JPS6161855U - - Google Patents

Info

Publication number
JPS6161855U
JPS6161855U JP1984146337U JP14633784U JPS6161855U JP S6161855 U JPS6161855 U JP S6161855U JP 1984146337 U JP1984146337 U JP 1984146337U JP 14633784 U JP14633784 U JP 14633784U JP S6161855 U JPS6161855 U JP S6161855U
Authority
JP
Japan
Prior art keywords
hole
led lamp
substrate
lead frame
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984146337U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146337U priority Critical patent/JPS6161855U/ja
Publication of JPS6161855U publication Critical patent/JPS6161855U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案に係るLEDランプの取付状
態を示す縦断面図、第2図は、従来例におけるL
EDランプの取付状態を示す縦断面図である。 1……金属製基板、1a……プリント配線部、
1b……孔、2……充填材、3……LEDランプ
、4……リードフレーム。
FIG. 1 is a vertical cross-sectional view showing the mounting state of the LED lamp according to the present invention, and FIG. 2 is the L in the conventional example.
FIG. 3 is a longitudinal cross-sectional view showing how the ED lamp is attached. 1...Metal board, 1a...Printed wiring part,
1b...hole, 2...filling material, 3...LED lamp, 4...lead frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属製基板に孔を形成し、該孔にLEDランプ
を挿入し、前記LEDランプの底面に突出形成し
たリードフレームを折り曲げて前記基板の底面に
形成したプリント配線部に半田付けしたことを特
徴とするLEDランプの基板取付構造。
A hole is formed in a metal substrate, an LED lamp is inserted into the hole, and a lead frame protruding from the bottom of the LED lamp is bent and soldered to a printed wiring portion formed on the bottom of the substrate. Board mounting structure for LED lamps.
JP1984146337U 1984-09-27 1984-09-27 Pending JPS6161855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146337U JPS6161855U (en) 1984-09-27 1984-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146337U JPS6161855U (en) 1984-09-27 1984-09-27

Publications (1)

Publication Number Publication Date
JPS6161855U true JPS6161855U (en) 1986-04-25

Family

ID=30704573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146337U Pending JPS6161855U (en) 1984-09-27 1984-09-27

Country Status (1)

Country Link
JP (1) JPS6161855U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076731A (en) * 2015-10-16 2017-04-20 京セラドキュメントソリューションズ株式会社 LED light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017076731A (en) * 2015-10-16 2017-04-20 京セラドキュメントソリューションズ株式会社 LED light emitting device

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