JPH0375546U - - Google Patents
Info
- Publication number
- JPH0375546U JPH0375546U JP13689089U JP13689089U JPH0375546U JP H0375546 U JPH0375546 U JP H0375546U JP 13689089 U JP13689089 U JP 13689089U JP 13689089 U JP13689089 U JP 13689089U JP H0375546 U JPH0375546 U JP H0375546U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lead
- semiconductor device
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面、正面、側面
図、第２図は本考案の要部の側面図、第３図、第
４図は本考案の一実施例の製造方法を説明するた
めの図、第５図は従来の一例の側面図、第６図、
第７図は夫々従来の一例の要部の側面図である。
１……リード、２……パツケージ、３……接続
部、４……底面、６……プリント配線基板。
Figure 1 is a plan, front, and side view of an embodiment of the present invention; Figure 2 is a side view of the main parts of the invention; Figures 3 and 4 illustrate a manufacturing method of an embodiment of the invention. Figure 5 is a side view of a conventional example, Figure 6 is a diagram for
FIG. 7 is a side view of the main parts of each conventional example. 1...Lead, 2...Package, 3...Connection part, 4...Bottom surface, 6...Printed wiring board.
Claims (1)
接続されたリードをプリント配線基板の表面に当
接させて該半導体装置と該プリント配線基板とを
電気的に接続する電子部品のリード構造において
、 前記リードの前記プリント配線基板との接続部を
前記プリント配線基板面に対して傾斜した構造と
し、かつ前記リードの先端部は該プリント配線基
板側と反対方向に変形してなる電子部品のリード
構造。[Claim for Utility Model Registration] An electronic device that electrically connects a semiconductor device and a printed wiring board by bringing a lead electrically connected to a semiconductor device contained in a package into contact with the surface of the printed wiring board. In the lead structure of the component, the connecting portion of the lead to the printed wiring board is inclined with respect to the printed wiring board surface, and the tip of the lead is deformed in a direction opposite to the printed wiring board side. The lead structure of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13689089U JPH0375546U (en) | 1989-11-28 | 1989-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13689089U JPH0375546U (en) | 1989-11-28 | 1989-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375546U true JPH0375546U (en) | 1991-07-29 |
Family
ID=31684075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13689089U Pending JPH0375546U (en) | 1989-11-28 | 1989-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375546U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006254600A (en) * | 2005-03-10 | 2006-09-21 | Asmo Co Ltd | Circuit component |
-
1989
- 1989-11-28 JP JP13689089U patent/JPH0375546U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006254600A (en) * | 2005-03-10 | 2006-09-21 | Asmo Co Ltd | Circuit component |