JPS61158955U - - Google Patents
Info
- Publication number
- JPS61158955U JPS61158955U JP4156485U JP4156485U JPS61158955U JP S61158955 U JPS61158955 U JP S61158955U JP 4156485 U JP4156485 U JP 4156485U JP 4156485 U JP4156485 U JP 4156485U JP S61158955 U JPS61158955 U JP S61158955U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- protrusion
- electrode structure
- ceramic chip
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案のチツプキヤリアの電極構造
の一実施例の斜視図、第２図は第１図のチツプキ
ヤリアの構造における電極構造部の拡大斜視図、
第３図はこの考案のチツプキヤリアの電極構造を
プリント基板に搭載した際の断面図、第４図はこ
の考案のチツプキヤリアの電極構造の他の実施例
をプリント基板に搭載した際の断面図、第５図は
従来のチツプキヤリアの電極構造をプリント基板
に搭載した状態の断面図である。
１…ＩＣチツプ、２…メタライズ導体、３…パ
ツケージ、４…プリント基板、５…導体、６…半
田付け、７…間隙、８…ケース、９…突起部、１
０…突起部の側面、１１…フイレツト。
FIG. 1 is a perspective view of an embodiment of the electrode structure of the chip carrier of this invention, FIG. 2 is an enlarged perspective view of the electrode structure in the structure of the chip carrier of FIG.
Figure 3 is a cross-sectional view of the chip carrier electrode structure of this invention mounted on a printed circuit board, and Figure 4 is a cross-sectional view of another embodiment of the chip carrier electrode structure of this invention mounted on a printed circuit board. FIG. 5 is a sectional view of the conventional chip carrier electrode structure mounted on a printed circuit board. DESCRIPTION OF SYMBOLS 1...IC chip, 2...Metallized conductor, 3...Package, 4...Printed circuit board, 5...Conductor, 6...Soldering, 7...Gap, 8...Case, 9...Protrusion, 1
0...Side surface of protrusion, 11...Fillet.
Claims (1)
て、セラミツクチツプキヤリア底部に突起部を設
け、この突起部に電極を形成したことを特徴とす
るチツプキヤリアの電極構造。 An electrode structure for a ceramic chip carrier, characterized in that a protrusion is provided at the bottom of the ceramic chip carrier, and an electrode is formed on the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156485U JPS61158955U (en) | 1985-03-25 | 1985-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156485U JPS61158955U (en) | 1985-03-25 | 1985-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61158955U true JPS61158955U (en) | 1986-10-02 |
Family
ID=30551510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156485U Pending JPS61158955U (en) | 1985-03-25 | 1985-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158955U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459621U (en) * | 1990-09-29 | 1992-05-21 |
-
1985
- 1985-03-25 JP JP4156485U patent/JPS61158955U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459621U (en) * | 1990-09-29 | 1992-05-21 |