JPH0482872U - - Google Patents
Info
- Publication number
- JPH0482872U JPH0482872U JP12578290U JP12578290U JPH0482872U JP H0482872 U JPH0482872 U JP H0482872U JP 12578290 U JP12578290 U JP 12578290U JP 12578290 U JP12578290 U JP 12578290U JP H0482872 U JPH0482872 U JP H0482872U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- lead frame
- base
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 claims description 5
- 239000006071 cream Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係る横照射用表面実装型ＬＥ
Ｄの実施例の概略を示しており、Ａはその側面図
、Ｂはその底面図、Ｃはベースの正面図である。
第２図は、第１図の横照射用表面実装型ＬＥＤが
実装されるべきプリント基板の平面図である。第
３図は、従来の横照射用表面実装型ＬＥＤの一例
を示す正面図である。
１０……横照射用表面実装型ＬＥＤ、１１……
ＬＥＤ、１２……ベース、１２ａ……台座、１２
ｂ……取付部、１２ｃ……凹陥部、１２ｄ……貫
通孔、１２ｅ……貫通孔、１３……リードフレー
ム、１３ａ……リードフレームの先端部、１５…
…プリント基板、１６……導電パターン、１７…
…クリーム半田。
Figure 1 shows a surface-mounted LE for horizontal illumination according to the present invention.
The outline of the embodiment D is shown, A is a side view thereof, B is a bottom view thereof, and C is a front view of the base.
FIG. 2 is a plan view of a printed circuit board on which the surface-mounted LED for lateral illumination shown in FIG. 1 is to be mounted. FIG. 3 is a front view showing an example of a conventional surface-mounted LED for horizontal illumination. 10...Surface-mounted LED for horizontal illumination, 11...
LED, 12...base, 12a...pedestal, 12
b...Mounting portion, 12c...Concave portion, 12d...Through hole, 12e...Through hole, 13...Lead frame, 13a...Tip of lead frame, 15...
...Printed circuit board, 16...Conductive pattern, 17...
...Cream solder.
Claims (1)
に支持し、且つ該発光ダイオードから延出したリ
ードフレームを挿通する貫通孔が形成されたベー
スとでなり、上記リードフレームのベース裏面に
突出させた先端部を該裏面に沿つて曲折させたこ
とを特徴とする、横照射用表面実装型ＬＥＤ。 It consists of a light emitting diode and a base that supports the light emitting diode laterally and is formed with a through hole through which a lead frame extending from the light emitting diode is inserted, and has a tip portion protruding from the back surface of the base of the lead frame. A surface-mounted LED for horizontal illumination, characterized in that it is bent along the back surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578290U JPH0482872U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12578290U JPH0482872U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482872U true JPH0482872U (en) | 1992-07-20 |
Family
ID=31873368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12578290U Pending JPH0482872U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482872U (en) |
-
1990
- 1990-11-28 JP JP12578290U patent/JPH0482872U/ja active Pending