JPH0221776U - - Google Patents
Info
- Publication number
- JPH0221776U JPH0221776U JP10071888U JP10071888U JPH0221776U JP H0221776 U JPH0221776 U JP H0221776U JP 10071888 U JP10071888 U JP 10071888U JP 10071888 U JP10071888 U JP 10071888U JP H0221776 U JPH0221776 U JP H0221776U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductor pattern
- heat transfer
- transfer layer
- insulating heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係わる金属基板形ＩＣの一実
施例を示す断面図、第２図および第３図は従来の
ものと本考案のものとの作業順序の比較図、第４
図は従来の一般的な金属基板形ＩＣの側面図、第
５図は従来のワイヤボンデイングによる導体パタ
ーンと金属基板との接続状態を説明する金属基板
形ＩＣの断面図である。
１１…金属基板、１２…絶縁伝熱層、１３…導
体パターン、１４…電子部品、１５…切り欠き穴
、１６…導電性部材、１７…半田。
FIG. 1 is a sectional view showing an embodiment of a metal substrate type IC according to the present invention, FIGS. 2 and 3 are comparison diagrams of the work order of the conventional IC and the present invention,
The figure is a side view of a conventional general metal substrate type IC, and FIG. 5 is a sectional view of the metal substrate type IC, illustrating the state of connection between a conductor pattern and a metal substrate by conventional wire bonding. DESCRIPTION OF SYMBOLS 11... Metal substrate, 12... Insulating heat transfer layer, 13... Conductor pattern, 14... Electronic component, 15... Notch hole, 16... Conductive member, 17... Solder.
Claims (1)
する導体パターン１３を形成すると共にこの導体
パターン上に電子部品１４を組み込んだＩＣ本体
１１〜１４と、前記導体パターン、前記絶縁伝熱
層および前記金属基板の面位置より所定の下方位
置に跨がつて貫通された切り欠き穴１５と、この
切り欠き穴に圧入嵌合され前記導体パターンと前
記金属基板とを電気的に接続する導電性部材１６
とを備えてなることを特徴とする金属基板形ＩＣ
。 IC bodies 11 to 14 in which a desired conductor pattern 13 is formed on the surface of the insulating heat transfer layer 12 on the metal substrate 11 and electronic components 14 are incorporated on the conductor pattern, the conductor pattern, and the insulating heat transfer layer. and a notch hole 15 that is passed through the metal substrate at a predetermined position below the plane thereof, and a conductive material that is press-fitted into the notch hole and electrically connects the conductive pattern and the metal substrate. Member 16
A metal substrate type IC characterized by comprising:
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10071888U JPH0221776U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10071888U JPH0221776U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221776U true JPH0221776U (en) | 1990-02-14 |
Family
ID=31329047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10071888U Pending JPH0221776U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019145077A1 (en) * | 2018-01-23 | 2019-08-01 | Robert Bosch Gmbh | Circuit substrate arrangement with improved electrical contact |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122190A (en) * | 1980-02-29 | 1981-09-25 | Matsushita Electric Works Ltd | Electric circuit board unit |
| JPS5843594A (en) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | Metallic core printed circuit board |
| JPS5843595A (en) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | Metallic core printed circuit board |
-
1988
- 1988-07-29 JP JP10071888U patent/JPH0221776U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122190A (en) * | 1980-02-29 | 1981-09-25 | Matsushita Electric Works Ltd | Electric circuit board unit |
| JPS5843594A (en) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | Metallic core printed circuit board |
| JPS5843595A (en) * | 1981-09-09 | 1983-03-14 | 住友電気工業株式会社 | Metallic core printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019145077A1 (en) * | 2018-01-23 | 2019-08-01 | Robert Bosch Gmbh | Circuit substrate arrangement with improved electrical contact |
| CN111602237A (en) * | 2018-01-23 | 2020-08-28 | 罗伯特·博世有限公司 | Circuit-base device with improved electrical contact |
| CN111602237B (en) * | 2018-01-23 | 2023-09-26 | 罗伯特·博世有限公司 | Circuit base device with improved electrical contact |