JPS63128737U - - Google Patents

Info

Publication number
JPS63128737U
JPS63128737U JP2153087U JP2153087U JPS63128737U JP S63128737 U JPS63128737 U JP S63128737U JP 2153087 U JP2153087 U JP 2153087U JP 2153087 U JP2153087 U JP 2153087U JP S63128737 U JPS63128737 U JP S63128737U
Authority
JP
Japan
Prior art keywords
chip carrier
leadless chip
recess
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2153087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2153087U priority Critical patent/JPS63128737U/ja
Publication of JPS63128737U publication Critical patent/JPS63128737U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の側面図、第2図は、
従来のリードレスチツプキヤリアを基板上に実装
したものの側面図、第3図は本考案のリードレス
チツプキヤリアの底面図である。 1……リードレスチツプキヤリア、2……基板
、3……基板上に形成された電極パターン、4…
…リードレスチツプキヤリア底面に形成された電
極パターン、5……底面、6……へこみ。
FIG. 1 is a side view of an embodiment of the present invention, and FIG. 2 is a side view of an embodiment of the present invention.
FIG. 3 is a side view of a conventional leadless chip carrier mounted on a board, and FIG. 3 is a bottom view of the leadless chip carrier of the present invention. DESCRIPTION OF SYMBOLS 1... Leadless chip carrier, 2... Substrate, 3... Electrode pattern formed on the substrate, 4...
... Electrode pattern formed on the bottom surface of the leadless chip carrier, 5 ... bottom surface, 6 ... recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレスチツプキヤリアにおいて、底面部の
隣接する電極間にへこみをつけたことを特徴とす
るリードレスチツプキヤリア。
A leadless chip carrier characterized in that a recess is formed between adjacent electrodes on the bottom surface.
JP2153087U 1987-02-16 1987-02-16 Pending JPS63128737U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2153087U JPS63128737U (en) 1987-02-16 1987-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2153087U JPS63128737U (en) 1987-02-16 1987-02-16

Publications (1)

Publication Number Publication Date
JPS63128737U true JPS63128737U (en) 1988-08-23

Family

ID=30818052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2153087U Pending JPS63128737U (en) 1987-02-16 1987-02-16

Country Status (1)

Country Link
JP (1) JPS63128737U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857742A (en) * 1981-10-01 1983-04-06 Nec Corp Chip carrier

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857742A (en) * 1981-10-01 1983-04-06 Nec Corp Chip carrier

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