011-09-21 | 2013-04-18 | Toshiba Mitsubishi-Electric Industrial System Corp | Cooling device of semiconductor element |
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