JPH02138466U - - Google Patents
Info
- Publication number
- JPH02138466U JPH02138466U JP4760389U JP4760389U JPH02138466U JP H02138466 U JPH02138466 U JP H02138466U JP 4760389 U JP4760389 U JP 4760389U JP 4760389 U JP4760389 U JP 4760389U JP H02138466 U JPH02138466 U JP H02138466U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- thickness direction
- soldering
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案に係る半田付け部品の取付構
造を示す概略斜視図、第２図はこの考案に係る半
田付け部品を折り曲げる前の形状を示す平面図、
第３図はこの考案に係る半田付け部品をプリント
基板に搭載したときの状態を示す断面図、第４図
は従来のタブ端子を示す斜視図、第５図は第４図
に示すタブ端子をプリント基板に取付けたときの
状態を示す断面図、第６図は従来の他のタブ端子
を示す斜視図、第７図は第６図に示すタブ端子を
プリント基板に取付けたときの状態を示す断面図
である。
２……本体、２ｃ……側面、３……突起部、６
……プリント基板、６ａ……取付孔、４……脚部
、５……折曲部。
FIG. 1 is a schematic perspective view showing the mounting structure of the soldered parts according to this invention, and FIG. 2 is a plan view showing the shape of the soldered parts according to this invention before being bent.
Fig. 3 is a cross-sectional view showing the soldered parts according to this invention mounted on a printed circuit board, Fig. 4 is a perspective view showing a conventional tab terminal, and Fig. 5 is a tab terminal shown in Fig. 4. 6 is a perspective view showing another conventional tab terminal, and FIG. 7 is a sectional view showing the tab terminal shown in FIG. 6 when it is installed on a printed circuit board. FIG. 2...Body, 2c...Side, 3...Protrusion, 6
...Printed circuit board, 6a...Mounting hole, 4...Legs, 5...Bending portion.
Claims (1)
ると共にプリント基板側の取付孔に挿入して半田
付けする脚部を少なくとも２個以上有し、前記プ
リント基板上に実装する半田付け部品であつて、 前記プリント基板に挿入後の各脚部先端側にこ
の半田付け部品の厚さ方向で、かつ互いに逆方向
に折り曲げた折曲部を設け、 この折曲部と前記突起部とによりプリント基板
を上下方向から挟持した ことを特徴とする半田付け部品の取付構造。[Claims for Utility Model Registration] The device has a protrusion protruding from the side surface of the main body in the thickness direction, and has at least two legs that are inserted into mounting holes on the printed circuit board side and soldered thereto, and is mounted on the printed circuit board. The soldering component to be mounted is provided with a bent portion bent in the thickness direction of the soldering component and in opposite directions to each other on the tip end side of each leg after being inserted into the printed circuit board, and the bent portion and A mounting structure for soldering parts, characterized in that a printed circuit board is held between the projections from above and below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4760389U JPH02138466U (en) | 1989-04-21 | 1989-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4760389U JPH02138466U (en) | 1989-04-21 | 1989-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138466U true JPH02138466U (en) | 1990-11-19 |
Family
ID=31563676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4760389U Pending JPH02138466U (en) | 1989-04-21 | 1989-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138466U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (en) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | Heat sink |
-
1989
- 1989-04-21 JP JP4760389U patent/JPH02138466U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (en) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | Heat sink |
| JP4666165B2 (en) * | 2006-03-28 | 2011-04-06 | セイコーエプソン株式会社 | heatsink |