JPS6423884U - - Google Patents

Info

Publication number
JPS6423884U
JPS6423884U JP11962087U JP11962087U JPS6423884U JP S6423884 U JPS6423884 U JP S6423884U JP 11962087 U JP11962087 U JP 11962087U JP 11962087 U JP11962087 U JP 11962087U JP S6423884 U JPS6423884 U JP S6423884U
Authority
JP
Japan
Prior art keywords
pin
connector
lead portion
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11962087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11962087U priority Critical patent/JPS6423884U/ja
Publication of JPS6423884U publication Critical patent/JPS6423884U/ja
Pending legal-status Critical Current

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  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例による高密度コネクタ
の構造を示す一部破断斜視図、第２図は本実施例
の高密度コネクタの実装方法を示す側断面図、第
３図は従来の高密度コネクタの構造を示す一部破
断斜視図、第４図は従来の高密度コネクタの実装
を示す側断面図である。 図において、３はプリント基板、４は半田、１
１はコネクタピン、１１ａはリード部、１１ｂは
ピン部、１２は支持部材、１２ａは貫通孔を示す
。 Fig. 1 is a partially cutaway perspective view showing the structure of a high-density connector according to an embodiment of the present invention, Fig. 2 is a side sectional view showing the mounting method of the high-density connector of this embodiment, and Fig. 3 is a conventional FIG. 4 is a partially cutaway perspective view showing the structure of a high-density connector, and FIG. 4 is a side sectional view showing the mounting of a conventional high-density connector. In the figure, 3 is a printed circuit board, 4 is solder, 1
1 is a connector pin, 11a is a lead portion, 11b is a pin portion, 12 is a support member, and 12a is a through hole.

Claims (1)

【実用新案登録請求の範囲】 一方にプリント基板と接続する予備半田を施し
たリード部１１ａを配し、他方に他のコネクタと
結合するピン部１１ｂを設けたＬ字形のコネクタ
ピン１１と、 該リード部１１ａに対向して形成した貫通孔１
２ａを有することを特徴とする高密度コネクタの
構造。[Claims for Utility Model Registration] An L-shaped connector pin 11 having a pre-soldered lead portion 11a for connection to a printed circuit board on one side and a pin portion 11b for connecting to another connector on the other side; Through hole 1 formed opposite to lead portion 11a
A structure of a high-density connector characterized by having 2a.
JP11962087U 1987-08-03 1987-08-03 Pending JPS6423884U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11962087U JPS6423884U (en) 1987-08-03 1987-08-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11962087U JPS6423884U (en) 1987-08-03 1987-08-03

Publications (1)

Publication Number Publication Date
JPS6423884U true JPS6423884U (en) 1989-02-08

Family

ID=31365008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11962087U Pending JPS6423884U (en) 1987-08-03 1987-08-03

Country Status (1)

Country Link
JP (1) JPS6423884U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320875U (en) * 1989-07-10 1991-02-28
JPH04598A (en) * 1990-04-17 1992-01-06 Hochiki Corp Sensor board built-in structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320875U (en) * 1989-07-10 1991-02-28
JPH04598A (en) * 1990-04-17 1992-01-06 Hochiki Corp Sensor board built-in structure

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