JPS61156265U - - Google Patents
Info
- Publication number
- JPS61156265U JPS61156265U JP3963585U JP3963585U JPS61156265U JP S61156265 U JPS61156265 U JP S61156265U JP 3963585 U JP3963585 U JP 3963585U JP 3963585 U JP3963585 U JP 3963585U JP S61156265 U JPS61156265 U JP S61156265U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode
- leadless electronic
- leadless
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図はこの考案の一実施例にかかわるリード
レス電子部品の構成を略示した説明図、第2図は
第1図に示したリードレス電子部品の作用の説明
図、第3図はこの考案のその他の実施例の説明図
、第4図は従来のリードレス電子部品の説明図を
示している。
1……ダイオード素子、3……ジユメツト線、
4……ガラス、5……電極、7……プリント基板
、9……クリーム半田。
FIG. 1 is an explanatory diagram schematically showing the structure of a leadless electronic component according to an embodiment of this invention, FIG. 2 is an explanatory diagram of the operation of the leadless electronic component shown in FIG. 1, and FIG. An explanatory diagram of another embodiment of the invention, FIG. 4 shows an explanatory diagram of a conventional leadless electronic component. 1... Diode element, 3... Dimension wire,
4...Glass, 5...Electrode, 7...Printed circuit board, 9...Cream solder.
Claims (1)
ードレス電子部品において、前記電極には少なく
とも基板表面に当接する下面側に、下面端縁から
外方に向けて張り出すように傾斜した傾斜面を形
成されていることを特徴とするリードレス電子部
品。 In a leadless electronic component including an electrode along an end surface of an electronic component main body, the electrode has an inclined surface extending outward from an edge of the lower surface at least on the lower surface side that contacts the substrate surface. A leadless electronic component characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3963585U JPS61156265U (en) | 1985-03-18 | 1985-03-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3963585U JPS61156265U (en) | 1985-03-18 | 1985-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61156265U true JPS61156265U (en) | 1986-09-27 |
Family
ID=30547766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3963585U Pending JPS61156265U (en) | 1985-03-18 | 1985-03-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61156265U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016219625A (en) * | 2015-05-21 | 2016-12-22 | ローム株式会社 | Chip resistor and manufacturing method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948001B2 (en) * | 1976-12-27 | 1984-11-22 | 三菱レイヨン株式会社 | Emulsion polymerization method of vinyl monomer |
-
1985
- 1985-03-18 JP JP3963585U patent/JPS61156265U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5948001B2 (en) * | 1976-12-27 | 1984-11-22 | 三菱レイヨン株式会社 | Emulsion polymerization method of vinyl monomer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016219625A (en) * | 2015-05-21 | 2016-12-22 | ローム株式会社 | Chip resistor and manufacturing method thereof |
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