JPS6186970U - - Google Patents

Info

Publication number
JPS6186970U
JPS6186970U JP17100384U JP17100384U JPS6186970U JP S6186970 U JPS6186970 U JP S6186970U JP 17100384 U JP17100384 U JP 17100384U JP 17100384 U JP17100384 U JP 17100384U JP S6186970 U JPS6186970 U JP S6186970U
Authority
JP
Japan
Prior art keywords
insulating substrate
electrode
notch
electronic component
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17100384U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17100384U priority Critical patent/JPS6186970U/ja
Publication of JPS6186970U publication Critical patent/JPS6186970U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図はこの考案の一実施例を示し、第1図は半導
体チツプを埋め込む過程を示す工程図、第2図は
第1図dの状態の平面図、第3図は各種の電子部
品を塔載した状態の要部断面図である。 1……絶縁基板、2……切欠部、3……半導体
チツプ、5……電極パターン。
The figure shows an embodiment of this invention, Fig. 1 is a process diagram showing the process of embedding a semiconductor chip, Fig. 2 is a plan view of the state shown in Fig. FIG. 1... Insulating substrate, 2... Notch, 3... Semiconductor chip, 5... Electrode pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 切欠部を有する絶縁基板と、この絶縁基板の切
欠部内に配設され且つ上面に電極を形成した電子
部品と、前記絶縁基板の表面および前記電子部品
の電極上に形成される電極パターンとを具備して
なる回路基板。
An insulating substrate having a notch, an electronic component disposed in the notch of the insulating substrate and having an electrode formed on its upper surface, and an electrode pattern formed on the surface of the insulating substrate and the electrode of the electronic component. A circuit board made of
JP17100384U 1984-11-13 1984-11-13 Pending JPS6186970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17100384U JPS6186970U (en) 1984-11-13 1984-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17100384U JPS6186970U (en) 1984-11-13 1984-11-13

Publications (1)

Publication Number Publication Date
JPS6186970U true JPS6186970U (en) 1986-06-07

Family

ID=30728708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17100384U Pending JPS6186970U (en) 1984-11-13 1984-11-13

Country Status (1)

Country Link
JP (1) JPS6186970U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
JPH11262537A (en) * 1997-12-12 1999-09-28 Ela Medical Sa Electronic circuit for active implantable medical device and method of manufacture
JP2010157669A (en) * 2009-01-05 2010-07-15 Seiko Instruments Inc Electronic circuit component and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board
JPH11262537A (en) * 1997-12-12 1999-09-28 Ela Medical Sa Electronic circuit for active implantable medical device and method of manufacture
JP2010157669A (en) * 2009-01-05 2010-07-15 Seiko Instruments Inc Electronic circuit component and electronic apparatus

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