JPH01163343U - - Google Patents
Info
- Publication number
- JPH01163343U JPH01163343U JP5901888U JP5901888U JPH01163343U JP H01163343 U JPH01163343 U JP H01163343U JP 5901888 U JP5901888 U JP 5901888U JP 5901888 U JP5901888 U JP 5901888U JP H01163343 U JPH01163343 U JP H01163343U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- tip
- electrical component
- lead
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本案一実施例の部分斜視図、第２図は
第１図のものをプリント基板に取付けた状態の断
面図である。第３図と第４図は夫々従来の異なる
例の部分斜視図である。
１０……絶縁ケース、２１，２２……リード端
子、２４……プリント基板、２５……取付け孔。
FIG. 1 is a partial perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view of the device shown in FIG. 1 attached to a printed circuit board. FIG. 3 and FIG. 4 are partial perspective views of different conventional examples, respectively. 10... Insulating case, 21, 22... Lead terminal, 24... Printed circuit board, 25... Mounting hole.
Claims (1)
て突出された複数リード端子付電気部品において
、 前記各リード端子の先端が下方向に延びたもの
と、該下方向に延びたものの途中から横方向に延
びたものとを交互に配置して成る電気部品のリー
ド端子。 (2) 前記リード端子の先端が下方向に延びたも
のはプリント基板に穿設された取付け孔に挿通さ
れて裏面で半田付けされるとともに、横方向に延
びたものはプリント基板の表面で半田付けされる
請求項(1)記載の電気部品のリード端子。[Claims for Utility Model Registration] (1) An electrical component with multiple lead terminals in which a plurality of lead terminals protrude adjacently from an insulating case, with the tip of each lead terminal extending downward; A lead terminal for an electrical component that is made up of alternately arranged parts that extend downward and parts that extend laterally from the middle. (2) The tip of the lead terminal that extends downward is inserted into a mounting hole drilled in the printed circuit board and soldered on the back side, and the tip of the lead terminal that extends horizontally is soldered on the surface of the printed circuit board. A lead terminal for an electrical component according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5901888U JPH01163343U (en) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5901888U JPH01163343U (en) | 1988-04-30 | 1988-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163343U true JPH01163343U (en) | 1989-11-14 |
Family
ID=31284805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5901888U Pending JPH01163343U (en) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163343U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020050325A1 (en) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | Power semiconductor device, method of manufacturing same, and power conversion device |
| JP2021114513A (en) * | 2020-01-17 | 2021-08-05 | 富士電機株式会社 | Multilayer substrate circuit structure |
-
1988
- 1988-04-30 JP JP5901888U patent/JPH01163343U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020050325A1 (en) * | 2018-09-06 | 2020-03-12 | 三菱電機株式会社 | Power semiconductor device, method of manufacturing same, and power conversion device |
| CN112655087A (en) * | 2018-09-06 | 2021-04-13 | 三菱电机株式会社 | Power semiconductor device, method for manufacturing same, and power conversion device |
| JPWO2020050325A1 (en) * | 2018-09-06 | 2021-08-30 | 三菱電機株式会社 | Power semiconductor devices and their manufacturing methods, as well as power converters |
| US11631623B2 (en) | 2018-09-06 | 2023-04-18 | Mitsubishi Electric Corporation | Power semiconductor device and method of manufacturing the same, and power conversion device |
| CN112655087B (en) * | 2018-09-06 | 2024-08-13 | 三菱电机株式会社 | Power semiconductor device and method for manufacturing the same, and power conversion device |
| JP2021114513A (en) * | 2020-01-17 | 2021-08-05 | 富士電機株式会社 | Multilayer substrate circuit structure |
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