JPH0395677U - - Google Patents
Info
- Publication number
- JPH0395677U JPH0395677U JP262690U JP262690U JPH0395677U JP H0395677 U JPH0395677 U JP H0395677U JP 262690 U JP262690 U JP 262690U JP 262690 U JP262690 U JP 262690U JP H0395677 U JPH0395677 U JP H0395677U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connection structure
- conductive
- conductor
- conductor material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例を示す断面図、第２図
は、従来例の断面図を示す。
１……導体機材、２……メイン回路基板、３…
…サブ回路基板、４……リード線、５……金属片
、６……半田。
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1... Conductor equipment, 2... Main circuit board, 3...
...Sub circuit board, 4...Lead wire, 5...Metal piece, 6...Solder.
Claims (1)
板と、他の導体機材との接続構造において、半田
付け可能な金属を介在させて前記回路基板と前記
導体機材をある角度を持つて接し、前記回路基板
と前記導体機材とを半田付けで接続することを特
徴とする回路基板の接続構造。 (2) 前記導体機材がフレキシブル回路基板であ
ることを特徴とする請求項１記載の回路基板の接
続構造。 (3) 前記導体機材が導通端子であることを特徴
とする請求項１記載の回路基板の接続構造。[Claims for Utility Model Registration] (1) In a connection structure between a circuit board having a conductive copper thin pattern on one main surface and another conductor material, the circuit board and the conductor are connected by interposing a solderable metal. 1. A circuit board connection structure, characterized in that the circuit board and the conductor material are connected by soldering, with the circuit board and the conductor material being brought into contact with each other at a certain angle. (2) The circuit board connection structure according to claim 1, wherein the conductive material is a flexible circuit board. (3) The circuit board connection structure according to claim 1, wherein the conductive material is a conductive terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262690U JPH0395677U (en) | 1990-01-16 | 1990-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP262690U JPH0395677U (en) | 1990-01-16 | 1990-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395677U true JPH0395677U (en) | 1991-09-30 |
Family
ID=31506490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP262690U Pending JPH0395677U (en) | 1990-01-16 | 1990-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395677U (en) |
-
1990
- 1990-01-16 JP JP262690U patent/JPH0395677U/ja active Pending
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