JPS6185177U - - Google Patents
Info
- Publication number
- JPS6185177U JPS6185177U JP1984169223U JP16922384U JPS6185177U JP S6185177 U JPS6185177 U JP S6185177U JP 1984169223 U JP1984169223 U JP 1984169223U JP 16922384 U JP16922384 U JP 16922384U JP S6185177 U JPS6185177 U JP S6185177U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- slit
- notch
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案によるプリント配線基板にコネ
クタが実装された状態の一例を示す側面図、第２
図は第１図中の本考案基板部分を矢印Ａ方向から
示した図、第３図及び第４図は各々本考案基板の
他の実施例を示す図である。
１…メタルコネクタ、２…メタルコネクタピン
、３…プリント配線基板、４…スリツト、５…リ
ード線、６…半田付け部分、９…切込み。
Fig. 1 is a side view showing an example of a state in which a connector is mounted on a printed wiring board according to the present invention;
The figure is a view showing the substrate portion of the present invention in FIG. 1 from the direction of arrow A, and FIGS. 3 and 4 are views showing other embodiments of the substrate of the present invention, respectively. 1...Metal connector, 2...Metal connector pin, 3...Printed wiring board, 4...Slit, 5...Lead wire, 6...Soldering part, 9...Notch.
Claims (1)
るプリント配線基板において、基板ベースを可撓
性材料で構成すると共に、前記接触子の半田付け
部分周囲にスリツト及び切込みのうちの少なくと
もいずれか一方を設けたことを特徴とするプリン
ト配線基板。 In a printed wiring board on which a connector whose contacts are movable within a predetermined range is mounted, the board base is made of a flexible material, and at least one of a slit and a notch is formed around the soldered portion of the contact. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169223U JPS6185177U (en) | 1984-11-09 | 1984-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984169223U JPS6185177U (en) | 1984-11-09 | 1984-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185177U true JPS6185177U (en) | 1986-06-04 |
Family
ID=30726971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984169223U Pending JPS6185177U (en) | 1984-11-09 | 1984-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185177U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63301584A (en) * | 1987-05-31 | 1988-12-08 | Matsushita Electric Ind Co Ltd | Printed board |
| JPS64363U (en) * | 1987-06-19 | 1989-01-05 | ||
| JP2012204775A (en) * | 2011-03-28 | 2012-10-22 | Mitsubishi Electric Corp | Printed wiring board, circuit board using printed wiring board and circuit board manufacturing method |
-
1984
- 1984-11-09 JP JP1984169223U patent/JPS6185177U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63301584A (en) * | 1987-05-31 | 1988-12-08 | Matsushita Electric Ind Co Ltd | Printed board |
| JPS64363U (en) * | 1987-06-19 | 1989-01-05 | ||
| JP2012204775A (en) * | 2011-03-28 | 2012-10-22 | Mitsubishi Electric Corp | Printed wiring board, circuit board using printed wiring board and circuit board manufacturing method |