JPS6170967U - - Google Patents
Info
- Publication number
- JPS6170967U JPS6170967U JP15651984U JP15651984U JPS6170967U JP S6170967 U JPS6170967 U JP S6170967U JP 15651984 U JP15651984 U JP 15651984U JP 15651984 U JP15651984 U JP 15651984U JP S6170967 U JPS6170967 U JP S6170967U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- recess
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す図で、ａは平
面図、ｂはａのＡ−Ａ断面図、第２図は従来例を
示す図で、ａは平面図、ｂはａのＡ−Ａ断面図を
示すものである。
１……基板本体、２……銅箔、３……電子部品
、３ａ……リード線、４……凹部。
Fig. 1 is a diagram showing one embodiment of the present invention, a is a plan view, b is a sectional view taken along line A-A of a, and Fig. 2 is a diagram showing a conventional example, a is a plan view, and b is a diagram of a. It shows a sectional view taken along line A-A. DESCRIPTION OF SYMBOLS 1... Board body, 2... Copper foil, 3... Electronic components, 3a... Lead wire, 4... Recessed part.
Claims (1)
品取付構造において、前記電子部品のリード線と
、前記電子部品のリード線に対応して形成された
凹部と、前記凹部の底面に形成された銅箔とを具
備するプリント基板とからなり、前記電子部品の
リード線を前記凹部に嵌入し、半田付けすること
を特徴とする電子部品取付構造。 An electronic component mounting structure for mounting an electronic component on the surface of a printed circuit board, comprising a lead wire of the electronic component, a recess formed to correspond to the lead wire of the electronic component, and a copper foil formed on the bottom of the recess. 1. An electronic component mounting structure comprising a printed circuit board, wherein a lead wire of the electronic component is inserted into the recess and soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15651984U JPS6170967U (en) | 1984-10-17 | 1984-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15651984U JPS6170967U (en) | 1984-10-17 | 1984-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6170967U true JPS6170967U (en) | 1986-05-15 |
Family
ID=30714525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15651984U Pending JPS6170967U (en) | 1984-10-17 | 1984-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6170967U (en) |
-
1984
- 1984-10-17 JP JP15651984U patent/JPS6170967U/ja active Pending
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