JPH0339863U - - Google Patents
Info
- Publication number
- JPH0339863U JPH0339863U JP10056189U JP10056189U JPH0339863U JP H0339863 U JPH0339863 U JP H0339863U JP 10056189 U JP10056189 U JP 10056189U JP 10056189 U JP10056189 U JP 10056189U JP H0339863 U JPH0339863 U JP H0339863U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- receiving element
- receiving
- circuit board
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図−１は本考案の一実施例に係る受発光素子実
装用回路基板の斜視図、図−２ないし図−４はそ
れぞれ従来の受発光素子実装用回路基板の断面図
である。
１……回路基板、３……パツド、４……受発光
素子、５……リード、７……凹部。
FIG. 1 is a perspective view of a circuit board for mounting light emitting/receiving elements according to an embodiment of the present invention, and FIGS. 2 to 4 are sectional views of conventional circuit boards for mounting light emitting/receiving elements, respectively. 1... Circuit board, 3... Pad, 4... Receiving/emitting element, 5... Lead, 7... Recess.
Claims (1)
その凹部は受発光素子を装着すると、そのリード
がパツド上に位置するように形成されていること
を特徴とする受発光素子実装用回路基板。 It has a concave part in the peripheral part in which the light receiving and emitting elements are mounted,
1. A circuit board for mounting a light emitting/receiving element, wherein the recess is formed such that when the light emitting/receiving element is mounted, a lead thereof is located on a pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10056189U JPH0339863U (en) | 1989-08-30 | 1989-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10056189U JPH0339863U (en) | 1989-08-30 | 1989-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339863U true JPH0339863U (en) | 1991-04-17 |
Family
ID=31649562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10056189U Pending JPH0339863U (en) | 1989-08-30 | 1989-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339863U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008140792A (en) * | 2006-11-29 | 2008-06-19 | Fujitsu Ltd | Electronic component and its manufacturing process, electronic component assembly and electronic device |
| JP2011017528A (en) * | 2010-08-23 | 2011-01-27 | Daikin Industries Ltd | Circuit board and air conditioner |
| JP2011513956A (en) * | 2008-02-29 | 2011-04-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Support device comprising a small casing and at least one small casing |
-
1989
- 1989-08-30 JP JP10056189U patent/JPH0339863U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008140792A (en) * | 2006-11-29 | 2008-06-19 | Fujitsu Ltd | Electronic component and its manufacturing process, electronic component assembly and electronic device |
| JP2011513956A (en) * | 2008-02-29 | 2011-04-28 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Support device comprising a small casing and at least one small casing |
| JP2011017528A (en) * | 2010-08-23 | 2011-01-27 | Daikin Industries Ltd | Circuit board and air conditioner |