JPS62160577U - - Google Patents
Info
- Publication number
- JPS62160577U JPS62160577U JP4886586U JP4886586U JPS62160577U JP S62160577 U JPS62160577 U JP S62160577U JP 4886586 U JP4886586 U JP 4886586U JP 4886586 U JP4886586 U JP 4886586U JP S62160577 U JPS62160577 U JP S62160577U
- Authority
- JP
- Japan
- Prior art keywords
- insertion hole
- electrical component
- lead wire
- fpc board
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図面は本考案の一実施例を示すもので、第1図
は第1実施例の断面図、第2図はその拡大図、第
3図はその分解斜視図、第4図は第2実施例の断
面図、第5図はその部分平面図、第6図は従来構
造の断面図、第7図はその分解斜視図、第8図は
従来構造の断面図である。
1……FPC板、2……回路パターン、3……
取付部材、4……電気部品、6……リード線、7
……差入穴、8……半田盛部。
The drawings show one embodiment of the present invention; Fig. 1 is a sectional view of the first embodiment, Fig. 2 is an enlarged view thereof, Fig. 3 is an exploded perspective view thereof, and Fig. 4 is a second embodiment. 5 is a partial plan view thereof, FIG. 6 is a sectional view of the conventional structure, FIG. 7 is an exploded perspective view thereof, and FIG. 8 is a sectional view of the conventional structure. 1... FPC board, 2... circuit pattern, 3...
Mounting member, 4... Electrical component, 6... Lead wire, 7
...insertion hole, 8...solder mound.
Claims (1)
気部品を設ける取付部材に電気部品のリード線を
差入し得る差入穴を形成し、該差入穴より突出す
るリード線を該FPC板の回路パターンに半田付
けするものにおいて、上記差入穴を上記半田付け
位置の半田盛部よりも大きくして構成したことを
特徴とする電気部品取付装置。 An FPC board is provided on one side, and an insertion hole into which the lead wire of the electrical component can be inserted is formed in a mounting member provided with the electrical component on the other side, and the lead wire protruding from the insertion hole is connected to the circuit of the FPC board. 1. An electrical component mounting device for soldering to a pattern, characterized in that the insertion hole is larger than the solder mound at the soldering position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4886586U JPS62160577U (en) | 1986-03-31 | 1986-03-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4886586U JPS62160577U (en) | 1986-03-31 | 1986-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62160577U true JPS62160577U (en) | 1987-10-13 |
Family
ID=30870796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4886586U Pending JPS62160577U (en) | 1986-03-31 | 1986-03-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62160577U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014082325A (en) * | 2012-10-16 | 2014-05-08 | Toshiba Corp | Electronic apparatus, method for manufacturing electronic apparatus, and flexible printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5585096A (en) * | 1978-12-22 | 1980-06-26 | Hitachi Ltd | Printed circuit board |
JPS58118188A (en) * | 1982-01-05 | 1983-07-14 | 松下電器産業株式会社 | Printed circuit board unit |
-
1986
- 1986-03-31 JP JP4886586U patent/JPS62160577U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5585096A (en) * | 1978-12-22 | 1980-06-26 | Hitachi Ltd | Printed circuit board |
JPS58118188A (en) * | 1982-01-05 | 1983-07-14 | 松下電器産業株式会社 | Printed circuit board unit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014082325A (en) * | 2012-10-16 | 2014-05-08 | Toshiba Corp | Electronic apparatus, method for manufacturing electronic apparatus, and flexible printed circuit board |