JPS61140569U - - Google Patents
Info
- Publication number
- JPS61140569U JPS61140569U JP2408685U JP2408685U JPS61140569U JP S61140569 U JPS61140569 U JP S61140569U JP 2408685 U JP2408685 U JP 2408685U JP 2408685 U JP2408685 U JP 2408685U JP S61140569 U JPS61140569 U JP S61140569U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- chip component
- electrode connection
- connection pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004308 accommodation Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例で、ａは平面図、ｂは
Ｘ―Ｙ矢視断面図である。第２図および第３図は
共に他の実施例で、第１図と同様位置のＸ―Ｙ矢
視断面図で示されている。第４図は従来のプリン
ト基板を示し、ａは正面図、ｂは側面図である。
１……本考案によるプリント基板、２……チツ
プ部品収容孔、３ａ，３ｂ……電極接続用パター
ン、４ａ，４ｂ……半田、５……チツプ部品、５
ａ，５ｂ……チツプ部品の電極、６ａ，６ｂ……
ストツパ。
FIG. 1 shows an embodiment of the present invention, in which a is a plan view and b is a sectional view taken along the line X--Y. Both FIGS. 2 and 3 are other embodiments, and are shown in cross-sectional views along the X-Y arrows at the same position as in FIG. 1. FIG. 4 shows a conventional printed circuit board, in which a is a front view and b is a side view. DESCRIPTION OF SYMBOLS 1... Printed circuit board according to the present invention, 2... Chip component accommodation hole, 3a, 3b... Electrode connection pattern, 4a, 4b... Solder, 5... Chip component, 5
a, 5b...electrodes of chip parts, 6a, 6b...
Stotspa.
Claims (1)
、前記チツプ部品の形状に適合する収容孔を有し
、この収容孔の１つの隅に隣接する基板上面に電
極接続用パターンが設けられ、この基板上面パタ
ーンに対し収容孔についての対角線位置にある基
板下面に他の電極接続用パターンが設けられてい
ることを特徴とするプリント基板。 A printed circuit board on which a chip component or the like is mounted has a housing hole that matches the shape of the chip component, and an electrode connection pattern is provided on the top surface of the board adjacent to one corner of the housing hole. A printed circuit board characterized in that another electrode connection pattern is provided on the lower surface of the board at a diagonal position with respect to the accommodation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2408685U JPS61140569U (en) | 1985-02-21 | 1985-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2408685U JPS61140569U (en) | 1985-02-21 | 1985-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61140569U true JPS61140569U (en) | 1986-08-30 |
Family
ID=30517913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2408685U Pending JPS61140569U (en) | 1985-02-21 | 1985-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61140569U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277568A (en) * | 2007-04-27 | 2008-11-13 | Victor Co Of Japan Ltd | Electronic component housing substrate and manufacturing method therefor |
| JP2016010093A (en) * | 2014-06-26 | 2016-01-18 | 京セラクリスタルデバイス株式会社 | Crystal device |
-
1985
- 1985-02-21 JP JP2408685U patent/JPS61140569U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008277568A (en) * | 2007-04-27 | 2008-11-13 | Victor Co Of Japan Ltd | Electronic component housing substrate and manufacturing method therefor |
| JP2016010093A (en) * | 2014-06-26 | 2016-01-18 | 京セラクリスタルデバイス株式会社 | Crystal device |