JPS63131116U - - Google Patents
Info
- Publication number
- JPS63131116U JPS63131116U JP2316287U JP2316287U JPS63131116U JP S63131116 U JPS63131116 U JP S63131116U JP 2316287 U JP2316287 U JP 2316287U JP 2316287 U JP2316287 U JP 2316287U JP S63131116 U JPS63131116 U JP S63131116U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- protrusion
- electrode
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例の正
面図及び底面図、第２図、第３図はそれぞれ本考
案のチツプ素子を回路基板に搭載した混成ＩＣの
分解斜視図及び断面図、第４図は従来のチツプ素
子を回路基板に搭載した混成ＩＣの分解斜視図で
ある。
１……チツプ素子、２ａ，２ｂ……電極、２ａ
′，２ｂ′……突起部、３ａ，３ｂ……スルーホ
ール、４……レジスト膜、５ａ，５ｂ……素子取
付パターン、６……回路基板、７ａ，７ｂ……配
線パターン、８……フローテイングパターン。
Figures 1a and b are respectively a front view and a bottom view of an embodiment of the present invention, and Figures 2 and 3 are an exploded perspective view and a sectional view, respectively, of a hybrid IC in which the chip element of the present invention is mounted on a circuit board. , FIG. 4 is an exploded perspective view of a hybrid IC in which conventional chip elements are mounted on a circuit board. 1... Chip element, 2a, 2b... Electrode, 2a
', 2b'...Protrusion, 3a, 3b...Through hole, 4...Resist film, 5a, 5b...Element mounting pattern, 6...Circuit board, 7a, 7b...Wiring pattern, 8...Flow Teing pattern.
Claims (1)
に設けられていることを特徴とするチツプ素子。 A chip element characterized in that an electrode is provided with a protrusion that is inserted into a through hole of a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2316287U JPS63131116U (en) | 1987-02-18 | 1987-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2316287U JPS63131116U (en) | 1987-02-18 | 1987-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131116U true JPS63131116U (en) | 1988-08-26 |
Family
ID=30821208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2316287U Pending JPS63131116U (en) | 1987-02-18 | 1987-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131116U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7355504B2 (en) | 1992-07-09 | 2008-04-08 | Tyco Electronics Corporation | Electrical devices |
| JP2016192466A (en) * | 2015-03-31 | 2016-11-10 | 株式会社村田製作所 | Multilayer chip component and multilayer chip component stack |
-
1987
- 1987-02-18 JP JP2316287U patent/JPS63131116U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7355504B2 (en) | 1992-07-09 | 2008-04-08 | Tyco Electronics Corporation | Electrical devices |
| JP2016192466A (en) * | 2015-03-31 | 2016-11-10 | 株式会社村田製作所 | Multilayer chip component and multilayer chip component stack |