JPS62149870U - - Google Patents
Info
- Publication number
- JPS62149870U JPS62149870U JP3540386U JP3540386U JPS62149870U JP S62149870 U JPS62149870 U JP S62149870U JP 3540386 U JP3540386 U JP 3540386U JP 3540386 U JP3540386 U JP 3540386U JP S62149870 U JPS62149870 U JP S62149870U
- Authority
- JP
- Japan
- Prior art keywords
- flexible film
- terminal
- electronic component
- board
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図および第２図は各々本考案に係る半導体
パツケージの各別の例の構成説明図、第３図は従
来の半導体パツケージの構成説明図である。
１，５，１０，１１……パツケージ、２……フ
レキシブルフイルム、３，１２……リード、６，
１３……電極端子。
1 and 2 are respectively explanatory views of the configuration of different examples of the semiconductor package according to the present invention, and FIG. 3 is an explanatory view of the configuration of a conventional semiconductor package. 1, 5, 10, 11...Package, 2...Flexible film, 3,12...Lead, 6,
13... Electrode terminal.
Claims (1)
端子を接続して該電子部品を基板上に搭載する電
子部品の実装構造において、電子部品の端子と基
板の端子パターンとをフレキシブルフイルム上に
設けたリード部を介して接続したことを特徴とす
る電子部品の実装構造。 ２ 前記フレキシブルフイルム上に形成したリー
ド部は先端が該フレキシブルフイルムの外側に突
出し、該突出先端部が基板上の端子パターンに接
合されたことを特徴とする実用新案登録請求の範
囲第１項記載の電子部品の実装構造。 ３ 前記フレキシブルフイルム上に設けたリード
部の一端を電子部品下面の電極端子に接合し、該
フレキシブルフイルムの裏面を内側にして該フレ
キシブルフイルムを折返すことにより該フレキシ
ブルフイルム表面のリード部の他端部を基板の端
子パターンに対面させて接合したことを特徴とす
る実用新案登録請求の範囲第１項記載の電子部品
の実装構造。[Claims for Utility Model Registration] 1. In an electronic component mounting structure in which a terminal of an electronic component is connected to a terminal pattern provided on a board and the electronic component is mounted on the board, the terminal of the electronic component and the terminal of the board A mounting structure for electronic components, characterized in that a pattern is connected to the pattern via a lead section provided on a flexible film. 2. Utility model registration claim 1, characterized in that the lead portion formed on the flexible film has a tip protruding outside the flexible film, and the protruding tip portion is joined to a terminal pattern on a substrate. Mounting structure of electronic components. 3. One end of the lead portion provided on the flexible film is joined to an electrode terminal on the bottom surface of the electronic component, and the other end of the lead portion on the surface of the flexible film is bonded by folding the flexible film with the back side of the flexible film facing inside. A mounting structure for an electronic component according to claim 1, characterized in that the part is bonded so as to face the terminal pattern of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3540386U JPS62149870U (en) | 1986-03-13 | 1986-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3540386U JPS62149870U (en) | 1986-03-13 | 1986-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62149870U true JPS62149870U (en) | 1987-09-22 |
Family
ID=30844859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3540386U Pending JPS62149870U (en) | 1986-03-13 | 1986-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149870U (en) |
-
1986
- 1986-03-13 JP JP3540386U patent/JPS62149870U/ja active Pending