JPH0482875U - - Google Patents
Info
- Publication number
- JPH0482875U JPH0482875U JP12578590U JP12578590U JPH0482875U JP H0482875 U JPH0482875 U JP H0482875U JP 12578590 U JP12578590 U JP 12578590U JP 12578590 U JP12578590 U JP 12578590U JP H0482875 U JPH0482875 U JP H0482875U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- base
- light emitting
- back surface
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る表面実装型ＬＥＤの実施
例の概略を示しており、Ａはその正面図、Ｂはリ
ードフレーム先端部の拡大斜視図、Ｃはベースの
底面図、Ｄはベースの底面図である。第２図は、
第１図の表面実装型ＬＥＤが実装されるべきプリ
ント基板の平面図である。第３図は、従来の表面
実装型ＬＥＤの一例を示す正面図である。
１０……表面実装型ＬＥＤ、１１……ＬＥＤ、
１２……ベース、１２ｂ……貫通孔、１２ｃ……
溝、１３……リードフレーム、１３ａ……リード
フレームの先端部、１３ｂ……曲折部、１５……
プリント基板、１６……導電パターン、１７……
クリーム半田。
Figure 1 shows an outline of an embodiment of the surface-mounted LED according to the present invention, where A is a front view thereof, B is an enlarged perspective view of the tip of the lead frame, C is a bottom view of the base, and D is a bottom view of the base. It is a bottom view. Figure 2 shows
FIG. 2 is a plan view of a printed circuit board on which the surface-mounted LED of FIG. 1 is to be mounted. FIG. 3 is a front view showing an example of a conventional surface-mounted LED. 10...Surface-mounted LED, 11...LED,
12...Base, 12b...Through hole, 12c...
Groove, 13... Lead frame, 13a... Lead frame tip, 13b... Bent part, 15...
Printed circuit board, 16... Conductive pattern, 17...
Cream solder.
Claims (1)
受容し、且つ該受光ダイオードから延出したリー
ドフレームを挿通する貫通孔が形成されたベース
とでなり、 上記リードフレームのベース裏面に突出させた
先端部を該裏面に沿つて曲折するとともに、この
リードフレーム先端部の少なくとも曲折部から先
端よりを断面偏平に形成したことを特徴とする、
表面実装型ＬＥＤ。[Claims for Utility Model Registration] A base comprising a light emitting diode and a base formed with a through hole for receiving a part of the light emitting diode and through which a lead frame extending from the light receiving diode is inserted; The lead frame is characterized in that the tip portion protruding from the back surface of the base is bent along the back surface, and the tip portion of the lead frame is formed to have a flat cross-section at least from the bent portion to the tip end.
Surface mounted LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578590U JPH0482875U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578590U JPH0482875U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482875U true JPH0482875U (en) | 1992-07-20 |
Family
ID=31873371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12578590U Pending JPH0482875U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482875U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017017146A (en) * | 2015-06-30 | 2017-01-19 | 日亜化学工業株式会社 | Light-emitting device and light-emitting system |
| JP2020012791A (en) * | 2018-07-20 | 2020-01-23 | 日本セラミック株式会社 | Surface mount infrared detector |
-
1990
- 1990-11-28 JP JP12578590U patent/JPH0482875U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017017146A (en) * | 2015-06-30 | 2017-01-19 | 日亜化学工業株式会社 | Light-emitting device and light-emitting system |
| JP2020012791A (en) * | 2018-07-20 | 2020-01-23 | 日本セラミック株式会社 | Surface mount infrared detector |