JPS63134573U - - Google Patents
Info
- Publication number
- JPS63134573U JPS63134573U JP2528187U JP2528187U JPS63134573U JP S63134573 U JPS63134573 U JP S63134573U JP 2528187 U JP2528187 U JP 2528187U JP 2528187 U JP2528187 U JP 2528187U JP S63134573 U JPS63134573 U JP S63134573U
- Authority
- JP
- Japan
- Prior art keywords
- round
- hole
- expanded portion
- lead wire
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図及び第２図はこの考案の第一の実施例を
示すもので、第１図は平面図、第２図は縦断側面
図、第３図はこの考案の第二の実施例を示す平面
図、第４図及び第５図は従来例を示すもので、第
４図は平面図、第５図は縦断側面図、第６図は他
の従来例を示す平面図である。
１……絶縁基板、２……導電パターン、３……
絶縁皮膜、４……非半田溶着部、５……拡開部、
６……突出部、７……ラウンド、８……孔、９…
…回路部品、１０……リード線、１１……半田、
１２……拡開部、１３……突出部、１４……ラウ
ンド。
Figures 1 and 2 show the first embodiment of this invention; Figure 1 is a plan view, Figure 2 is a vertical side view, and Figure 3 is a second embodiment of this invention. A plan view, FIG. 4, and FIG. 5 show a conventional example. FIG. 4 is a plan view, FIG. 5 is a vertical side view, and FIG. 6 is a plan view showing another conventional example. 1... Insulating substrate, 2... Conductive pattern, 3...
Insulating film, 4... Non-solder welded part, 5... Expanded part,
6... protrusion, 7... round, 8... hole, 9...
...Circuit parts, 10...Lead wire, 11...Solder,
12... Expansion part, 13... Protrusion part, 14... Round.
Claims (1)
皮膜により覆われた非半田溶着部と絶縁皮膜に覆
われないラウンドとこのラウンドの一部に位置し
て前記絶縁基板を貫通する孔とを形成し、前記孔
に回路部品のリード線を挿入してこのリード線を
前記ラウンドに半田付けしてなるプリント基板に
おいて、前記ラウンドを前記孔の周囲に形成され
た拡開部とこの拡開部から前記導電パターンの長
手方向に突出する幅狭の突出部とを連続させて形
成したことを特徴とするプリント基板。 On a conductive pattern formed on an insulating substrate, a non-solder welded portion covered with an insulating film, a round not covered with the insulating film, and a hole located in a part of this round and penetrating the insulating substrate are formed. , in a printed circuit board in which a lead wire of a circuit component is inserted into the hole and the lead wire is soldered to the round, the round is connected to an expanded portion formed around the hole and from the expanded portion to the expanded portion. A printed circuit board characterized in that a conductive pattern is formed in a continuous manner with a narrow protrusion protruding in the longitudinal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528187U JPS63134573U (en) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528187U JPS63134573U (en) | 1987-02-23 | 1987-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63134573U true JPS63134573U (en) | 1988-09-02 |
Family
ID=30825286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2528187U Pending JPS63134573U (en) | 1987-02-23 | 1987-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63134573U (en) |
-
1987
- 1987-02-23 JP JP2528187U patent/JPS63134573U/ja active Pending