JPH0292967U - - Google Patents
Info
- Publication number
- JPH0292967U JPH0292967U JP111989U JP111989U JPH0292967U JP H0292967 U JPH0292967 U JP H0292967U JP 111989 U JP111989 U JP 111989U JP 111989 U JP111989 U JP 111989U JP H0292967 U JPH0292967 U JP H0292967U
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- soldering land
- flexible printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第３図は本考案のフレキシブルプリ
ント基板とこのフレキシブルプリント基板がはん
だ付けされるプリント基板を示す側面断面図であ
る。第２図は第１図に示す実施例の正面図である
。第４図は本考案の別の実施例を示す側面断面図
である。
２……フレキシブルプリント基板、３……プリ
ント基板、６……スルーホール、９……リード端
子、１１，１４……はんだ付けランド、１２……
クリームはんだ、１３……接続端子。
1 and 3 are side sectional views showing a flexible printed circuit board of the present invention and a printed circuit board to which the flexible printed circuit board is soldered. FIG. 2 is a front view of the embodiment shown in FIG. 1. FIG. 4 is a side sectional view showing another embodiment of the present invention. 2... Flexible printed circuit board, 3... Printed circuit board, 6... Through hole, 9... Lead terminal, 11, 14... Soldering land, 12...
Cream solder, 13... connection terminal.
Claims (1)
にはんだ付けランドを設けたことを特徴とするフ
レキシブルプリント基板。 (2) 前記はんだ付けランドは、基板の表面に形
成された前記導体パターンからスルーホールを介
して基板の裏面に形成された前記導体パターンの
接続部に導通することなく、基板の裏面に設けら
れていることを特徴とする実用新案登録請求の範
囲第１項記載のフレキシブルプリント基板。 (3) 前記はんだ付けランドは、前記基板の表面
に形成された前記導体パターンの接続部を基板の
裏面側に屈曲させたときに、屈曲された基板の端
部が接触しないように基板の裏面に形成されてい
ることを特徴とする実用新案登録請求の範囲第１
項記載のフレキシブルプリント基板。[Scope of Claim for Utility Model Registration] (1) A flexible printed circuit board characterized in that a soldering land is provided in a part electrically insulated from a conductor pattern. (2) The soldering land is provided on the back surface of the board without conduction from the conductive pattern formed on the front surface of the board to the connection part of the conductive pattern formed on the back surface of the board via a through hole. A flexible printed circuit board according to claim 1, characterized in that: (3) The soldering land is placed on the back side of the board so that when the connecting portion of the conductive pattern formed on the front surface of the board is bent toward the back side of the board, the bent end of the board does not come into contact with the soldering land. The first claim for utility model registration is characterized in that it is formed in
Flexible printed circuit board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP111989U JPH0292967U (en) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP111989U JPH0292967U (en) | 1989-01-09 | 1989-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292967U true JPH0292967U (en) | 1990-07-24 |
Family
ID=31200728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP111989U Pending JPH0292967U (en) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292967U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012209436A (en) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | Connection structure of flexible wiring circuit board and method for connecting the same |
| CN106465541A (en) * | 2014-12-01 | 2017-02-22 | 株式会社村田制作所 | Electronic apparatus, electrical element, and electrical element tray |
| JP2018170521A (en) * | 2016-01-20 | 2018-11-01 | 株式会社村田製作所 | Bonding structure of resin multilayer substrate and circuit board |
-
1989
- 1989-01-09 JP JP111989U patent/JPH0292967U/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012209436A (en) * | 2011-03-30 | 2012-10-25 | Fujifilm Corp | Connection structure of flexible wiring circuit board and method for connecting the same |
| CN106465541A (en) * | 2014-12-01 | 2017-02-22 | 株式会社村田制作所 | Electronic apparatus, electrical element, and electrical element tray |
| JP2017092486A (en) * | 2014-12-01 | 2017-05-25 | 株式会社村田製作所 | Electrical element |
| US10270150B2 (en) | 2014-12-01 | 2019-04-23 | Murata Manufacturing Co., Ltd. | Electronic apparatus |
| CN110212276A (en) * | 2014-12-01 | 2019-09-06 | 株式会社村田制作所 | Electronic equipment and electrical component |
| US10424824B2 (en) | 2014-12-01 | 2019-09-24 | Murata Manufacturing Co., Ltd. | Electronic apparatus, electrical element, and electrical element tray |
| CN111447737A (en) * | 2014-12-01 | 2020-07-24 | 株式会社村田制作所 | Electronic device |
| CN110212276B (en) * | 2014-12-01 | 2022-05-10 | 株式会社村田制作所 | Electronic device and electric element |
| JP2018170521A (en) * | 2016-01-20 | 2018-11-01 | 株式会社村田製作所 | Bonding structure of resin multilayer substrate and circuit board |
| US10403989B2 (en) | 2016-01-20 | 2019-09-03 | Murata Manufacturing Co., Ltd. | Resin multilayer substrate and electronic device |
| US10505298B2 (en) | 2016-01-20 | 2019-12-10 | Murata Manufacturing Co., Ltd. | Joint structure of a resin multilayer substrate and a circuit board |