JPH0252471U - - Google Patents
Info
- Publication number
- JPH0252471U JPH0252471U JP13215988U JP13215988U JPH0252471U JP H0252471 U JPH0252471 U JP H0252471U JP 13215988 U JP13215988 U JP 13215988U JP 13215988 U JP13215988 U JP 13215988U JP H0252471 U JPH0252471 U JP H0252471U
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- foot portion
- integrated circuit
- circuit device
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
図面は本考案の実施例を示し、第１図は混成集
積回路装置の斜視図、第２図は一部断面で示す正
面図、第３図は一部断面で示す側面図である。
１……混成集積回路装置、２……絶縁基板、３
，４……個別電子部品、５……外部接続端子、６
……母基板、７……孔、８，８……足部、９，９
……固着部、１０……取付け孔、１１……接当部
、１２，１３……半田。
The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of a hybrid integrated circuit device, FIG. 2 is a partially sectional front view, and FIG. 3 is a partially sectional side view. 1... Hybrid integrated circuit device, 2... Insulating substrate, 3
, 4...Individual electronic component, 5...External connection terminal, 6
... Mother board, 7 ... Hole, 8, 8 ... Foot section, 9, 9
...Fixed part, 10...Mounting hole, 11...Contact part, 12, 13...Solder.
Claims (1)
絶縁基板の一側から突出させて成る混成集積回路
装置において、前記絶縁基板に、前記外部接続端
子と同じ方向に延びる足部を突設し、該足部の表
面に設けた半田付け性を有する固着部を、前記足
部が嵌る母基板の取付け孔から当該母基板の裏面
側まで延長させたことを特徴とする混成集積回路
装置。 In a hybrid integrated circuit device comprising external connection terminals that are inserted into a motherboard and soldered to the motherboard and protrude from one side of an insulating substrate, the insulating substrate is provided with a protruding foot portion extending in the same direction as the external connection terminals, A hybrid integrated circuit device, characterized in that a solderable fixing portion provided on the surface of the foot portion extends from a mounting hole of the motherboard into which the foot portion fits to the back side of the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13215988U JPH0642371Y2 (en) | 1988-10-07 | 1988-10-07 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13215988U JPH0642371Y2 (en) | 1988-10-07 | 1988-10-07 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0252471U true JPH0252471U (en) | 1990-04-16 |
| JPH0642371Y2 JPH0642371Y2 (en) | 1994-11-02 |
Family
ID=31388869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13215988U Expired - Lifetime JPH0642371Y2 (en) | 1988-10-07 | 1988-10-07 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642371Y2 (en) |
-
1988
- 1988-10-07 JP JP13215988U patent/JPH0642371Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642371Y2 (en) | 1994-11-02 |