JPS62135367U - - Google Patents
Info
- Publication number
- JPS62135367U JPS62135367U JP1986022590U JP2259086U JPS62135367U JP S62135367 U JPS62135367 U JP S62135367U JP 1986022590 U JP1986022590 U JP 1986022590U JP 2259086 U JP2259086 U JP 2259086U JP S62135367 U JPS62135367 U JP S62135367U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- printed circuit
- circuit board
- terminal board
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例に示すリード線接続
装置の縦断面図、第２図は同上の平面図、第３図
は他の一実施例を示すリード線接続装置の縦断面
図、第４図は従来例のリード線接続装置の縦断面
図である。
１……プリント基板、２……端子板、４……リ
ード線挿入孔、５……リード線、８……半田。
FIG. 1 is a longitudinal sectional view of a lead wire connecting device according to an embodiment of the present invention, FIG. 2 is a plan view of the same, and FIG. 3 is a longitudinal sectional view of a lead wire connecting device according to another embodiment. FIG. 4 is a longitudinal sectional view of a conventional lead wire connecting device. 1... Printed circuit board, 2... Terminal board, 4... Lead wire insertion hole, 5... Lead wire, 8... Solder.
Claims (1)
端子板に半田接続するリード線とからなり、 前記プリント基板の前記端子板の周縁近傍にリ
ード線挿入孔を形成し、このリード線挿入孔に先
端を挿入したリード線を折曲げて前記端子板上に
半田接続したことを特徴とするリード線接続装置
。[Claims for Utility Model Registration] Consisting of a printed circuit board, a terminal board provided on the printed circuit board, and a lead wire connected to the terminal board by soldering, the lead wire is inserted near the periphery of the terminal board of the printed circuit board. A lead wire connecting device characterized in that a hole is formed, and a lead wire whose tip is inserted into the lead wire insertion hole is bent and soldered onto the terminal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986022590U JPS62135367U (en) | 1986-02-19 | 1986-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986022590U JPS62135367U (en) | 1986-02-19 | 1986-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62135367U true JPS62135367U (en) | 1987-08-26 |
Family
ID=30820118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986022590U Pending JPS62135367U (en) | 1986-02-19 | 1986-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62135367U (en) |
-
1986
- 1986-02-19 JP JP1986022590U patent/JPS62135367U/ja active Pending
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