JPH0472661U - - Google Patents
Info
- Publication number
- JPH0472661U JPH0472661U JP11636490U JP11636490U JPH0472661U JP H0472661 U JPH0472661 U JP H0472661U JP 11636490 U JP11636490 U JP 11636490U JP 11636490 U JP11636490 U JP 11636490U JP H0472661 U JPH0472661 U JP H0472661U
- Authority
- JP
- Japan
- Prior art keywords
- base
- light emitting
- emitting diode
- back surface
- side edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る表面実装型ＬＥＤの実施
例を示しており、Ａはその正面図、Ｂはその底面
図、Ｃはベースの平面図である。第２図は、第１
図の表面実装型ＬＥＤが実装されるべきプリント
基板の平面図である。第３図は、従来の表面実装
型ＬＥＤの一例を示す正面図である。
１０……表面実装型ＬＥＤ、１１……ＬＥＤ、
１２……ベース、１２ｂ……貫通孔、１３……リ
ードフレーム、１３ａ……リードフレームの先端
部、１５……プリント基板、１６……導電パター
ン、１７……クリーム半田。
FIG. 1 shows an embodiment of a surface-mounted LED according to the present invention, in which A is a front view thereof, B is a bottom view thereof, and C is a plan view of the base. Figure 2 shows the first
FIG. 2 is a plan view of a printed circuit board on which the surface-mounted LED shown in the figure is to be mounted. FIG. 3 is a front view showing an example of a conventional surface-mounted LED. 10...Surface-mounted LED, 11...LED,
12... Base, 12b... Through hole, 13... Lead frame, 13a... Lead frame tip, 15... Printed circuit board, 16... Conductive pattern, 17... Cream solder.
Claims (1)
受容し、且つ該発光ダイオードから延出したリー
ドフレームを挿通する貫通孔が形成されたベース
とでなり、 上記リードフレームのベース裏面に突出させた
先端部を該ベースの側縁に向かつて曲折し、ベー
ス側縁付近でさらにベース裏面の端縁に沿つて曲
折させたことを特徴とする、表面実装型ＬＥＤ。[Claims for Utility Model Registration] A base comprising a light emitting diode and a base formed with a through hole for receiving a part of the light emitting diode and through which a lead frame extending from the light emitting diode is inserted; A surface-mounted LED characterized in that a tip portion protruding from the back surface of the base is bent toward the side edge of the base, and further bent near the side edge of the base along the edge of the back surface of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636490U JPH0472661U (en) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636490U JPH0472661U (en) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472661U true JPH0472661U (en) | 1992-06-26 |
Family
ID=31864184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11636490U Pending JPH0472661U (en) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472661U (en) |
-
1990
- 1990-11-06 JP JP11636490U patent/JPH0472661U/ja active Pending