JPS6355469U - - Google Patents
Info
- Publication number
- JPS6355469U JPS6355469U JP14794586U JP14794586U JPS6355469U JP S6355469 U JPS6355469 U JP S6355469U JP 14794586 U JP14794586 U JP 14794586U JP 14794586 U JP14794586 U JP 14794586U JP S6355469 U JPS6355469 U JP S6355469U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- land portion
- pad portion
- portion provided
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａおよびｂおよびｃは本考案の一実施例
の平面図および底面図およびＡ―Ａ線断面図、第
２図は、第１図の実施例にチツプ部品を実装する
ときの手順を示す断面図、第３図ａおよびｂおよ
びｃは、従来の印刷配線板の一例を示す平面図お
よび底面図およびＢ―Ｂ線断面図である。
１……基板、２，２ｂ……パツト部、２ａ……
スルーホールパツト部、３……配線パターン、４
……ランド、４ａ，１４ａ……スルーホール導通
孔、５……ペーストはんだ、６……接着剤、７…
…チツプ部品、８……ソルダレジスト、９，１９
……印刷配線板。
Figures 1a, b, and c are a top view, bottom view, and cross-sectional view taken along line A--A of an embodiment of the present invention, and Figure 2 shows the procedure for mounting chip components on the embodiment of Figure 1. The cross-sectional views shown in FIGS. 3A, 3B, and 3C are a top view, a bottom view, and a sectional view taken along the line B--B of an example of a conventional printed wiring board. 1... Board, 2, 2b... Parts part, 2a...
Through-hole patch part, 3... Wiring pattern, 4
...Land, 4a, 14a...Through-hole conduction hole, 5...Paste solder, 6...Adhesive, 7...
...Chip parts, 8...Solder resist, 9,19
...Printed wiring board.
Claims (1)
リード端子を搭載するのに充分な大きさの外形寸
法を有し内部にスルーホール導通孔を有するスル
ーホールパツト部と、前記スルーホールパツト部
を設けた面と反対側の面に設けられ前記スルーホ
ール導通孔と接続するランド部と、前記ランド部
と接続する配線パターンとを備え、前記ランド部
側の前記スルーホール導通孔がソルダレジストに
よつて被覆されていることを特徴とする印刷配線
板。 A through-hole pad portion provided on the front or back surface of the board and having external dimensions large enough to mount a lead terminal of a chip component and having a through-hole conduction hole inside, and the through-hole pad portion are provided. A land portion provided on a surface opposite to the surface and connected to the through-hole conductive hole, and a wiring pattern connected to the land portion, and the through-hole conductive hole on the land portion side is covered with a solder resist. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14794586U JPS6355469U (en) | 1986-09-26 | 1986-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14794586U JPS6355469U (en) | 1986-09-26 | 1986-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355469U true JPS6355469U (en) | 1988-04-13 |
Family
ID=31061770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14794586U Pending JPS6355469U (en) | 1986-09-26 | 1986-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355469U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078290A (en) * | 2006-09-20 | 2008-04-03 | Nec Corp | Printed circuit board and method for manufacturing the same |
-
1986
- 1986-09-26 JP JP14794586U patent/JPS6355469U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078290A (en) * | 2006-09-20 | 2008-04-03 | Nec Corp | Printed circuit board and method for manufacturing the same |