JPH0365276U - - Google Patents
Info
- Publication number
- JPH0365276U JPH0365276U JP12566089U JP12566089U JPH0365276U JP H0365276 U JPH0365276 U JP H0365276U JP 12566089 U JP12566089 U JP 12566089U JP 12566089 U JP12566089 U JP 12566089U JP H0365276 U JPH0365276 U JP H0365276U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor
- conductors
- opposite ends
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例における電子部品搭
載の手順を示す図であつて、ａおよびｂは電子部
品搭載前、ｃおよびｄは電子部品搭載後の状況を
それぞれ示すもので、ａとｃは平面図であり、ｂ
とｄは側面図である。第２図は従来の回路基板に
おける電子部品搭載の手順を示す図であつて、第
１図と同様にａおよびｂは搭載前、ｃおよびｄは
搭載後の状況をそれぞれ示すものでａとｃは平面
図であり、ｂとｄは側面図である。第３図は本考
案の他の実施例を示す図であつて、ａは導体パタ
ーンを示す平面図、ｂは電子部品搭載後の状況を
示す平面図である。
符号の説明、１……絶縁性基板、２……導体、
３……電子部品、４……電子部品の接続用電極、
５……半田ペースト、６……溶融半田、７……半
田ボール。
FIG. 1 is a diagram showing the procedure for mounting electronic components in an embodiment of the present invention, in which a and b show the situations before electronic components are mounted, and c and d show the situations after electronic components are mounted, respectively. c is a plan view, b
and d are side views. FIG. 2 is a diagram showing the procedure for mounting electronic components on a conventional circuit board, and like FIG. 1, a and b show the situation before mounting, and c and d show the situation after mounting, respectively. is a plan view, and b and d are side views. FIG. 3 is a diagram showing another embodiment of the present invention, in which a is a plan view showing a conductor pattern, and b is a plan view showing the situation after electronic components are mounted. Explanation of symbols, 1... Insulating substrate, 2... Conductor,
3...Electronic component, 4...Electrode for connection of electronic component,
5... Solder paste, 6... Molten solder, 7... Solder ball.
Claims (1)
を形成し、該対向する導体に電子部品を半田付け
してなる回路基板であつて、前記導体の対向する
端縁の互いに異なる側部に、相対する導体に向け
て、少なくとも導体間隔の中間点に達するまで、
それぞれ導体領域を突出させて形成したことを特
徴とする浮動半田ボールの生じない回路基板。 A circuit board comprising at least one pair of opposing conductors formed on an insulating substrate, and electronic components soldered to the opposing conductors, the circuit board having opposite ends of opposite ends of the conductors. toward the conductor until at least the midpoint of the conductor spacing is reached.
A circuit board in which floating solder balls do not occur, characterized in that each conductor region is formed to protrude.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12566089U JPH0365276U (en) | 1989-10-30 | 1989-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12566089U JPH0365276U (en) | 1989-10-30 | 1989-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365276U true JPH0365276U (en) | 1991-06-25 |
Family
ID=31673523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12566089U Pending JPH0365276U (en) | 1989-10-30 | 1989-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365276U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7748581B2 (en) | 2007-01-16 | 2010-07-06 | Maruso Industry Co., Ltd. | Three-dimensional collar shape retaining hanger |
| JP4854806B1 (en) * | 2010-12-01 | 2012-01-18 | マルソー産業株式会社 | Clothes hanger |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188397A (en) * | 1986-02-14 | 1987-08-17 | 株式会社日立製作所 | Printed circuit board for chip-type parts |
-
1989
- 1989-10-30 JP JP12566089U patent/JPH0365276U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188397A (en) * | 1986-02-14 | 1987-08-17 | 株式会社日立製作所 | Printed circuit board for chip-type parts |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7748581B2 (en) | 2007-01-16 | 2010-07-06 | Maruso Industry Co., Ltd. | Three-dimensional collar shape retaining hanger |
| JP4854806B1 (en) * | 2010-12-01 | 2012-01-18 | マルソー産業株式会社 | Clothes hanger |