JPH0482871U - - Google Patents
Info
- Publication number
- JPH0482871U JPH0482871U JP12578190U JP12578190U JPH0482871U JP H0482871 U JPH0482871 U JP H0482871U JP 12578190 U JP12578190 U JP 12578190U JP 12578190 U JP12578190 U JP 12578190U JP H0482871 U JPH0482871 U JP H0482871U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- back surface
- base
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る表面実装型ＬＥＤの実施
例の概略を示しており、Ａはその正面図、Ｂは底
面図、Ｃはベースの平面図である。第２図は、第
１図の表面実装型ＬＥＤが実装されるべきプリン
ト基板の平面図である。第３図は、従来の表面実
装型ＬＥＤの一例を示す正面図である。
１０……表面実装型ＬＥＤ、１１……ＬＥＤ、
１２……ベース、１２ｂ……貫通孔、１２ｃ……
溝、１３……リードフレーム、１３ａ……リード
フレームの先端部、１５……プリント基板、１６
……導電パターン、１７……クリーム半田、１８
……導電部材、１８ａ……凹状下面。
FIG. 1 schematically shows an embodiment of a surface-mounted LED according to the present invention, in which A is a front view thereof, B is a bottom view, and C is a plan view of the base. FIG. 2 is a plan view of a printed circuit board on which the surface-mounted LED of FIG. 1 is to be mounted. FIG. 3 is a front view showing an example of a conventional surface-mounted LED. 10...Surface-mounted LED, 11...LED,
12...Base, 12b...Through hole, 12c...
Groove, 13... Lead frame, 13a... Lead frame tip, 15... Printed circuit board, 16
...Conductive pattern, 17...Cream solder, 18
...Conductive member, 18a... Concave lower surface.
Claims (1)
受容し、且つ該発光ダイオードから延出したリー
ドフレームを挿通する貫通孔が形成されたベース
とでなり、該ベース裏面の一部に凹状の下面を備
えた導電部が形成されているとともに、上記リー
ドフレームのベース裏面に突出させた先端部を該
裏面に沿つて曲折して上記導電部の凹状下面の下
に位置させたことを特徴とする、表面実装型ＬＥ
Ｄ。 The base includes a light emitting diode and a through hole for receiving a portion of the light emitting diode and through which a lead frame extending from the light emitting diode is inserted, and has a concave lower surface on a portion of the back surface of the base. A conductive portion is formed thereon, and a tip portion protruding from the back surface of the base of the lead frame is bent along the back surface and positioned below the concave lower surface of the conductive portion. Mounted LE
D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578190U JP2521493Y2 (en) | 1990-11-28 | 1990-11-28 | Surface mount LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578190U JP2521493Y2 (en) | 1990-11-28 | 1990-11-28 | Surface mount LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0482871U true JPH0482871U (en) | 1992-07-20 |
| JP2521493Y2 JP2521493Y2 (en) | 1996-12-25 |
Family
ID=31873367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12578190U Expired - Lifetime JP2521493Y2 (en) | 1990-11-28 | 1990-11-28 | Surface mount LED |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2521493Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6692085B1 (en) * | 2019-05-25 | 2020-05-13 | 薫 冨塚 | Battery box. |
-
1990
- 1990-11-28 JP JP12578190U patent/JP2521493Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2521493Y2 (en) | 1996-12-25 |