JPH02113267U - - Google Patents
Info
- Publication number
- JPH02113267U JPH02113267U JP2179589U JP2179589U JPH02113267U JP H02113267 U JPH02113267 U JP H02113267U JP 2179589 U JP2179589 U JP 2179589U JP 2179589 U JP2179589 U JP 2179589U JP H02113267 U JPH02113267 U JP H02113267U
- Authority
- JP
- Japan
- Prior art keywords
- modular jack
- circuit board
- printed circuit
- claw portion
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図および第２図は本考案の一実施例を示す
図であつて、第１図はその組立を示す斜視図、第
２図はその側面図、第３図は従来のモジユラージ
ヤツクの取付構造を示す側面図である。
２１……ダイヤル基板、２２……半田面、２３
……部品実装面、２４……取付孔、２５……モジ
ユラージヤツク、２６……爪部、２７……コネク
タ、２８……リード線。
1 and 2 are views showing one embodiment of the present invention, in which FIG. 1 is a perspective view showing its assembly, FIG. 2 is a side view thereof, and FIG. 3 is a conventional modular jack. FIG. 3 is a side view showing the mounting structure. 21...Dial board, 22...Solder surface, 23
... component mounting surface, 24 ... mounting hole, 25 ... modular jack, 26 ... claw portion, 27 ... connector, 28 ... lead wire.
Claims (1)
嵌合する爪部を有し、この爪部によつて前記プリ
ント基板の半田面に装着されるモジユラージヤツ
クと、前記プリント基板の部品実装面に実装され
たコネクタと、このコネクタと前記モジユラージ
ヤツクとを接続するリード線とを備えたことを特
徴とするモジユラージヤツクの取付構造。 A printed circuit board having a mounting hole, a modular jack having a claw portion that fits into the mounting hole and is attached to the soldering surface of the printed circuit board by the claw portion, and a component mounting surface of the printed circuit board. 1. A mounting structure for a modular jack, comprising: a connector mounted on the modular jack; and a lead wire connecting the connector to the modular jack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179589U JPH02113267U (en) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179589U JPH02113267U (en) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113267U true JPH02113267U (en) | 1990-09-11 |
Family
ID=31239338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2179589U Pending JPH02113267U (en) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113267U (en) |
-
1989
- 1989-02-27 JP JP2179589U patent/JPH02113267U/ja active Pending